APO RESEARCH · REPORT
Epoxy Adhesive for Electronics
Epoxy Adhesive for Electronics refers to reactive epoxy adhesives for bonded joints in electronic assemblies. A useful bond depends on interfacial wetting, the adhesive's cure or film formation, and the way load passes through the joint.
Product & engineering
Understand the product.
For this subject, the supplied object is reactive epoxy adhesives for bonded joints in electronic assemblies. Bulk strength is only one input. Identify peel versus shear loading, surface preparation, bond-line thickness and cure access; then test after the relevant moisture, heat and fluid exposure. For laminates, retained bond strength and applicable migration requirements matter after full cure, rather than immediately after coating.
What turns activity into demand
Demand follows qualified bonded joints, coating area or dispensed volume and assembly output. Cure, application loss and rework connect formulation shipments to accepted bonded parts.
The commercial boundary
Count the supplied adhesive formulation, not the whole bonded assembly. Chemistry and application labels overlap; packaging, structural and electronic topics are not automatically independent markets.
Why can a strong adhesive fail in the actual joint?
For this subject, the supplied object is reactive epoxy adhesives for bonded joints in electronic assemblies. Bulk strength is only one input. Identify peel versus shear loading, surface preparation, bond-line thickness and cure access; then test after the relevant moisture, heat and fluid exposure. For laminates, retained bond strength and applicable migration requirements matter after full cure, rather than immediately after coating.
Technical reading
Selected research
Industry Research
Epoxy Adhesive for Electronics Industry Research Report 2026
Market perspective
The global Epoxy Adhesive for Electronics market was valued at US$ million in 2025 and is projected to reach US$ million by 2032, implying a CAGR of % over 2026–2032.
The North America market for Epoxy Adhesive for Electronics is forecast to increase from US$ million in 2026 to US$ million by 2032, corresponding to a CAGR of % over 2026–2032.
The Europe market for Epoxy Adhesive for Electronics is projected to rise from US$ million in 2026 to US$ million by 2032, registering a CAGR of % over 2026–2032.
Read the full market overview
The Asia Pacific market for Epoxy Adhesive for Electronics is expected to grow from US$ million in 2026 to US$ million by 2032, at a CAGR of % over 2026–2032.
Leading global manufacturers of Epoxy Adhesive for Electronics include , among others. In 2025, the top three vendors together accounted for approximately % of global revenue.
Report Scope
This report quantifies the global Epoxy Adhesive for Electronics market in revenue (US$ million) and, where applicable, sales volume (k units), using 2025 as the base year and providing annual historical and forecast data for 2021–2032.
It standardizes definitions of types and applications, harmonizes vendor attribution, and presents comparable time series by company, type, application, and region/country, including indicative price bands (US$/k units) and concentration ratios (CR5/CR10).
The outputs are intended to support strategy development, budgeting, and performance benchmarking for manufacturers, new entrants, channel partners, and investors; the report also reviews technology shifts and notable product introductions relevant to Epoxy Adhesive for Electronics.
Key Companies & Market Share Insights
This section profiles leading manufacturers, combining 2021–2025 results with a 2026–2032 outlook. It reports revenue, market share, price bands, product and application mix, regional and channel mix, and key developments (M&A, capacity additions, certifications). It also provides global revenue, average price, and—where applicable—sales volume by manufacturer, and calculates CR5/CR10 and rank changes to support comparative benchmarking.
Epoxy Adhesive for Electronics Market by Company
Evonik
DELO
Henkel
Heraeus
HB Fuller
3M
Tacusil
Tomoegawa
Pelnox
Kisling
Creative Materials, Inc.
Epotek
Shanhai Hansi
Nanjing Abnen Sealing Technology
Yantai Chemical Technology
Epoxy Adhesive for Electronics Segment by Type
Multi-component Epoxy Adhesive
One-Component Epoxy Adhesive
Epoxy Adhesive for Electronics Segment by Application
Automotive Electronics
Consumer Electronics
Other
Epoxy Adhesive for Electronics Segment by Region
North America
United States
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Spain
Netherlands
Switzerland
Sweden
Poland
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Southeast Asia
South America
Brazil
Argentina
Chile
Middle East & Africa
Egypt
South Africa
Israel
Türkiye
GCC Countries
Key Drivers & Barriers
High-impact rendering factors and drivers have been studied in this report to aid the readers to understand the general development. Moreover, the report includes restraints and challenges that may act as stumbling blocks on the way of the players. This will assist the users to be attentive and make informed decisions related to business. Specialists have also laid their focus on the upcoming business prospects.
