Selected research
Industry Growth & Trends
Global Through-Hole Electronics Packaging Industry Growth and Trends Forecast to 2032
Market perspective
The global Through-Hole Electronics Packaging market was valued at US$ million in 2026 and is projected to reach US$ million by 2032, implying a CAGR of xx% over 2026-2032.
The North America market for Through-Hole Electronics Packaging is projected to increase from US$ million in 2026 to US$ million by 2032, corresponding to a CAGR of % over 2026-2032.
The Europe market for Through-Hole Electronics Packaging is projected to increase from US$ million in 2026 to US$ million by 2032, registering a CAGR of % over 2026-2032.
Read the full market overview
The Asia Pacific market for Through-Hole Electronics Packaging is projected to increase from US$ million in 2026 to US$ million by 2032, at a CAGR of % over 2026-2032.
Leading global manufacturers of Through-Hole Electronics Packaging include AMETEK, Inc., Dordan Mfg, Dupont, Osram, The Plastiform Company, Kiva Container, Primex Plastics Corporation., Quality Foam Packaging Inc and Ameson Packaging, among others. In 2025, the top three vendors together accounted for approximately % of global revenue.
Report Scope
This report provides a structured, data-driven view of the global Through-Hole Electronics Packaging market, combining harmonized quantitative metrics with targeted qualitative insight to support business and growth strategy, market positioning, and capital allocation.
The Through-Hole Electronics Packaging market size, estimates, and forecasts are presented in terms of sales volume (k units) and revenue (US$ million), with 2025 as the base year and historical and forecast data for 2021-2032. The report segments the global Through-Hole Electronics Packaging market by Type, Application, region/country, and company, provides regional market sizes at the segment level, profiles the competitive landscape and key players and their market ranks, and reviews technology trends and new product developments relevant to Through-Hole Electronics Packaging.
Key Companies & Market Share Insights
This section analyzes the strategies and performance of leading manufacturers in the global Through-Hole Electronics Packaging market, including portfolio focus, innovation and product development, mergers and acquisitions, collaborations, and geographic expansion used to sustain or enhance competitive positions. It also summarizes recent corporate developments and key financial indicators and provides global revenue, price, and sales volume data by manufacturer for 2020-2025, enabling benchmarking of scale, pricing, and market share and supporting assessment of market concentration through indicators such as CR5 and CR10.
Through-Hole Electronics Packaging Market by Company
AMETEK, Inc.
Dordan Mfg
Dupont
Osram
The Plastiform Company
Kiva Container
Primex Plastics Corporation.
Quality Foam Packaging Inc
Ameson Packaging
Lithoflex, Inc.
UFP Technologies
Intel Corporation
STMicroelectronics
Advanced Micro Devices, Inc
SAMSUNG
GY Packaging
Taiwan Semiconductor
Through-Hole Electronics Packaging Segment by Type
Plastic
Metal
Glass
Others
Through-Hole Electronics Packaging Segment by Application
Consumer Electronics
Aerospace and Defense
Automotive
Telecommunications
Others
Through-Hole Electronics Packaging Segment by Region
North America
United States
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Spain
Netherlands
Switzerland
Sweden
Poland
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Southeast Asia
South America
Brazil
Argentina
Chile
Middle East & Africa
Egypt
South Africa
Israel
Türkiye
GCC Countries
Key Drivers & Barriers
High-impact rendering factors and drivers have been studied in this report to aid the readers to understand the general development. Moreover, the report includes restraints and challenges that may act as stumbling blocks on the way of the players. This will assist the users to be attentive and make informed decisions related to business. Specialists have also laid their focus on the upcoming business prospects.
Reasons to Buy This Report
1. This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global Through-Hole Electronics Packaging market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.
2. This report will help stakeholders to understand the global industry status and trends of Through-Hole Electronics Packaging and provides them with information on key market drivers, restraints, challenges, and opportunities.
3. This report will help stakeholders to understand competitors better and gain more insights to strengthen their position in their businesses. The competitive landscape section includes the market share and rank (in volume and value), competitor ecosystem, new product development, expansion, and acquisition.
