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5 editions17 January 2026
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Insulated metal substrate (IMS) consists of a metal baseplate (aluminium is commonly used because of its low cost and density) covered by a thin layer of dielectric (usually an epoxy-based layer) and a layer of copper (35 µm to more than 200 µm thick). The FR-4-based dielectric is usually thin (about 100 μm) because it has poor thermal conductivity compared to the ceramics used in DBC substrates.
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