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Market Structure
Global Radiation Hardened Electronic Devices and Components Market by Size, by Type, by Application, by Region, History and Forecast 2021-2032
Market perspective
The global Radiation Hardened Electronic Devices and Components market is projected to grow from US$ million in 2026 to US$ million by 2032, implying a CAGR of % over 2026-2032.
The US & Canada market for Radiation Hardened Electronic Devices and Components is projected to increase from US$ million in 2026 to US$ million by 2032, at a CAGR of % over 2026-2032.
The Europe market for Radiation Hardened Electronic Devices and Components is projected to increase from US$ million in 2026 to US$ million by 2032, at a CAGR of % over 2026-2032.
Read the full market overview
The Asia Pacific market for Radiation Hardened Electronic Devices and Components is projected to increase from US$ million in 2026 to US$ million by 2032, at a CAGR of % over 2026-2032.
The China market for Radiation Hardened Electronic Devices and Components is projected to increase from US$ million in 2026 to US$ million by 2032, at a CAGR of % over 2026-2032.
Leading global manufacturers of Radiation Hardened Electronic Devices and Components include Maxwell Technologies Inc., Microsemi, Honeywell International Inc., BAE Systems, STMicroelectronics, Microchip Technology Inc., Renesas Electronics Corporation, Infineon Technologies AG and Texas Instruments, among others. In 2025, the top three vendors together accounted for approximately % of global revenue.
On the production side, the report examines Radiation Hardened Electronic Devices and Components output, growth rates, and market shares by manufacturer and by region (at regional and country level) for 2021-2026, with forecasts through 2032.
On the consumption side, the report analyzes sales of Radiation Hardened Electronic Devices and Components by region (regional and country level), company, type, and application for 2021-2026 and provides forecasts through 2032.
The report provides an overview of the global Radiation Hardened Electronic Devices and Components market in terms of capacity, output, revenue, and price, analyzing global market trends using historical revenue and sales data for 2021-2025, estimates for 2026, and projected CAGRs through 2032.
The study covers key producers of Radiation Hardened Electronic Devices and Components and consumption patterns in major regions and countries, assesses future market potential, and highlights priority regions and countries for segmenting the market into sub-sectors, with country-specific market value data for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, the Middle East, Africa, and other countries.
The report also presents Radiation Hardened Electronic Devices and Components sales, revenue, market share, and industry ranking for the main manufacturers for 2021-2026, identifies the major stakeholders in the global market, and analyzes their competitive landscape and market positioning based on recent developments and segmental revenues.
In addition, the report analyzes segment data by type and application—covering sales, revenue, and price—for 2021-2032, and evaluates and forecasts the Radiation Hardened Electronic Devices and Components market size, projected growth trends, production technologies, key applications, and end-use industries.
Radiation Hardened Electronic Devices and Components Segment by Company
Maxwell Technologies Inc.
Microsemi
Honeywell International Inc.
BAE Systems
STMicroelectronics
Microchip Technology Inc.
Renesas Electronics Corporation
Infineon Technologies AG
Texas Instruments
Xilinx
Analog Devices, Inc.
Cobham Limited
Data Device Corporation(DDC)
Solid State Devices, Inc.
Micropac Industries, Inc.
Anaren
Radiation Hardened Electronic Devices and Components Segment by Type
Silicon
Silicon Carbide
Gallium Nitride
Hydrogenated Amorphous Silicon
Radiation Hardened Electronic Devices and Components Segment by Application
Aerospace
Military
Nuclear
Medical
Consumer Electronics
Others
Radiation Hardened Electronic Devices and Components Segment by Region
North America
United States
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Spain
Netherlands
Switzerland
Sweden
Poland
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Southeast Asia
South America
Brazil
Argentina
Chile
Middle East & Africa
Egypt
South Africa
Israel
Türkiye
GCC Countries
Study Objectives
1. To analyze and research the global status and future forecast, involving, production, value, consumption, growth rate (CAGR), market share, historical and forecast.