Reasons to Buy This Report
1. This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global Epoxy Adhesive for Electronics market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.
2. This report will help stakeholders to understand the global industry status and trends of Epoxy Adhesive for Electronics and provides them with information on key market drivers, restraints, challenges, and opportunities.
3. This report will help stakeholders to understand competitors better and gain more insights to strengthen their position in their businesses. The competitive landscape section includes the market share and rank (in volume and value), competitor ecosystem, new product development, expansion, and acquisition.
4. This report stays updated with novel technology integration, features, and the latest developments in the market
5. This report helps stakeholders to gain insights into which regions to target globally
6. This report helps stakeholders to gain insights into the end-user perception concerning the adoption of Epoxy Adhesive for Electronics.
7. This report helps stakeholders to identify some of the key players in the market and understand their valuable contribution.
Chapter Outline
Chapter 1: Research objectives, research methods, data sources, data cross-validation;
Chapter 2: Introduces the report scope of the report, executive summary of different market segments (by region, product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 3: Detailed analysis of Epoxy Adhesive for Electronics manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 5: Production/output, value of Epoxy Adhesive for Electronics by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 6: Consumption of Epoxy Adhesive for Electronics in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 7: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 8: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 9: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 10: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 11: The main points and conclusions of the report.
More report detail
Tables and figures
Scope & coverage.
Types
- Multi-component Epoxy Adhesive
- One-Component Epoxy Adhesive
Applications
- Automotive Electronics
- Consumer Electronics
- Other
Companies covered
- Evonik
- DELO
- Henkel
- Heraeus
- HB Fuller
- 3M
- Tacusil
- Tomoegawa
- Pelnox
- Kisling
- Creative Materials, Inc.
- Epotek
- Shanhai Hansi
- Nanjing Abnen Sealing Technology
- Yantai Chemical Technology
Inside the report.
1 Preface
- 1.1 Scope of Report
- 1.2 Reasons for Doing This Study
- 1.3 Research Methodology
- 1.4 Research Process
- 1.5 Data Source
- 1.5.1 Secondary Sources
- 1.5.2 Primary Sources
2 Market Overview
- 2.1 Product Definition
- 2.2 Epoxy Adhesive for Electronics by Type
- 2.2.1 Market Value Comparison by Type (2021 VS 2025 VS 2032) & (US$ Million)
- 2.2.2 Multi-component Epoxy Adhesive
- 2.2.3 One-Component Epoxy Adhesive
- 2.3 Epoxy Adhesive for Electronics by Application
- 2.3.1 Market Value Comparison by Application (2021 VS 2025 VS 2032) & (US$ Million)
- 2.3.2 Automotive Electronics
- 2.3.3 Consumer Electronics
- 2.3.4 Other
- 2.4 Global Market Growth Prospects
- 2.4.1 Global Epoxy Adhesive for Electronics Production Value Estimates and Forecasts (2021-2032)
- 2.4.2 Global Epoxy Adhesive for Electronics Production Capacity Estimates and Forecasts (2021-2032)
- 2.4.3 Global Epoxy Adhesive for Electronics Production Estimates and Forecasts (2021-2032)
- 2.4.4 Global Epoxy Adhesive for Electronics Market Average Price (2021-2032)
3 Market Competitive Landscape by Manufacturers
- 3.1 Global Epoxy Adhesive for Electronics Production by Manufacturers (2021-2026)
