Selected research
Market Structure
Global Semiconductor Wafer Dry Etching Equipment Market by Size, by Type, by Application, by Region, History and Forecast 2021-2032
Market perspective
The global Semiconductor Wafer Dry Etching Equipment market is projected to grow from US$ million in 2026 to US$ million by 2032, implying a CAGR of % over 2026-2032.
The US & Canada market for Semiconductor Wafer Dry Etching Equipment is projected to increase from US$ million in 2026 to US$ million by 2032, at a CAGR of % over 2026-2032.
The Europe market for Semiconductor Wafer Dry Etching Equipment is projected to increase from US$ million in 2026 to US$ million by 2032, at a CAGR of % over 2026-2032.
Read the full market overview
The Asia Pacific market for Semiconductor Wafer Dry Etching Equipment is projected to increase from US$ million in 2026 to US$ million by 2032, at a CAGR of % over 2026-2032.
The China market for Semiconductor Wafer Dry Etching Equipment is projected to increase from US$ million in 2026 to US$ million by 2032, at a CAGR of % over 2026-2032.
Leading global manufacturers of Semiconductor Wafer Dry Etching Equipment include Lam Research, Tokyo Electron Limited, Applied Materials, Hitachi High-Tech, SEMES, AMEC, NAURA, SPTS Technologies (KLA) and Oxford Instruments, among others. In 2025, the top three vendors together accounted for approximately % of global revenue.
On the production side, the report examines Semiconductor Wafer Dry Etching Equipment output, growth rates, and market shares by manufacturer and by region (at regional and country level) for 2021-2026, with forecasts through 2032.
On the consumption side, the report analyzes sales of Semiconductor Wafer Dry Etching Equipment by region (regional and country level), company, type, and application for 2021-2026 and provides forecasts through 2032.
The report provides an overview of the global Semiconductor Wafer Dry Etching Equipment market in terms of capacity, output, revenue, and price, analyzing global market trends using historical revenue and sales data for 2021-2025, estimates for 2026, and projected CAGRs through 2032.
The study covers key producers of Semiconductor Wafer Dry Etching Equipment and consumption patterns in major regions and countries, assesses future market potential, and highlights priority regions and countries for segmenting the market into sub-sectors, with country-specific market value data for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, the Middle East, Africa, and other countries.
The report also presents Semiconductor Wafer Dry Etching Equipment sales, revenue, market share, and industry ranking for the main manufacturers for 2021-2026, identifies the major stakeholders in the global market, and analyzes their competitive landscape and market positioning based on recent developments and segmental revenues.
In addition, the report analyzes segment data by type and application—covering sales, revenue, and price—for 2021-2032, and evaluates and forecasts the Semiconductor Wafer Dry Etching Equipment market size, projected growth trends, production technologies, key applications, and end-use industries.
Semiconductor Wafer Dry Etching Equipment Segment by Company
Lam Research
Tokyo Electron Limited
Applied Materials
Hitachi High-Tech
SEMES
AMEC
NAURA
SPTS Technologies (KLA)
Oxford Instruments
ULVAC
Plasma-Therm
Semiconductor Wafer Dry Etching Equipment Segment by Type
Inductively Coupled Plasma (ICP)
Capacitive Coupled Plasma (CCP)
Reactive Ion Etching (RIE)
Deep Reactive Ion Etching (DRIE)
Others
Semiconductor Wafer Dry Etching Equipment Segment by Application
300 mm Wafer
200 mm Wafer
Others
Semiconductor Wafer Dry Etching Equipment Segment by Region
North America
United States
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Spain
Netherlands
Switzerland
Sweden
Poland
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Southeast Asia
South America
Brazil
Argentina
Chile
Middle East & Africa
Egypt
South Africa
Israel
Türkiye
GCC Countries
Study Objectives
1. To analyze and research the global status and future forecast, involving, production, value, consumption, growth rate (CAGR), market share, historical and forecast.
2. To present the key manufacturers, capacity, production, revenue, market share, and Recent Developments.
3. To split the breakdown data by regions, type, manufacturers, and Application.
4. To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints, and risks.
5. To identify significant trends, drivers, influence factors in global and regions.
6. To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
Reasons to Buy This Report
1. This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global Semiconductor Wafer Dry Etching Equipment market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.