2. To present the key manufacturers, capacity, production, revenue, market share, and Recent Developments.
3. To split the breakdown data by regions, type, manufacturers, and Application.
4. To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints, and risks.
5. To identify significant trends, drivers, influence factors in global and regions.
6. To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
Reasons to Buy This Report
1. This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global Radiation Hardened Electronic Devices and Components market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.
2. This report will help stakeholders to understand the global industry status and trends of Radiation Hardened Electronic Devices and Components and provides them with information on key market drivers, restraints, challenges, and opportunities.
3. This report will help stakeholders to understand competitors better and gain more insights to strengthen their position in their businesses. The competitive landscape section includes the market share and rank (in volume and value), competitor ecosystem, new product development, expansion, and acquisition.
4. This report stays updated with novel technology integration, features, and the latest developments in the market.
5. This report helps stakeholders to gain insights into which regions to target globally.
6. This report helps stakeholders to gain insights into the end-user perception concerning the adoption of Radiation Hardened Electronic Devices and Components.
7. This report helps stakeholders to identify some of the key players in the market and understand their valuable contribution.
Chapter Outline
Chapter 1: Provides an overview of the Radiation Hardened Electronic Devices and Components market, including product definition, global market growth prospects, production value, capacity, and average price forecasts (2021-2032).
Chapter 2: Analysis key trends, drivers, challenges, and opportunities within the global Radiation Hardened Electronic Devices and Components industry.
Chapter 3: Detailed analysis of Radiation Hardened Electronic Devices and Components market competition landscape. Including Radiation Hardened Electronic Devices and Components manufacturers' output value, output and average price from 2021 to 2026, as well as competition analysis indicators such as origin, product type, application, merger and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 7: Production/Production Value of Radiation Hardened Electronic Devices and Components by region. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 8: Consumption of Radiation Hardened Electronic Devices and Components in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 9: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 10: Concluding Insights of the report.
More report detail
Tables and figures
Scope & coverage.
Types
- Silicon
- Silicon Carbide
- Gallium Nitride
- Hydrogenated Amorphous Silicon
Applications
- Aerospace
- Military
- Nuclear
- Medical
- Consumer Electronics
- Others
Companies covered
- Maxwell Technologies Inc.
- Microsemi
- Honeywell International Inc.
- BAE Systems
- STMicroelectronics
- Microchip Technology Inc.
- Renesas Electronics Corporation
- Infineon Technologies AG
- Texas Instruments
- Xilinx
- Analog Devices, Inc.
- Cobham Limited
- Data Device Corporation(DDC)
- Solid State Devices, Inc.
- Micropac Industries, Inc.
- Anaren
Inside the report.
1 Market Overview
- 1.1 Product Definition
- 1.2 Global Market Growth Prospects
- 1.2.1 Global Radiation Hardened Electronic Devices and Components Production Value Estimates and Forecasts (2021-2032)
- 1.2.2 Global Radiation Hardened Electronic Devices and Components Production Capacity Estimates and Forecasts (2021-2032)
- 1.2.3 Global Radiation Hardened Electronic Devices and Components Production Estimates and Forecasts (2021-2032)
- 1.2.4 Global Radiation Hardened Electronic Devices and Components Market Average Price (2021-2032)
- 1.3 Assumptions and Limitations
- 1.4 Study Goals and Objectives
2 Global Radiation Hardened Electronic Devices and Components Market Dynamics
- 2.1 Radiation Hardened Electronic Devices and Components Industry Trends
- 2.2 Radiation Hardened Electronic Devices and Components Industry Drivers
- 2.3 Radiation Hardened Electronic Devices and Components Industry Opportunities and Challenges