- 3.2 Global Epoxy Adhesive for Electronics Production Value by Manufacturers (2021-2026)
- 3.3 Global Epoxy Adhesive for Electronics Average Price by Manufacturers (2021-2026)
- 3.4 Global Epoxy Adhesive for Electronics Industry Manufacturers Ranking, 2024 VS 2025 VS 2026
- 3.5 Global Epoxy Adhesive for Electronics Key Manufacturers, Manufacturing Sites & Headquarters
- 3.6 Global Epoxy Adhesive for Electronics Manufacturers, Product Type & Application
- 3.7 Global Epoxy Adhesive for Electronics Manufacturers Established Date
- 3.8 Global Epoxy Adhesive for Electronics Market CR5 and HHI
- 3.9 Global Manufacturers Mergers & Acquisition
4 Manufacturers Profiled
- 4.1 Evonik
- 4.1.1 Evonik Epoxy Adhesive for Electronics Company Information
- 4.1.2 Evonik Epoxy Adhesive for Electronics Business Overview
- 4.1.3 Evonik Epoxy Adhesive for Electronics Production, Value and Gross Margin (2021-2026)
- 4.1.4 Evonik Product Portfolio
- 4.1.5 Evonik Recent Developments
- 4.2 DELO
- 4.2.1 DELO Epoxy Adhesive for Electronics Company Information
- 4.2.2 DELO Epoxy Adhesive for Electronics Business Overview
- 4.2.3 DELO Epoxy Adhesive for Electronics Production, Value and Gross Margin (2021-2026)
- 4.2.4 DELO Product Portfolio
- 4.2.5 DELO Recent Developments
- 4.3 Henkel
- 4.3.1 Henkel Epoxy Adhesive for Electronics Company Information
- 4.3.2 Henkel Epoxy Adhesive for Electronics Business Overview
- 4.3.3 Henkel Epoxy Adhesive for Electronics Production, Value and Gross Margin (2021-2026)
- 4.3.4 Henkel Product Portfolio
- 4.3.5 Henkel Recent Developments
- 4.4 Heraeus
- 4.4.1 Heraeus Epoxy Adhesive for Electronics Company Information
- 4.4.2 Heraeus Epoxy Adhesive for Electronics Business Overview
- 4.4.3 Heraeus Epoxy Adhesive for Electronics Production, Value and Gross Margin (2021-2026)
- 4.4.4 Heraeus Product Portfolio
- 4.4.5 Heraeus Recent Developments
- 4.5 HB Fuller
- 4.5.1 HB Fuller Epoxy Adhesive for Electronics Company Information
- 4.5.2 HB Fuller Epoxy Adhesive for Electronics Business Overview
- 4.5.3 HB Fuller Epoxy Adhesive for Electronics Production, Value and Gross Margin (2021-2026)
- 4.5.4 HB Fuller Product Portfolio
- 4.5.5 HB Fuller Recent Developments
- 4.6 3M
- 4.6.1 3M Epoxy Adhesive for Electronics Company Information
- 4.6.2 3M Epoxy Adhesive for Electronics Business Overview
- 4.6.3 3M Epoxy Adhesive for Electronics Production, Value and Gross Margin (2021-2026)
- 4.6.4 3M Product Portfolio
- 4.6.5 3M Recent Developments
- 4.7 Tacusil
- 4.7.1 Tacusil Epoxy Adhesive for Electronics Company Information
- 4.7.2 Tacusil Epoxy Adhesive for Electronics Business Overview
- 4.7.3 Tacusil Epoxy Adhesive for Electronics Production, Value and Gross Margin (2021-2026)
- 4.7.4 Tacusil Product Portfolio
- 4.7.5 Tacusil Recent Developments
- 4.8 Tomoegawa
- 4.8.1 Tomoegawa Epoxy Adhesive for Electronics Company Information
- 4.8.2 Tomoegawa Epoxy Adhesive for Electronics Business Overview
- 4.8.3 Tomoegawa Epoxy Adhesive for Electronics Production, Value and Gross Margin (2021-2026)
- 4.8.4 Tomoegawa Product Portfolio
- 4.8.5 Tomoegawa Recent Developments
- 4.9 Pelnox
- 4.9.1 Pelnox Epoxy Adhesive for Electronics Company Information
- 4.9.2 Pelnox Epoxy Adhesive for Electronics Business Overview
- 4.9.3 Pelnox Epoxy Adhesive for Electronics Production, Value and Gross Margin (2021-2026)
- 4.9.4 Pelnox Product Portfolio
- 4.9.5 Pelnox Recent Developments
- 4.10 Kisling
- 4.10.1 Kisling Epoxy Adhesive for Electronics Company Information
- 4.10.2 Kisling Epoxy Adhesive for Electronics Business Overview
- 4.10.3 Kisling Epoxy Adhesive for Electronics Production, Value and Gross Margin (2021-2026)
- 4.10.4 Kisling Product Portfolio
- 4.10.5 Kisling Recent Developments
- 4.11 Creative Materials, Inc.
