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Through-Hole Electronics Packaging Industry Research Report 2026
Market perspective
The global Through-Hole Electronics Packaging market was valued at US$ million in 2025 and is projected to reach US$ million by 2032, implying a CAGR of % over 2026–2032.
The North America market for Through-Hole Electronics Packaging is forecast to increase from US$ million in 2026 to US$ million by 2032, corresponding to a CAGR of % over 2026–2032.
The Europe market for Through-Hole Electronics Packaging is projected to rise from US$ million in 2026 to US$ million by 2032, registering a CAGR of % over 2026–2032.
Read the full market overview
The Asia Pacific market for Through-Hole Electronics Packaging is expected to grow from US$ million in 2026 to US$ million by 2032, at a CAGR of % over 2026–2032.
Leading global manufacturers of Through-Hole Electronics Packaging include , among others. In 2025, the top three vendors together accounted for approximately % of global revenue.
Report Scope
This report quantifies the global Through-Hole Electronics Packaging market in revenue (US$ million) and, where applicable, sales volume (k units), using 2025 as the base year and providing annual historical and forecast data for 2021–2032.
It standardizes definitions of types and applications, harmonizes vendor attribution, and presents comparable time series by company, type, application, and region/country, including indicative price bands (US$/k units) and concentration ratios (CR5/CR10).
The outputs are intended to support strategy development, budgeting, and performance benchmarking for manufacturers, new entrants, channel partners, and investors; the report also reviews technology shifts and notable product introductions relevant to Through-Hole Electronics Packaging.
Key Companies & Market Share Insights
This section profiles leading manufacturers, combining 2021–2025 results with a 2026–2032 outlook. It reports revenue, market share, price bands, product and application mix, regional and channel mix, and key developments (M&A, capacity additions, certifications). It also provides global revenue, average price, and—where applicable—sales volume by manufacturer, and calculates CR5/CR10 and rank changes to support comparative benchmarking.
Through-Hole Electronics Packaging Market by Company
AMETEK, Inc.
Dordan Mfg
Dupont
Osram
The Plastiform Company
Kiva Container
Primex Plastics Corporation.
Quality Foam Packaging Inc
Ameson Packaging
Lithoflex, Inc.
UFP Technologies
Intel Corporation
STMicroelectronics
Advanced Micro Devices, Inc
SAMSUNG
GY Packaging
Taiwan Semiconductor
Through-Hole Electronics Packaging Segment by Type
Plastic
Metal
Glass
Others
Through-Hole Electronics Packaging Segment by Application
Consumer Electronics
Aerospace and Defense
Automotive
Telecommunications
Others
Through-Hole Electronics Packaging Segment by Region
North America
United States
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Spain
Netherlands
Switzerland
Sweden
Poland
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Southeast Asia
South America
Brazil
Argentina
Chile
Middle East & Africa
Egypt
South Africa
Israel
Türkiye
GCC Countries
Key Drivers & Barriers
High-impact rendering factors and drivers have been studied in this report to aid the readers to understand the general development. Moreover, the report includes restraints and challenges that may act as stumbling blocks on the way of the players. This will assist the users to be attentive and make informed decisions related to business. Specialists have also laid their focus on the upcoming business prospects.
Reasons to Buy This Report
1. This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global Through-Hole Electronics Packaging market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.
2. This report will help stakeholders to understand the global industry status and trends of Through-Hole Electronics Packaging and provides them with information on key market drivers, restraints, challenges, and opportunities.
3. This report will help stakeholders to understand competitors better and gain more insights to strengthen their position in their businesses. The competitive landscape section includes the market share and rank (in volume and value), competitor ecosystem, new product development, expansion, and acquisition.
4. This report stays updated with novel technology integration, features, and the latest developments in the market
5. This report helps stakeholders to gain insights into which regions to target globally
6. This report helps stakeholders to gain insights into the end-user perception concerning the adoption of Through-Hole Electronics Packaging.
7. This report helps stakeholders to identify some of the key players in the market and understand their valuable contribution.
Chapter Outline
Chapter 1: Research objectives, research methods, data sources, data cross-validation;
Chapter 2: Introduces the report scope of the report, executive summary of different market segments (by region, product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 3: Detailed analysis of Through-Hole Electronics Packaging manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 5: Production/output, value of Through-Hole Electronics Packaging by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 6: Consumption of Through-Hole Electronics Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 7: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 8: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 9: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 10: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 11: The main points and conclusions of the report.