2. This report will help stakeholders to understand the global industry status and trends of Semiconductor Wafer Dry Etching Equipment and provides them with information on key market drivers, restraints, challenges, and opportunities.
3. This report will help stakeholders to understand competitors better and gain more insights to strengthen their position in their businesses. The competitive landscape section includes the market share and rank (in volume and value), competitor ecosystem, new product development, expansion, and acquisition.
4. This report stays updated with novel technology integration, features, and the latest developments in the market.
5. This report helps stakeholders to gain insights into which regions to target globally.
6. This report helps stakeholders to gain insights into the end-user perception concerning the adoption of Semiconductor Wafer Dry Etching Equipment.
7. This report helps stakeholders to identify some of the key players in the market and understand their valuable contribution.
Chapter Outline
Chapter 1: Provides an overview of the Semiconductor Wafer Dry Etching Equipment market, including product definition, global market growth prospects, production value, capacity, and average price forecasts (2021-2032).
Chapter 2: Analysis key trends, drivers, challenges, and opportunities within the global Semiconductor Wafer Dry Etching Equipment industry.
Chapter 3: Detailed analysis of Semiconductor Wafer Dry Etching Equipment market competition landscape. Including Semiconductor Wafer Dry Etching Equipment manufacturers' output value, output and average price from 2021 to 2026, as well as competition analysis indicators such as origin, product type, application, merger and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 7: Production/Production Value of Semiconductor Wafer Dry Etching Equipment by region. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 8: Consumption of Semiconductor Wafer Dry Etching Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 9: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 10: Concluding Insights of the report.
More report detail
Tables and figures
Scope & coverage.
Types
- Inductively Coupled Plasma (ICP)
- Capacitive Coupled Plasma (CCP)
- Reactive Ion Etching (RIE)
- Deep Reactive Ion Etching (DRIE)
- Others
Applications
- 300 mm Wafer
- 200 mm Wafer
- Others
Companies covered
- Lam Research
- Tokyo Electron Limited
- Applied Materials
- Hitachi High-Tech
- SEMES
- AMEC
- NAURA
- SPTS Technologies (KLA)
- Oxford Instruments
- ULVAC
- Plasma-Therm
Inside the report.
1 Market Overview
- 1.1 Product Definition
- 1.2 Global Market Growth Prospects
- 1.2.1 Global Semiconductor Wafer Dry Etching Equipment Production Value Estimates and Forecasts (2021-2032)
- 1.2.2 Global Semiconductor Wafer Dry Etching Equipment Production Capacity Estimates and Forecasts (2021-2032)
- 1.2.3 Global Semiconductor Wafer Dry Etching Equipment Production Estimates and Forecasts (2021-2032)
- 1.2.4 Global Semiconductor Wafer Dry Etching Equipment Market Average Price (2021-2032)
- 1.3 Assumptions and Limitations
- 1.4 Study Goals and Objectives
2 Global Semiconductor Wafer Dry Etching Equipment Market Dynamics
- 2.1 Semiconductor Wafer Dry Etching Equipment Industry Trends
- 2.2 Semiconductor Wafer Dry Etching Equipment Industry Drivers
- 2.3 Semiconductor Wafer Dry Etching Equipment Industry Opportunities and Challenges
- 2.4 Semiconductor Wafer Dry Etching Equipment Industry Restraints
3 Semiconductor Wafer Dry Etching Equipment Market by Manufacturers
- 3.1 Global Semiconductor Wafer Dry Etching Equipment Production Value by Manufacturers (2021-2026)