- 4.11.1 Creative Materials, Inc. Epoxy Adhesive for Electronics Company Information
- 4.11.2 Creative Materials, Inc. Epoxy Adhesive for Electronics Business Overview
- 4.11.3 Creative Materials, Inc. Epoxy Adhesive for Electronics Production, Value and Gross Margin (2021-2026)
- 4.11.4 Creative Materials, Inc. Product Portfolio
- 4.11.5 Creative Materials, Inc. Recent Developments
- 4.12 Epotek
- 4.12.1 Epotek Epoxy Adhesive for Electronics Company Information
- 4.12.2 Epotek Epoxy Adhesive for Electronics Business Overview
- 4.12.3 Epotek Epoxy Adhesive for Electronics Production, Value and Gross Margin (2021-2026)
- 4.12.4 Epotek Product Portfolio
- 4.12.5 Epotek Recent Developments
- 4.13 Shanhai Hansi
- 4.13.1 Shanhai Hansi Epoxy Adhesive for Electronics Company Information
- 4.13.2 Shanhai Hansi Epoxy Adhesive for Electronics Business Overview
- 4.13.3 Shanhai Hansi Epoxy Adhesive for Electronics Production, Value and Gross Margin (2021-2026)
- 4.13.4 Shanhai Hansi Product Portfolio
- 4.13.5 Shanhai Hansi Recent Developments
- 4.14 Nanjing Abnen Sealing Technology
- 4.14.1 Nanjing Abnen Sealing Technology Epoxy Adhesive for Electronics Company Information
- 4.14.2 Nanjing Abnen Sealing Technology Epoxy Adhesive for Electronics Business Overview
- 4.14.3 Nanjing Abnen Sealing Technology Epoxy Adhesive for Electronics Production, Value and Gross Margin (2021-2026)
- 4.14.4 Nanjing Abnen Sealing Technology Product Portfolio
- 4.14.5 Nanjing Abnen Sealing Technology Recent Developments
- 4.15 Yantai Chemical Technology
- 4.15.1 Yantai Chemical Technology Epoxy Adhesive for Electronics Company Information
- 4.15.2 Yantai Chemical Technology Epoxy Adhesive for Electronics Business Overview
- 4.15.3 Yantai Chemical Technology Epoxy Adhesive for Electronics Production, Value and Gross Margin (2021-2026)
- 4.15.4 Yantai Chemical Technology Product Portfolio
- 4.15.5 Yantai Chemical Technology Recent Developments
5 Global Epoxy Adhesive for Electronics Production by Region
- 5.1 Global Epoxy Adhesive for Electronics Production Estimates and Forecasts by Region: 2021 VS 2025 VS 2032
- 5.2 Global Epoxy Adhesive for Electronics Production by Region: 2021-2032
- 5.2.1 Global Epoxy Adhesive for Electronics Production by Region: 2021-2026
- 5.2.2 Global Epoxy Adhesive for Electronics Production Forecast by Region (2027-2032)
- 5.3 Global Epoxy Adhesive for Electronics Production Value Estimates and Forecasts by Region: 2021 VS 2025 VS 2032
- 5.4 Global Epoxy Adhesive for Electronics Production Value by Region: 2021-2032
- 5.4.1 Global Epoxy Adhesive for Electronics Production Value by Region: 2021-2026
- 5.4.2 Global Epoxy Adhesive for Electronics Production Value Forecast by Region (2027-2032)
- 5.5 Global Epoxy Adhesive for Electronics Market Price Analysis by Region (2021-2026)
- 5.6 Global Epoxy Adhesive for Electronics Production and Value, YOY Growth
- 5.6.1 North America Epoxy Adhesive for Electronics Production Value Estimates and Forecasts (2021-2032)
- 5.6.2 Europe Epoxy Adhesive for Electronics Production Value Estimates and Forecasts (2021-2032)
- 5.6.3 China Epoxy Adhesive for Electronics Production Value Estimates and Forecasts (2021-2032)
- 5.6.4 Japan Epoxy Adhesive for Electronics Production Value Estimates and Forecasts (2021-2032)
- 5.6.5 South Korea Epoxy Adhesive for Electronics Production Value Estimates and Forecasts (2021-2032)
6 Global Epoxy Adhesive for Electronics Consumption by Region
- 6.1 Global Epoxy Adhesive for Electronics Consumption Estimates and Forecasts by Region: 2021 VS 2025 VS 2032
- 6.2 Global Epoxy Adhesive for Electronics Consumption by Region (2021-2032)
- 6.2.1 Global Epoxy Adhesive for Electronics Consumption by Region: 2021-2026
- 6.2.2 Global Epoxy Adhesive for Electronics Forecasted Consumption by Region (2027-2032)
- 6.3 North America
- 6.3.1 North America Epoxy Adhesive for Electronics Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 6.3.2 North America Epoxy Adhesive for Electronics Consumption by Country (2021-2032)
- 6.3.3 United States
- 6.3.4 Canada
- 6.3.5 Mexico
- 6.4 Europe
- 6.4.1 Europe Epoxy Adhesive for Electronics Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 6.4.2 Europe Epoxy Adhesive for Electronics Consumption by Country (2021-2032)
- 6.4.3 Germany
- 6.4.4 France
- 6.4.5 U.K.