4. This report stays updated with novel technology integration, features, and the latest developments in the market.
5. This report helps stakeholders to gain insights into which regions to target globally.
6. This report helps stakeholders to gain insights into the end-user perception concerning the adoption of Through-Hole Electronics Packaging.
7. This report helps stakeholders to identify some of the key players in the market and understand their valuable contribution.
Chapter Outline
Chapter 1: Introduces the study scope of this report, executive summary of market segments by type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter 2: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Through-Hole Electronics Packaging manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter 4: Sales, revenue of Through-Hole Electronics Packaging in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter 5: Introduces market segments by application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter 6: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 7, 8, 9, 10 and 11: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter 12: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics.
Chapter 13: Concluding Insights of the report.
More report detail
Tables and figures
Scope & coverage.
Types
- Plastic
- Metal
- Glass
- Others
Applications
- Consumer Electronics
- Aerospace and Defense
- Automotive
- Telecommunications
- Others
Companies covered
- AMETEK, Inc.
- Dordan Mfg
- Dupont
- Osram
- The Plastiform Company
- Kiva Container
- Primex Plastics Corporation.
- Quality Foam Packaging Inc
- Ameson Packaging
- Lithoflex, Inc.
- UFP Technologies
- Intel Corporation
- STMicroelectronics
- Advanced Micro Devices, Inc
- SAMSUNG
- GY Packaging
- Taiwan Semiconductor
Inside the report.
1 Market Overview
- 1.1 Product Definition
- 1.2 Global Market Growth Prospects
- 1.2.1 Global Through-Hole Electronics Packaging Market Size Estimates and Forecasts (2021-2032)
- 1.2.2 Global Through-Hole Electronics Packaging Sales Estimates and Forecasts (2021-2032)
- 1.3 Through-Hole Electronics Packaging Market by Type
- 1.3.1 Plastic
- 1.3.2 Metal
- 1.3.3 Glass
- 1.3.4 Others
- 1.4 Global Through-Hole Electronics Packaging Market Size by Type
- 1.4.1 Global Through-Hole Electronics Packaging Market Size Overview by Type (2021-2032)
- 1.4.2 Global Through-Hole Electronics Packaging Historic Market Size Review by Type (2021-2026)
- 1.4.3 Global Through-Hole Electronics Packaging Forecasted Market Size by Type (2027-2032)
- 1.5 Key Regions Market Size by Type
- 1.5.1 North America Through-Hole Electronics Packaging Sales Breakdown by Type (2021-2026)
- 1.5.2 Europe Through-Hole Electronics Packaging Sales Breakdown by Type (2021-2026)
- 1.5.3 Asia-Pacific Through-Hole Electronics Packaging Sales Breakdown by Type (2021-2026)
- 1.5.4 South America Through-Hole Electronics Packaging Sales Breakdown by Type (2021-2026)
- 1.5.5 Middle East and Africa Through-Hole Electronics Packaging Sales Breakdown by Type (2021-2026)
2 Global Market Dynamics
- 2.1 Through-Hole Electronics Packaging Industry Trends
- 2.2 Through-Hole Electronics Packaging Industry Drivers