- 2.4 Radiation Hardened Electronic Devices and Components Industry Restraints
3 Radiation Hardened Electronic Devices and Components Market by Manufacturers
- 3.1 Global Radiation Hardened Electronic Devices and Components Production Value by Manufacturers (2021-2026)
- 3.2 Global Radiation Hardened Electronic Devices and Components Production by Manufacturers (2021-2026)
- 3.3 Global Radiation Hardened Electronic Devices and Components Average Price by Manufacturers (2021-2026)
- 3.4 Global Radiation Hardened Electronic Devices and Components Industry Manufacturers Ranking, 2024 VS 2025 VS 2026
- 3.5 Global Radiation Hardened Electronic Devices and Components Key Manufacturers Manufacturing Sites & Headquarters
- 3.6 Global Radiation Hardened Electronic Devices and Components Manufacturers, Product Type & Application
- 3.7 Global Radiation Hardened Electronic Devices and Components Manufacturers Established Date
- 3.8 Market Competitive Analysis
- 3.8.1 Global Radiation Hardened Electronic Devices and Components Market CR5 and HHI
- 3.8.2 Global Top 5 and 10 Radiation Hardened Electronic Devices and Components Players Market Share by Production Value in 2025
- 3.8.3 2025 Radiation Hardened Electronic Devices and Components Tier 1, Tier 2, and Tier 3
4 Radiation Hardened Electronic Devices and Components Market by Type
- 4.1 Radiation Hardened Electronic Devices and Components Type Introduction
- 4.1.1 Silicon
- 4.1.2 Silicon Carbide
- 4.1.3 Gallium Nitride
- 4.1.4 Hydrogenated Amorphous Silicon
- 4.2 Global Radiation Hardened Electronic Devices and Components Production by Type
- 4.2.1 Global Radiation Hardened Electronic Devices and Components Production by Type (2021 VS 2025 VS 2032)
- 4.2.2 Global Radiation Hardened Electronic Devices and Components Production by Type (2021-2032)
- 4.2.3 Global Radiation Hardened Electronic Devices and Components Production Market Share by Type (2021-2032)
- 4.3 Global Radiation Hardened Electronic Devices and Components Production Value by Type
- 4.3.1 Global Radiation Hardened Electronic Devices and Components Production Value by Type (2021 VS 2025 VS 2032)
- 4.3.2 Global Radiation Hardened Electronic Devices and Components Production Value by Type (2021-2032)
- 4.3.3 Global Radiation Hardened Electronic Devices and Components Production Value Market Share by Type (2021-2032)
5 Radiation Hardened Electronic Devices and Components Market by Application
- 5.1 Radiation Hardened Electronic Devices and Components Application Introduction
- 5.1.1 Aerospace
- 5.1.2 Military
- 5.1.3 Nuclear
- 5.1.4 Medical
- 5.1.5 Consumer Electronics
- 5.1.6 Others
- 5.2 Global Radiation Hardened Electronic Devices and Components Production by Application
- 5.2.1 Global Radiation Hardened Electronic Devices and Components Production by Application (2021 VS 2025 VS 2032)
- 5.2.2 Global Radiation Hardened Electronic Devices and Components Production by Application (2021-2032)
- 5.2.3 Global Radiation Hardened Electronic Devices and Components Production Market Share by Application (2021-2032)
- 5.3 Global Radiation Hardened Electronic Devices and Components Production Value by Application
- 5.3.1 Global Radiation Hardened Electronic Devices and Components Production Value by Application (2021 VS 2025 VS 2032)
- 5.3.2 Global Radiation Hardened Electronic Devices and Components Production Value by Application (2021-2032)
- 5.3.3 Global Radiation Hardened Electronic Devices and Components Production Value Market Share by Application (2021-2032)
6 Company Profiles
- 6.1 Maxwell Technologies Inc.
- 6.1.1 Maxwell Technologies Inc. Company Information
- 6.1.2 Maxwell Technologies Inc. Business Overview
- 6.1.3 Maxwell Technologies Inc. Radiation Hardened Electronic Devices and Components Production, Value and Gross Margin (2021-2026)
- 6.1.4 Maxwell Technologies Inc. Radiation Hardened Electronic Devices and Components Product Portfolio
- 6.1.5 Maxwell Technologies Inc. Recent Developments
- 6.2 Microsemi
- 6.2.1 Microsemi Company Information
- 6.2.2 Microsemi Business Overview
- 6.2.3 Microsemi Radiation Hardened Electronic Devices and Components Production, Value and Gross Margin (2021-2026)
- 6.2.4 Microsemi Radiation Hardened Electronic Devices and Components Product Portfolio
- 6.2.5 Microsemi Recent Developments
- 6.3 Honeywell International Inc.
