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Electronics & Semiconductor

300 mm CMP Pads

300 mm CMP Pads is a consumable or interface component for the named semiconductor processing or wafer-handling step.

Types
Hard CMP Pad · Soft CMP Pad
Applications
IDM · Foundry

5 editions31 January 2026

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$4,950Single user · USD · Market Analysis & ForecastExplore product: 300 mm CMP PadsCompare research options for 300 mm CMP Pads

Electronics & Semiconductor

300 mm FOUP Door Opener

300 mm FOUP Door Opener is a protective semiconductor-wafer handling or transport container defined by the named carrier format.

Types
Manual · Automatic
Applications
IDM · Foundry

5 editions6 July 2026

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$4,950Single user · USD · Market Analysis & ForecastExplore product: 300 mm FOUP Door OpenerCompare research options for 300 mm FOUP Door Opener

Electronics & Semiconductor

300 mm Front Opening Unified Pods (FOUPs)

300 mm Front Opening Unified Pods (FOUPs) is a protective semiconductor-wafer handling or transport container defined by the named carrier format.

Types
13 Pcs Wafer Carrying Capacity · 25 Pcs Wafer Carrying Capacity · Others
Applications
IDM · Foundry

5 editions23 January 2026

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$4,950Single user · USD · Market Analysis & ForecastExplore product: 300 mm Front Opening Unified Pods (FOUPs)Compare research options for 300 mm Front Opening Unified Pods (FOUPs)

Electronics & Semiconductor

300 mm Semiconductor Wafer Carrier for Thin Wafer

300 mm Semiconductor Wafer Carrier for Thin Wafer is a protective semiconductor-wafer handling or transport container defined by the named carrier format.

Types
FOUP · FOSB
Applications
IDM · Foundry

5 editions6 July 2026

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$4,950Single user · USD · Market Analysis & ForecastExplore product: 300 mm Semiconductor Wafer Carrier for Thin WaferCompare research options for 300 mm Semiconductor Wafer Carrier for Thin Wafer

Electronics & Semiconductor

300 mm Through Glass Via Wafer

300 mm Through Glass Via Wafer is a semiconductor or functional substrate material supplied in the geometry and processing state named in the catalogue.

Types
Chemical Etching Technology · Laser Drilling Technology
Applications
Consumer Electronics · Automobile Electronics · Others

5 editions6 January 2026

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$4,950Single user · USD · Market Analysis & ForecastExplore product: 300 mm Through Glass Via WaferCompare research options for 300 mm Through Glass Via Wafer

Food & Beverages

300 mm Wafer CMP Pad Conditioners

300 mm Wafer CMP Pad Conditioners is a consumable or interface component for the named semiconductor processing or wafer-handling step.

Types
Conventional Pad Conditioners · CVD Diamond Pad Conditioners
Applications
Wafer Foundry · IDM

5 editions6 January 2026

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$4,950Single user · USD · Market Analysis & ForecastExplore product: 300 mm Wafer CMP Pad ConditionersCompare research options for 300 mm Wafer CMP Pad Conditioners

Electronics & Semiconductor

300 mm Wafer CMP Retaining Rings

300 mm Wafer CMP Retaining Rings is a consumable or interface component for the named semiconductor processing or wafer-handling step.

Types
Polyetheretherketone (PEEK) · Polyphenylene Sulfide (PPS) · Polyethylene Terephthalate (PET)
Applications
Wafer Suppliers · Semiconductor Equipment Suppliers

5 editions1 January 2026

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$4,950Single user · USD · Market Analysis & ForecastExplore product: 300 mm Wafer CMP Retaining RingsCompare research options for 300 mm Wafer CMP Retaining Rings

Electronics & Semiconductor

300 mm Wafer Electrostatic Chucks

300 mm Wafer Electrostatic Chucks is a wafer-support or thermal-processing component defined by its holding and process interfaces.

Types
Coulomb Type Electrostatic Chuck · Johnsen-Rahbek (JR) Type Electrostatic Chuck
Applications
Fab · Semiconductor Equipment Factory

5 editions1 January 2026

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$4,950Single user · USD · Market Analysis & ForecastExplore product: 300 mm Wafer Electrostatic ChucksCompare research options for 300 mm Wafer Electrostatic Chucks

Electronics & Semiconductor

300 mm Wafer Front Opening Unified Pod

300 mm Wafer Front Opening Unified Pod is a front-opening semiconductor-wafer handling pod in the wafer-diameter class named in the catalogue.

Types
13 Slot Wafers Front Opening Unified Pod · 25 Slot Wafers Front Opening Unified Pod
Applications
Wafer Foundry · IDM

5 editions10 April 2026

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$4,950Single user · USD · Market Analysis & ForecastExplore product: 300 mm Wafer Front Opening Unified PodCompare research options for 300 mm Wafer Front Opening Unified Pod

Electronics & Semiconductor

300 mm Wafer Probing Machines

300 mm Wafer Probing Machines is semiconductor test or inspection equipment that positions wafers and acquires an identified electrical or optical result.

Types
Semi-automatic · Fully automatic
Applications
IDMs · OSAT

5 editions31 January 2026

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$4,950Single user · USD · Market Analysis & ForecastExplore product: 300 mm Wafer Probing MachinesCompare research options for 300 mm Wafer Probing Machines

Electronics & Semiconductor

300 mm Wafer Ring Frame

300 mm Wafer Ring Frame is a frame used to support a wafer or wafer-mounted film within a defined handling process.

Types
Metal · Plastic
Applications
Wafer Dicing · Wafer Back Grinding · Wafer Sorting

5 editions7 July 2026

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$4,950Single user · USD · Market Analysis & ForecastExplore product: 300 mm Wafer Ring FrameCompare research options for 300 mm Wafer Ring Frame

Electronics & Semiconductor

300 mm Wafer Shippers and Carriers

300 mm Wafer Shippers and Carriers is a protective semiconductor-wafer handling or transport container defined by the named carrier format.

Types
FOUP · FOSB
Applications
Foundry · IDM

5 editions3 May 2026

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$4,950Single user · USD · Market Analysis & ForecastExplore product: 300 mm Wafer Shippers and CarriersCompare research options for 300 mm Wafer Shippers and Carriers
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