- 2.3 Through-Hole Electronics Packaging Industry Opportunities and Challenges
- 2.4 Through-Hole Electronics Packaging Industry Restraints
3 Market Competitive Landscape by Company
- 3.1 Global Top Players by Through-Hole Electronics Packaging Revenue (2021-2026)
- 3.2 Global Top Players by Through-Hole Electronics Packaging Sales (2021-2026)
- 3.3 Global Top Players by Through-Hole Electronics Packaging Price (2021-2026)
- 3.4 Global Through-Hole Electronics Packaging Industry Company Ranking, 2024 VS 2025 VS 2026
- 3.5 Global Through-Hole Electronics Packaging Major Company Production Sites & Headquarters
- 3.6 Global Through-Hole Electronics Packaging Company, Product Type & Application
- 3.7 Global Through-Hole Electronics Packaging Company Establishment Date
- 3.8 Market Competitive Analysis
- 3.8.1 Global Through-Hole Electronics Packaging Market CR5 and HHI
- 3.8.2 Global Top 5 and 10 Through-Hole Electronics Packaging Players Market Share by Revenue in 2025
- 3.8.3 2025 Through-Hole Electronics Packaging Tier 1, Tier 2, and Tier 3
4 Through-Hole Electronics Packaging Regional Status and Outlook
- 4.1 Global Through-Hole Electronics Packaging Market Size and CAGR by Region: 2021 VS 2025 VS 2032
- 4.2 Global Through-Hole Electronics Packaging Historic Market Size by Region
- 4.2.1 Global Through-Hole Electronics Packaging Sales in Volume by Region (2021-2026)
- 4.2.2 Global Through-Hole Electronics Packaging Sales in Value by Region (2021-2026)
- 4.2.3 Global Through-Hole Electronics Packaging Sales (Volume & Value), Price and Gross Margin (2021-2026)
- 4.3 Global Through-Hole Electronics Packaging Forecasted Market Size by Region
- 4.3.1 Global Through-Hole Electronics Packaging Sales in Volume by Region (2027-2032)
- 4.3.2 Global Through-Hole Electronics Packaging Sales in Value by Region (2027-2032)
- 4.3.3 Global Through-Hole Electronics Packaging Sales (Volume & Value), Price and Gross Margin (2027-2032)
5 Through-Hole Electronics Packaging by Application
- 5.1 Through-Hole Electronics Packaging Market by Application
- 5.1.1 Consumer Electronics
- 5.1.2 Aerospace and Defense
- 5.1.3 Automotive
- 5.1.4 Telecommunications
- 5.1.5 Others
- 5.2 Global Through-Hole Electronics Packaging Market Size by Application
- 5.2.1 Global Through-Hole Electronics Packaging Market Size Overview by Application (2021-2032)
- 5.2.2 Global Through-Hole Electronics Packaging Historic Market Size Review by Application (2021-2026)
- 5.2.3 Global Through-Hole Electronics Packaging Forecasted Market Size by Application (2027-2032)
- 5.3 Key Regions Market Size by Application
- 5.3.1 North America Through-Hole Electronics Packaging Sales Breakdown by Application (2021-2026)
- 5.3.2 Europe Through-Hole Electronics Packaging Sales Breakdown by Application (2021-2026)
- 5.3.3 Asia-Pacific Through-Hole Electronics Packaging Sales Breakdown by Application (2021-2026)
- 5.3.4 South America Through-Hole Electronics Packaging Sales Breakdown by Application (2021-2026)
- 5.3.5 Middle East and Africa Through-Hole Electronics Packaging Sales Breakdown by Application (2021-2026)
6 Company Profiles
- 6.1 AMETEK, Inc.