- 3.2 Global Semiconductor Wafer Dry Etching Equipment Production by Manufacturers (2021-2026)
- 3.3 Global Semiconductor Wafer Dry Etching Equipment Average Price by Manufacturers (2021-2026)
- 3.4 Global Semiconductor Wafer Dry Etching Equipment Industry Manufacturers Ranking, 2024 VS 2025 VS 2026
- 3.5 Global Semiconductor Wafer Dry Etching Equipment Key Manufacturers Manufacturing Sites & Headquarters
- 3.6 Global Semiconductor Wafer Dry Etching Equipment Manufacturers, Product Type & Application
- 3.7 Global Semiconductor Wafer Dry Etching Equipment Manufacturers Established Date
- 3.8 Market Competitive Analysis
- 3.8.1 Global Semiconductor Wafer Dry Etching Equipment Market CR5 and HHI
- 3.8.2 Global Top 5 and 10 Semiconductor Wafer Dry Etching Equipment Players Market Share by Production Value in 2025
- 3.8.3 2025 Semiconductor Wafer Dry Etching Equipment Tier 1, Tier 2, and Tier 3
4 Semiconductor Wafer Dry Etching Equipment Market by Type
- 4.1 Semiconductor Wafer Dry Etching Equipment Type Introduction
- 4.1.1 Inductively Coupled Plasma (ICP)
- 4.1.2 Capacitive Coupled Plasma (CCP)
- 4.1.3 Reactive Ion Etching (RIE)
- 4.1.4 Deep Reactive Ion Etching (DRIE)
- 4.1.5 Others
- 4.2 Global Semiconductor Wafer Dry Etching Equipment Production by Type
- 4.2.1 Global Semiconductor Wafer Dry Etching Equipment Production by Type (2021 VS 2025 VS 2032)
- 4.2.2 Global Semiconductor Wafer Dry Etching Equipment Production by Type (2021-2032)
- 4.2.3 Global Semiconductor Wafer Dry Etching Equipment Production Market Share by Type (2021-2032)
- 4.3 Global Semiconductor Wafer Dry Etching Equipment Production Value by Type
- 4.3.1 Global Semiconductor Wafer Dry Etching Equipment Production Value by Type (2021 VS 2025 VS 2032)
- 4.3.2 Global Semiconductor Wafer Dry Etching Equipment Production Value by Type (2021-2032)
- 4.3.3 Global Semiconductor Wafer Dry Etching Equipment Production Value Market Share by Type (2021-2032)
5 Semiconductor Wafer Dry Etching Equipment Market by Application
- 5.1 Semiconductor Wafer Dry Etching Equipment Application Introduction
- 5.1.1 300 mm Wafer
- 5.1.2 200 mm Wafer
- 5.1.3 Others
- 5.2 Global Semiconductor Wafer Dry Etching Equipment Production by Application
- 5.2.1 Global Semiconductor Wafer Dry Etching Equipment Production by Application (2021 VS 2025 VS 2032)
- 5.2.2 Global Semiconductor Wafer Dry Etching Equipment Production by Application (2021-2032)
- 5.2.3 Global Semiconductor Wafer Dry Etching Equipment Production Market Share by Application (2021-2032)
- 5.3 Global Semiconductor Wafer Dry Etching Equipment Production Value by Application
- 5.3.1 Global Semiconductor Wafer Dry Etching Equipment Production Value by Application (2021 VS 2025 VS 2032)
- 5.3.2 Global Semiconductor Wafer Dry Etching Equipment Production Value by Application (2021-2032)
- 5.3.3 Global Semiconductor Wafer Dry Etching Equipment Production Value Market Share by Application (2021-2032)
6 Company Profiles
- 6.1 Lam Research
- 6.1.1 Lam Research Company Information
- 6.1.2 Lam Research Business Overview
- 6.1.3 Lam Research Semiconductor Wafer Dry Etching Equipment Production, Value and Gross Margin (2021-2026)
- 6.1.4 Lam Research Semiconductor Wafer Dry Etching Equipment Product Portfolio
- 6.1.5 Lam Research Recent Developments
- 6.2 Tokyo Electron Limited
- 6.2.1 Tokyo Electron Limited Company Information
- 6.2.2 Tokyo Electron Limited Business Overview
- 6.2.3 Tokyo Electron Limited Semiconductor Wafer Dry Etching Equipment Production, Value and Gross Margin (2021-2026)
- 6.2.4 Tokyo Electron Limited Semiconductor Wafer Dry Etching Equipment Product Portfolio