- 6.3.1 Honeywell International Inc. Company Information
- 6.3.2 Honeywell International Inc. Business Overview
- 6.3.3 Honeywell International Inc. Radiation Hardened Electronic Devices and Components Production, Value and Gross Margin (2021-2026)
- 6.3.4 Honeywell International Inc. Radiation Hardened Electronic Devices and Components Product Portfolio
- 6.3.5 Honeywell International Inc. Recent Developments
- 6.4 BAE Systems
- 6.4.1 BAE Systems Company Information
- 6.4.2 BAE Systems Business Overview
- 6.4.3 BAE Systems Radiation Hardened Electronic Devices and Components Production, Value and Gross Margin (2021-2026)
- 6.4.4 BAE Systems Radiation Hardened Electronic Devices and Components Product Portfolio
- 6.4.5 BAE Systems Recent Developments
- 6.5 STMicroelectronics
- 6.5.1 STMicroelectronics Company Information
- 6.5.2 STMicroelectronics Business Overview
- 6.5.3 STMicroelectronics Radiation Hardened Electronic Devices and Components Production, Value and Gross Margin (2021-2026)
- 6.5.4 STMicroelectronics Radiation Hardened Electronic Devices and Components Product Portfolio
- 6.5.5 STMicroelectronics Recent Developments
- 6.6 Microchip Technology Inc.
- 6.6.1 Microchip Technology Inc. Company Information
- 6.6.2 Microchip Technology Inc. Business Overview
- 6.6.3 Microchip Technology Inc. Radiation Hardened Electronic Devices and Components Production, Value and Gross Margin (2021-2026)
- 6.6.4 Microchip Technology Inc. Radiation Hardened Electronic Devices and Components Product Portfolio
- 6.6.5 Microchip Technology Inc. Recent Developments
- 6.7 Renesas Electronics Corporation
- 6.7.1 Renesas Electronics Corporation Company Information
- 6.7.2 Renesas Electronics Corporation Business Overview
- 6.7.3 Renesas Electronics Corporation Radiation Hardened Electronic Devices and Components Production, Value and Gross Margin (2021-2026)
- 6.7.4 Renesas Electronics Corporation Radiation Hardened Electronic Devices and Components Product Portfolio
- 6.7.5 Renesas Electronics Corporation Recent Developments
- 6.8 Infineon Technologies AG
- 6.8.1 Infineon Technologies AG Company Information
- 6.8.2 Infineon Technologies AG Business Overview
- 6.8.3 Infineon Technologies AG Radiation Hardened Electronic Devices and Components Production, Value and Gross Margin (2021-2026)
- 6.8.4 Infineon Technologies AG Radiation Hardened Electronic Devices and Components Product Portfolio
- 6.8.5 Infineon Technologies AG Recent Developments
- 6.9 Texas Instruments
- 6.9.1 Texas Instruments Company Information
- 6.9.2 Texas Instruments Business Overview
- 6.9.3 Texas Instruments Radiation Hardened Electronic Devices and Components Production, Value and Gross Margin (2021-2026)
- 6.9.4 Texas Instruments Radiation Hardened Electronic Devices and Components Product Portfolio
- 6.9.5 Texas Instruments Recent Developments
- 6.10 Xilinx
- 6.10.1 Xilinx Company Information
- 6.10.2 Xilinx Business Overview
- 6.10.3 Xilinx Radiation Hardened Electronic Devices and Components Production, Value and Gross Margin (2021-2026)
- 6.10.4 Xilinx Radiation Hardened Electronic Devices and Components Product Portfolio
- 6.10.5 Xilinx Recent Developments
- 6.11 Analog Devices, Inc.