- 6.1.1 AMETEK, Inc. Company Information
- 6.1.2 AMETEK, Inc. Business Overview
- 6.1.3 AMETEK, Inc. Through-Hole Electronics Packaging Sales, Revenue and Gross Margin (2021-2026)
- 6.1.4 AMETEK, Inc. Through-Hole Electronics Packaging Product Portfolio
- 6.1.5 AMETEK, Inc. Recent Developments
- 6.2 Dordan Mfg
- 6.2.1 Dordan Mfg Company Information
- 6.2.2 Dordan Mfg Business Overview
- 6.2.3 Dordan Mfg Through-Hole Electronics Packaging Sales, Revenue and Gross Margin (2021-2026)
- 6.2.4 Dordan Mfg Through-Hole Electronics Packaging Product Portfolio
- 6.2.5 Dordan Mfg Recent Developments
- 6.3 Dupont
- 6.3.1 Dupont Company Information
- 6.3.2 Dupont Business Overview
- 6.3.3 Dupont Through-Hole Electronics Packaging Sales, Revenue and Gross Margin (2021-2026)
- 6.3.4 Dupont Through-Hole Electronics Packaging Product Portfolio
- 6.3.5 Dupont Recent Developments
- 6.4 Osram
- 6.4.1 Osram Company Information
- 6.4.2 Osram Business Overview
- 6.4.3 Osram Through-Hole Electronics Packaging Sales, Revenue and Gross Margin (2021-2026)
- 6.4.4 Osram Through-Hole Electronics Packaging Product Portfolio
- 6.4.5 Osram Recent Developments
- 6.5 The Plastiform Company
- 6.5.1 The Plastiform Company Company Information
- 6.5.2 The Plastiform Company Business Overview
- 6.5.3 The Plastiform Company Through-Hole Electronics Packaging Sales, Revenue and Gross Margin (2021-2026)
- 6.5.4 The Plastiform Company Through-Hole Electronics Packaging Product Portfolio
- 6.5.5 The Plastiform Company Recent Developments
- 6.6 Kiva Container
- 6.6.1 Kiva Container Company Information
- 6.6.2 Kiva Container Business Overview
- 6.6.3 Kiva Container Through-Hole Electronics Packaging Sales, Revenue and Gross Margin (2021-2026)
- 6.6.4 Kiva Container Through-Hole Electronics Packaging Product Portfolio
- 6.6.5 Kiva Container Recent Developments
- 6.7 Primex Plastics Corporation.
- 6.7.1 Primex Plastics Corporation. Company Information
- 6.7.2 Primex Plastics Corporation. Business Overview
- 6.7.3 Primex Plastics Corporation. Through-Hole Electronics Packaging Sales, Revenue and Gross Margin (2021-2026)
- 6.7.4 Primex Plastics Corporation. Through-Hole Electronics Packaging Product Portfolio
- 6.7.5 Primex Plastics Corporation. Recent Developments
- 6.8 Quality Foam Packaging Inc
- 6.8.1 Quality Foam Packaging Inc Company Information
- 6.8.2 Quality Foam Packaging Inc Business Overview
- 6.8.3 Quality Foam Packaging Inc Through-Hole Electronics Packaging Sales, Revenue and Gross Margin (2021-2026)
- 6.8.4 Quality Foam Packaging Inc Through-Hole Electronics Packaging Product Portfolio
- 6.8.5 Quality Foam Packaging Inc Recent Developments
- 6.9 Ameson Packaging
- 6.9.1 Ameson Packaging Company Information
- 6.9.2 Ameson Packaging Business Overview
- 6.9.3 Ameson Packaging Through-Hole Electronics Packaging Sales, Revenue and Gross Margin (2021-2026)
- 6.9.4 Ameson Packaging Through-Hole Electronics Packaging Product Portfolio
- 6.9.5 Ameson Packaging Recent Developments
- 6.10 Lithoflex, Inc.
- 6.10.1 Lithoflex, Inc. Company Information
- 6.10.2 Lithoflex, Inc. Business Overview
- 6.10.3 Lithoflex, Inc. Through-Hole Electronics Packaging Sales, Revenue and Gross Margin (2021-2026)
- 6.10.4 Lithoflex, Inc. Through-Hole Electronics Packaging Product Portfolio
- 6.10.5 Lithoflex, Inc. Recent Developments
- 6.11 UFP Technologies
- 6.11.1 UFP Technologies Company Information
- 6.11.2 UFP Technologies Business Overview
- 6.11.3 UFP Technologies Through-Hole Electronics Packaging Sales, Revenue and Gross Margin (2021-2026)