- 6.2.5 Tokyo Electron Limited Recent Developments
- 6.3 Applied Materials
- 6.3.1 Applied Materials Company Information
- 6.3.2 Applied Materials Business Overview
- 6.3.3 Applied Materials Semiconductor Wafer Dry Etching Equipment Production, Value and Gross Margin (2021-2026)
- 6.3.4 Applied Materials Semiconductor Wafer Dry Etching Equipment Product Portfolio
- 6.3.5 Applied Materials Recent Developments
- 6.4 Hitachi High-Tech
- 6.4.1 Hitachi High-Tech Company Information
- 6.4.2 Hitachi High-Tech Business Overview
- 6.4.3 Hitachi High-Tech Semiconductor Wafer Dry Etching Equipment Production, Value and Gross Margin (2021-2026)
- 6.4.4 Hitachi High-Tech Semiconductor Wafer Dry Etching Equipment Product Portfolio
- 6.4.5 Hitachi High-Tech Recent Developments
- 6.5 SEMES
- 6.5.1 SEMES Company Information
- 6.5.2 SEMES Business Overview
- 6.5.3 SEMES Semiconductor Wafer Dry Etching Equipment Production, Value and Gross Margin (2021-2026)
- 6.5.4 SEMES Semiconductor Wafer Dry Etching Equipment Product Portfolio
- 6.5.5 SEMES Recent Developments
- 6.6 AMEC
- 6.6.1 AMEC Company Information
- 6.6.2 AMEC Business Overview
- 6.6.3 AMEC Semiconductor Wafer Dry Etching Equipment Production, Value and Gross Margin (2021-2026)
- 6.6.4 AMEC Semiconductor Wafer Dry Etching Equipment Product Portfolio
- 6.6.5 AMEC Recent Developments
- 6.7 NAURA
- 6.7.1 NAURA Company Information
- 6.7.2 NAURA Business Overview
- 6.7.3 NAURA Semiconductor Wafer Dry Etching Equipment Production, Value and Gross Margin (2021-2026)
- 6.7.4 NAURA Semiconductor Wafer Dry Etching Equipment Product Portfolio
- 6.7.5 NAURA Recent Developments
- 6.8 SPTS Technologies (KLA)
- 6.8.1 SPTS Technologies (KLA) Company Information
- 6.8.2 SPTS Technologies (KLA) Business Overview
- 6.8.3 SPTS Technologies (KLA) Semiconductor Wafer Dry Etching Equipment Production, Value and Gross Margin (2021-2026)
- 6.8.4 SPTS Technologies (KLA) Semiconductor Wafer Dry Etching Equipment Product Portfolio
- 6.8.5 SPTS Technologies (KLA) Recent Developments
- 6.9 Oxford Instruments
- 6.9.1 Oxford Instruments Company Information
- 6.9.2 Oxford Instruments Business Overview
- 6.9.3 Oxford Instruments Semiconductor Wafer Dry Etching Equipment Production, Value and Gross Margin (2021-2026)
- 6.9.4 Oxford Instruments Semiconductor Wafer Dry Etching Equipment Product Portfolio
- 6.9.5 Oxford Instruments Recent Developments
- 6.10 ULVAC
- 6.10.1 ULVAC Company Information
- 6.10.2 ULVAC Business Overview
- 6.10.3 ULVAC Semiconductor Wafer Dry Etching Equipment Production, Value and Gross Margin (2021-2026)
- 6.10.4 ULVAC Semiconductor Wafer Dry Etching Equipment Product Portfolio
- 6.10.5 ULVAC Recent Developments
- 6.11 Plasma-Therm
- 6.11.1 Plasma-Therm Company Information
- 6.11.2 Plasma-Therm Business Overview
- 6.11.3 Plasma-Therm Semiconductor Wafer Dry Etching Equipment Production, Value and Gross Margin (2021-2026)
- 6.11.4 Plasma-Therm Semiconductor Wafer Dry Etching Equipment Product Portfolio
- 6.11.5 Plasma-Therm Recent Developments
7 Global Semiconductor Wafer Dry Etching Equipment Production by Region
- 7.1 Global Semiconductor Wafer Dry Etching Equipment Production by Region: 2021 VS 2025 VS 2032
- 7.2 Global Semiconductor Wafer Dry Etching Equipment Production by Region (2021-2032)
- 7.2.1 Global Semiconductor Wafer Dry Etching Equipment Production by Region (2021-2026)
- 7.2.2 Global Semiconductor Wafer Dry Etching Equipment Production Forecast by Region (2027-2032)
- 7.3 Global Semiconductor Wafer Dry Etching Equipment Production by Region: 2021 VS 2025 VS 2032
- 7.4 Global Semiconductor Wafer Dry Etching Equipment Production Value by Region (2021-2032)