- 6.4.6 Italy
- 6.4.7 Russia
- 6.4.8 Spain
- 6.4.9 Netherlands
- 6.4.10 Switzerland
- 6.4.11 Sweden
- 6.4.12 Poland
- 6.5 Asia Pacific
- 6.5.1 Asia Pacific Epoxy Adhesive for Electronics Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 6.5.2 Asia Pacific Epoxy Adhesive for Electronics Consumption by Country (2021-2032)
- 6.5.3 China
- 6.5.4 Japan
- 6.5.5 South Korea
- 6.5.6 India
- 6.5.7 Australia
- 6.5.8 Taiwan
- 6.5.9 Southeast Asia
- 6.6 South America, Middle East & Africa
- 6.6.1 South America, Middle East & Africa Epoxy Adhesive for Electronics Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 6.6.2 South America, Middle East & Africa Epoxy Adhesive for Electronics Consumption by Country (2021-2032)
- 6.6.3 Brazil
- 6.6.4 Argentina
- 6.6.5 Chile
- 6.6.6 Turkey
- 6.6.7 GCC Countries
7 Segment by Type
- 7.1 Global Epoxy Adhesive for Electronics Production by Type (2021-2032)
- 7.1.1 Global Epoxy Adhesive for Electronics Production by Type (2021-2032) & (k units)
- 7.1.2 Global Epoxy Adhesive for Electronics Production Market Share by Type (2021-2032)
- 7.2 Global Epoxy Adhesive for Electronics Production Value by Type (2021-2032)
- 7.2.1 Global Epoxy Adhesive for Electronics Production Value by Type (2021-2032) & (US$ Million)
- 7.2.2 Global Epoxy Adhesive for Electronics Production Value Market Share by Type (2021-2032)
- 7.3 Global Epoxy Adhesive for Electronics Price by Type (2021-2032)
8 Segment by Application
- 8.1 Global Epoxy Adhesive for Electronics Production by Application (2021-2032)
- 8.1.1 Global Epoxy Adhesive for Electronics Production by Application (2021-2032) & (k units)
- 8.1.2 Global Epoxy Adhesive for Electronics Production Market Share by Application (2021-2032)
- 8.2 Global Epoxy Adhesive for Electronics Production Value by Application (2021-2032)
- 8.2.1 Global Epoxy Adhesive for Electronics Production Value by Application (2021-2032) & (US$ Million)
- 8.2.2 Global Epoxy Adhesive for Electronics Production Value Market Share by Application (2021-2032)
- 8.3 Global Epoxy Adhesive for Electronics Price by Application (2021-2032)
9 Value Chain and Sales Channels Analysis of the Market
- 9.1 Epoxy Adhesive for Electronics Value Chain Analysis
- 9.1.1 Epoxy Adhesive for Electronics Key Raw Materials
- 9.1.2 Raw Materials Key Suppliers
- 9.1.3 Epoxy Adhesive for Electronics Production Mode & Process
- 9.2 Epoxy Adhesive for Electronics Sales Channels Analysis
- 9.2.1 Direct Comparison with Distribution Share
- 9.2.2 Epoxy Adhesive for Electronics Distributors
- 9.2.3 Epoxy Adhesive for Electronics Customers
10 Global Epoxy Adhesive for Electronics Analyzing Market Dynamics
- 10.1 Epoxy Adhesive for Electronics Industry Trends
- 10.2 Epoxy Adhesive for Electronics Industry Drivers
- 10.3 Epoxy Adhesive for Electronics Industry Opportunities and Challenges
- 10.4 Epoxy Adhesive for Electronics Industry Restraints
11 Report Conclusion
12 Disclaimer
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