- 6.11.4 UFP Technologies Through-Hole Electronics Packaging Product Portfolio
- 6.11.5 UFP Technologies Recent Developments
- 6.12 Intel Corporation
- 6.12.1 Intel Corporation Company Information
- 6.12.2 Intel Corporation Business Overview
- 6.12.3 Intel Corporation Through-Hole Electronics Packaging Sales, Revenue and Gross Margin (2021-2026)
- 6.12.4 Intel Corporation Through-Hole Electronics Packaging Product Portfolio
- 6.12.5 Intel Corporation Recent Developments
- 6.13 STMicroelectronics
- 6.13.1 STMicroelectronics Company Information
- 6.13.2 STMicroelectronics Business Overview
- 6.13.3 STMicroelectronics Through-Hole Electronics Packaging Sales, Revenue and Gross Margin (2021-2026)
- 6.13.4 STMicroelectronics Through-Hole Electronics Packaging Product Portfolio
- 6.13.5 STMicroelectronics Recent Developments
- 6.14 Advanced Micro Devices, Inc
- 6.14.1 Advanced Micro Devices, Inc Company Information
- 6.14.2 Advanced Micro Devices, Inc Business Overview
- 6.14.3 Advanced Micro Devices, Inc Through-Hole Electronics Packaging Sales, Revenue and Gross Margin (2021-2026)
- 6.14.4 Advanced Micro Devices, Inc Through-Hole Electronics Packaging Product Portfolio
- 6.14.5 Advanced Micro Devices, Inc Recent Developments
- 6.15 SAMSUNG
- 6.15.1 SAMSUNG Company Information
- 6.15.2 SAMSUNG Business Overview
- 6.15.3 SAMSUNG Through-Hole Electronics Packaging Sales, Revenue and Gross Margin (2021-2026)
- 6.15.4 SAMSUNG Through-Hole Electronics Packaging Product Portfolio
- 6.15.5 SAMSUNG Recent Developments
- 6.16 GY Packaging
- 6.16.1 GY Packaging Company Information
- 6.16.2 GY Packaging Business Overview
- 6.16.3 GY Packaging Through-Hole Electronics Packaging Sales, Revenue and Gross Margin (2021-2026)
- 6.16.4 GY Packaging Through-Hole Electronics Packaging Product Portfolio
- 6.16.5 GY Packaging Recent Developments
- 6.17 Taiwan Semiconductor
- 6.17.1 Taiwan Semiconductor Company Information
- 6.17.2 Taiwan Semiconductor Business Overview
- 6.17.3 Taiwan Semiconductor Through-Hole Electronics Packaging Sales, Revenue and Gross Margin (2021-2026)
- 6.17.4 Taiwan Semiconductor Through-Hole Electronics Packaging Product Portfolio
- 6.17.5 Taiwan Semiconductor Recent Developments
7 North America by Country
- 7.1 North America Through-Hole Electronics Packaging Sales by Country
- 7.1.1 North America Through-Hole Electronics Packaging Sales Growth Rate (CAGR) by Country: 2021 VS 2025 VS 2032
- 7.1.2 North America Through-Hole Electronics Packaging Sales by Country (2021-2026)
- 7.1.3 North America Through-Hole Electronics Packaging Sales Forecast by Country (2027-2032)
- 7.2 North America Through-Hole Electronics Packaging Market Size by Country
- 7.2.1 North America Through-Hole Electronics Packaging Market Size Growth Rate (CAGR) by Country: 2021 VS 2025 VS 2032
- 7.2.2 North America Through-Hole Electronics Packaging Market Size by Country (2021-2026)
- 7.2.3 North America Through-Hole Electronics Packaging Market Size Forecast by Country (2027-2032)
8 Europe by Country
- 8.1 Europe Through-Hole Electronics Packaging Sales by Country
- 8.1.1 Europe Through-Hole Electronics Packaging Sales Growth Rate (CAGR) by Country: 2021 VS 2025 VS 2032
- 8.1.2 Europe Through-Hole Electronics Packaging Sales by Country (2021-2026)
- 8.1.3 Europe Through-Hole Electronics Packaging Sales Forecast by Country (2027-2032)
- 8.2 Europe Through-Hole Electronics Packaging Market Size by Country
- 8.2.1 Europe Through-Hole Electronics Packaging Market Size Growth Rate (CAGR) by Country: 2021 VS 2025 VS 2032