- 6.11.1 Analog Devices, Inc. Company Information
- 6.11.2 Analog Devices, Inc. Business Overview
- 6.11.3 Analog Devices, Inc. Radiation Hardened Electronic Devices and Components Production, Value and Gross Margin (2021-2026)
- 6.11.4 Analog Devices, Inc. Radiation Hardened Electronic Devices and Components Product Portfolio
- 6.11.5 Analog Devices, Inc. Recent Developments
- 6.12 Cobham Limited
- 6.12.1 Cobham Limited Company Information
- 6.12.2 Cobham Limited Business Overview
- 6.12.3 Cobham Limited Radiation Hardened Electronic Devices and Components Production, Value and Gross Margin (2021-2026)
- 6.12.4 Cobham Limited Radiation Hardened Electronic Devices and Components Product Portfolio
- 6.12.5 Cobham Limited Recent Developments
- 6.13 Data Device Corporation(DDC)
- 6.13.1 Data Device Corporation(DDC) Company Information
- 6.13.2 Data Device Corporation(DDC) Business Overview
- 6.13.3 Data Device Corporation(DDC) Radiation Hardened Electronic Devices and Components Production, Value and Gross Margin (2021-2026)
- 6.13.4 Data Device Corporation(DDC) Radiation Hardened Electronic Devices and Components Product Portfolio
- 6.13.5 Data Device Corporation(DDC) Recent Developments
- 6.14 Solid State Devices, Inc.
- 6.14.1 Solid State Devices, Inc. Company Information
- 6.14.2 Solid State Devices, Inc. Business Overview
- 6.14.3 Solid State Devices, Inc. Radiation Hardened Electronic Devices and Components Production, Value and Gross Margin (2021-2026)
- 6.14.4 Solid State Devices, Inc. Radiation Hardened Electronic Devices and Components Product Portfolio
- 6.14.5 Solid State Devices, Inc. Recent Developments
- 6.15 Micropac Industries, Inc.
- 6.15.1 Micropac Industries, Inc. Company Information
- 6.15.2 Micropac Industries, Inc. Business Overview
- 6.15.3 Micropac Industries, Inc. Radiation Hardened Electronic Devices and Components Production, Value and Gross Margin (2021-2026)
- 6.15.4 Micropac Industries, Inc. Radiation Hardened Electronic Devices and Components Product Portfolio
- 6.15.5 Micropac Industries, Inc. Recent Developments
- 6.16 Anaren
- 6.16.1 Anaren Company Information
- 6.16.2 Anaren Business Overview
- 6.16.3 Anaren Radiation Hardened Electronic Devices and Components Production, Value and Gross Margin (2021-2026)
- 6.16.4 Anaren Radiation Hardened Electronic Devices and Components Product Portfolio
- 6.16.5 Anaren Recent Developments
7 Global Radiation Hardened Electronic Devices and Components Production by Region
- 7.1 Global Radiation Hardened Electronic Devices and Components Production by Region: 2021 VS 2025 VS 2032
- 7.2 Global Radiation Hardened Electronic Devices and Components Production by Region (2021-2032)
- 7.2.1 Global Radiation Hardened Electronic Devices and Components Production by Region (2021-2026)
- 7.2.2 Global Radiation Hardened Electronic Devices and Components Production Forecast by Region (2027-2032)
- 7.3 Global Radiation Hardened Electronic Devices and Components Production by Region: 2021 VS 2025 VS 2032
- 7.4 Global Radiation Hardened Electronic Devices and Components Production Value by Region (2021-2032)
- 7.4.1 Global Radiation Hardened Electronic Devices and Components Production Value by Region (2021-2026)
- 7.4.2 Global Radiation Hardened Electronic Devices and Components Production Value by Region (2027-2032)
- 7.5 Global Radiation Hardened Electronic Devices and Components Market Price Analysis by Region (2021-2032)
- 7.6 Regional Production Value Trends (2021-2032)
- 7.6.1 North America Radiation Hardened Electronic Devices and Components Production Value (2021-2032)