- 7.4.1 Global Semiconductor Wafer Dry Etching Equipment Production Value by Region (2021-2026)
- 7.4.2 Global Semiconductor Wafer Dry Etching Equipment Production Value by Region (2027-2032)
- 7.5 Global Semiconductor Wafer Dry Etching Equipment Market Price Analysis by Region (2021-2032)
- 7.6 Regional Production Value Trends (2021-2032)
- 7.6.1 North America Semiconductor Wafer Dry Etching Equipment Production Value (2021-2032)
- 7.6.2 Europe Semiconductor Wafer Dry Etching Equipment Production Value (2021-2032)
- 7.6.3 Asia-Pacific Semiconductor Wafer Dry Etching Equipment Production Value (2021-2032)
- 7.6.4 South America Semiconductor Wafer Dry Etching Equipment Production Value (2021-2032)
- 7.6.5 Middle East & Africa Semiconductor Wafer Dry Etching Equipment Production Value (2021-2032)
8 Global Semiconductor Wafer Dry Etching Equipment Consumption by Region
- 8.1 Global Semiconductor Wafer Dry Etching Equipment Consumption by Region: 2021 VS 2025 VS 2032
- 8.2 Global Semiconductor Wafer Dry Etching Equipment Consumption by Region (2021-2032)
- 8.2.1 Global Semiconductor Wafer Dry Etching Equipment Consumption by Region (2021-2026)
- 8.2.2 Global Semiconductor Wafer Dry Etching Equipment Consumption by Region (2027-2032)
- 8.3 North America
- 8.3.1 North America Semiconductor Wafer Dry Etching Equipment Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 8.3.2 North America Semiconductor Wafer Dry Etching Equipment Consumption by Country (2021-2032)
- 8.3.3 U.S.
- 8.3.4 Canada
- 8.3.5 Mexico
- 8.4 Europe
- 8.4.1 Europe Semiconductor Wafer Dry Etching Equipment Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 8.4.2 Europe Semiconductor Wafer Dry Etching Equipment Consumption by Country (2021-2032)
- 8.4.3 Germany
- 8.4.4 France
- 8.4.5 U.K.
- 8.4.6 Italy
- 8.4.7 Netherlands
- 8.5 Asia Pacific
- 8.5.1 Asia Pacific Semiconductor Wafer Dry Etching Equipment Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 8.5.2 Asia Pacific Semiconductor Wafer Dry Etching Equipment Consumption by Country (2021-2032)
- 8.5.3 China
- 8.5.4 Japan
- 8.5.5 South Korea
- 8.5.6 Southeast Asia
- 8.5.7 India
- 8.5.8 Australia
- 8.6 South America
- 8.6.1 South America Semiconductor Wafer Dry Etching Equipment Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 8.6.2 South America Semiconductor Wafer Dry Etching Equipment Consumption by Country (2021-2032)
- 8.6.3 Brazil
- 8.6.4 Argentina
- 8.6.5 Chile
- 8.6.6 Colombia
- 8.7 Middle East & Africa
- 8.7.1 Middle East & Africa Semiconductor Wafer Dry Etching Equipment Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 8.7.2 Middle East & Africa Semiconductor Wafer Dry Etching Equipment Consumption by Country (2021-2032)
- 8.7.3 Egypt
- 8.7.4 South Africa
- 8.7.5 Israel
- 8.7.6 Türkiye
- 8.7.7 GCC Countries
9 Value Chain and Sales Channels Analysis
- 9.1 Semiconductor Wafer Dry Etching Equipment Value Chain Analysis
- 9.1.1 Semiconductor Wafer Dry Etching Equipment Key Raw Materials
- 9.1.2 Raw Materials Key Suppliers
- 9.1.3 Manufacturing Cost Structure
- 9.1.4 Semiconductor Wafer Dry Etching Equipment Production Mode & Process
- 9.2 Semiconductor Wafer Dry Etching Equipment Sales Channels Analysis
- 9.2.1 Direct Comparison with Distribution Share
- 9.2.2 Semiconductor Wafer Dry Etching Equipment Distributors
- 9.2.3 Semiconductor Wafer Dry Etching Equipment Customers
10 Concluding Insights
11 Appendix
- 11.1 Reasons for Doing This Study
- 11.2 Research Methodology
- 11.3 Research Process
- 11.4 Authors List of This Report
- 11.5 Data Source
- 11.5.1 Secondary Sources
- 11.5.2 Primary Sources
- 11.6 Disclaimer
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