- 8.2.2 Europe Through-Hole Electronics Packaging Market Size by Country (2021-2026)
- 8.2.3 Europe Through-Hole Electronics Packaging Market Size Forecast by Country (2027-2032)
9 Asia-Pacific by Country
- 9.1 Asia-Pacific Through-Hole Electronics Packaging Sales by Country
- 9.1.1 Asia-Pacific Through-Hole Electronics Packaging Sales Growth Rate (CAGR) by Country: 2021 VS 2025 VS 2032
- 9.1.2 Asia-Pacific Through-Hole Electronics Packaging Sales by Country (2021-2026)
- 9.1.3 Asia-Pacific Through-Hole Electronics Packaging Sales Forecast by Country (2027-2032)
- 9.2 Asia-Pacific Through-Hole Electronics Packaging Market Size by Country
- 9.2.1 Asia-Pacific Through-Hole Electronics Packaging Market Size Growth Rate (CAGR) by Country: 2021 VS 2025 VS 2032
- 9.2.2 Asia-Pacific Through-Hole Electronics Packaging Market Size by Country (2021-2026)
- 9.2.3 Asia-Pacific Through-Hole Electronics Packaging Market Size Forecast by Country (2027-2032)
10 South America by Country
- 10.1 South America Through-Hole Electronics Packaging Sales by Country
- 10.1.1 South America Through-Hole Electronics Packaging Sales Growth Rate (CAGR) by Country: 2021 VS 2025 VS 2032
- 10.1.2 South America Through-Hole Electronics Packaging Sales by Country (2021-2026)
- 10.1.3 South America Through-Hole Electronics Packaging Sales Forecast by Country (2027-2032)
- 10.2 South America Through-Hole Electronics Packaging Market Size by Country
- 10.2.1 South America Through-Hole Electronics Packaging Market Size Growth Rate (CAGR) by Country: 2021 VS 2025 VS 2032
- 10.2.2 South America Through-Hole Electronics Packaging Market Size by Country (2021-2026)
- 10.2.3 South America Through-Hole Electronics Packaging Market Size Forecast by Country (2027-2032)
11 Middle East and Africa by Country
- 11.1 Middle East and Africa Through-Hole Electronics Packaging Sales by Country
- 11.1.1 Middle East and Africa Through-Hole Electronics Packaging Sales Growth Rate (CAGR) by Country: 2021 VS 2025 VS 2032
- 11.1.2 Middle East and Africa Through-Hole Electronics Packaging Sales by Country (2021-2026)
- 11.1.3 Middle East and Africa Through-Hole Electronics Packaging Sales Forecast by Country (2027-2032)
- 11.2 Middle East and Africa Through-Hole Electronics Packaging Market Size by Country
- 11.2.1 Middle East and Africa Through-Hole Electronics Packaging Market Size Growth Rate (CAGR) by Country: 2021 VS 2025 VS 2032
- 11.2.2 Middle East and Africa Through-Hole Electronics Packaging Market Size by Country (2021-2026)
- 11.2.3 Middle East and Africa Through-Hole Electronics Packaging Market Size Forecast by Country (2027-2032)
12 Value Chain and Sales Channels Analysis
- 12.1 Through-Hole Electronics Packaging Value Chain Analysis
- 12.1.1 Through-Hole Electronics Packaging Key Raw Materials
- 12.1.2 Key Raw Materials Price
- 12.1.3 Raw Materials Key Suppliers
- 12.1.4 Manufacturing Cost Structure
- 12.1.5 Through-Hole Electronics Packaging Production Mode & Process
- 12.2 Through-Hole Electronics Packaging Sales Channels Analysis
- 12.2.1 Direct Comparison with Distribution Share
- 12.2.2 Through-Hole Electronics Packaging Distributors
- 12.2.3 Through-Hole Electronics Packaging Customers
13 Concluding Insights
14 Appendix
- 14.1 Reasons for Doing This Study
- 14.2 Research Methodology
- 14.3 Research Process
- 14.4 Authors List of This Report
- 14.5 Data Source
- 14.5.1 Secondary Sources
- 14.5.2 Primary Sources
- 14.6 Disclaimer
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