- 7.6.2 Europe Radiation Hardened Electronic Devices and Components Production Value (2021-2032)
- 7.6.3 Asia-Pacific Radiation Hardened Electronic Devices and Components Production Value (2021-2032)
- 7.6.4 South America Radiation Hardened Electronic Devices and Components Production Value (2021-2032)
- 7.6.5 Middle East & Africa Radiation Hardened Electronic Devices and Components Production Value (2021-2032)
8 Global Radiation Hardened Electronic Devices and Components Consumption by Region
- 8.1 Global Radiation Hardened Electronic Devices and Components Consumption by Region: 2021 VS 2025 VS 2032
- 8.2 Global Radiation Hardened Electronic Devices and Components Consumption by Region (2021-2032)
- 8.2.1 Global Radiation Hardened Electronic Devices and Components Consumption by Region (2021-2026)
- 8.2.2 Global Radiation Hardened Electronic Devices and Components Consumption by Region (2027-2032)
- 8.3 North America
- 8.3.1 North America Radiation Hardened Electronic Devices and Components Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 8.3.2 North America Radiation Hardened Electronic Devices and Components Consumption by Country (2021-2032)
- 8.3.3 U.S.
- 8.3.4 Canada
- 8.3.5 Mexico
- 8.4 Europe
- 8.4.1 Europe Radiation Hardened Electronic Devices and Components Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 8.4.2 Europe Radiation Hardened Electronic Devices and Components Consumption by Country (2021-2032)
- 8.4.3 Germany
- 8.4.4 France
- 8.4.5 U.K.
- 8.4.6 Italy
- 8.4.7 Netherlands
- 8.5 Asia Pacific
- 8.5.1 Asia Pacific Radiation Hardened Electronic Devices and Components Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 8.5.2 Asia Pacific Radiation Hardened Electronic Devices and Components Consumption by Country (2021-2032)
- 8.5.3 China
- 8.5.4 Japan
- 8.5.5 South Korea
- 8.5.6 Southeast Asia
- 8.5.7 India
- 8.5.8 Australia
- 8.6 South America
- 8.6.1 South America Radiation Hardened Electronic Devices and Components Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 8.6.2 South America Radiation Hardened Electronic Devices and Components Consumption by Country (2021-2032)
- 8.6.3 Brazil
- 8.6.4 Argentina
- 8.6.5 Chile
- 8.6.6 Colombia
- 8.7 Middle East & Africa
- 8.7.1 Middle East & Africa Radiation Hardened Electronic Devices and Components Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 8.7.2 Middle East & Africa Radiation Hardened Electronic Devices and Components Consumption by Country (2021-2032)
- 8.7.3 Egypt
- 8.7.4 South Africa
- 8.7.5 Israel
- 8.7.6 Türkiye
- 8.7.7 GCC Countries
9 Value Chain and Sales Channels Analysis
- 9.1 Radiation Hardened Electronic Devices and Components Value Chain Analysis
- 9.1.1 Radiation Hardened Electronic Devices and Components Key Raw Materials
- 9.1.2 Raw Materials Key Suppliers
- 9.1.3 Manufacturing Cost Structure
- 9.1.4 Radiation Hardened Electronic Devices and Components Production Mode & Process
- 9.2 Radiation Hardened Electronic Devices and Components Sales Channels Analysis
- 9.2.1 Direct Comparison with Distribution Share
- 9.2.2 Radiation Hardened Electronic Devices and Components Distributors
- 9.2.3 Radiation Hardened Electronic Devices and Components Customers
10 Concluding Insights
11 Appendix
- 11.1 Reasons for Doing This Study
- 11.2 Research Methodology
- 11.3 Research Process
- 11.4 Authors List of This Report
- 11.5 Data Source
- 11.5.1 Secondary Sources
- 11.5.2 Primary Sources
- 11.6 Disclaimer
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