More report detail
Tables and figures
Scope & coverage.
Types
- Plastic
- Metal
- Glass
- Others
Applications
- Consumer Electronics
- Aerospace and Defense
- Automotive
- Telecommunications
- Others
Companies covered
- AMETEK, Inc.
- Dordan Mfg
- Dupont
- Osram
- The Plastiform Company
- Kiva Container
- Primex Plastics Corporation.
- Quality Foam Packaging Inc
- Ameson Packaging
- Lithoflex, Inc.
- UFP Technologies
- Intel Corporation
- STMicroelectronics
- Advanced Micro Devices, Inc
- SAMSUNG
- GY Packaging
- Taiwan Semiconductor
Inside the report.
1 Preface
- 1.1 Scope of Report
- 1.2 Reasons for Doing This Study
- 1.3 Research Methodology
- 1.4 Research Process
- 1.5 Data Source
- 1.5.1 Secondary Sources
- 1.5.2 Primary Sources
2 Market Overview
- 2.1 Product Definition
- 2.2 Through-Hole Electronics Packaging by Type
- 2.2.1 Market Value Comparison by Type (2021 VS 2025 VS 2032) & (US$ Million)
- 2.2.2 Plastic
- 2.2.3 Metal
- 2.2.4 Glass
- 2.2.5 Others
- 2.3 Through-Hole Electronics Packaging by Application
- 2.3.1 Market Value Comparison by Application (2021 VS 2025 VS 2032) & (US$ Million)
- 2.3.2 Consumer Electronics
- 2.3.3 Aerospace and Defense
- 2.3.4 Automotive
- 2.3.5 Telecommunications
- 2.3.6 Others
- 2.4 Global Market Growth Prospects
- 2.4.1 Global Through-Hole Electronics Packaging Production Value Estimates and Forecasts (2021-2032)
- 2.4.2 Global Through-Hole Electronics Packaging Production Capacity Estimates and Forecasts (2021-2032)
- 2.4.3 Global Through-Hole Electronics Packaging Production Estimates and Forecasts (2021-2032)
- 2.4.4 Global Through-Hole Electronics Packaging Market Average Price (2021-2032)
3 Market Competitive Landscape by Manufacturers
- 3.1 Global Through-Hole Electronics Packaging Production by Manufacturers (2021-2026)
- 3.2 Global Through-Hole Electronics Packaging Production Value by Manufacturers (2021-2026)
- 3.3 Global Through-Hole Electronics Packaging Average Price by Manufacturers (2021-2026)
- 3.4 Global Through-Hole Electronics Packaging Industry Manufacturers Ranking, 2024 VS 2025 VS 2026
- 3.5 Global Through-Hole Electronics Packaging Key Manufacturers, Manufacturing Sites & Headquarters
- 3.6 Global Through-Hole Electronics Packaging Manufacturers, Product Type & Application
- 3.7 Global Through-Hole Electronics Packaging Manufacturers Established Date
- 3.8 Global Through-Hole Electronics Packaging Market CR5 and HHI
- 3.9 Global Manufacturers Mergers & Acquisition
4 Manufacturers Profiled
- 4.1 AMETEK, Inc.
- 4.1.1 AMETEK, Inc. Through-Hole Electronics Packaging Company Information
- 4.1.2 AMETEK, Inc. Through-Hole Electronics Packaging Business Overview
- 4.1.3 AMETEK, Inc. Through-Hole Electronics Packaging Production, Value and Gross Margin (2021-2026)
- 4.1.4 AMETEK, Inc. Product Portfolio
- 4.1.5 AMETEK, Inc. Recent Developments
- 4.2 Dordan Mfg
- 4.2.1 Dordan Mfg Through-Hole Electronics Packaging Company Information
- 4.2.2 Dordan Mfg Through-Hole Electronics Packaging Business Overview
- 4.2.3 Dordan Mfg Through-Hole Electronics Packaging Production, Value and Gross Margin (2021-2026)
- 4.2.4 Dordan Mfg Product Portfolio
- 4.2.5 Dordan Mfg Recent Developments
- 4.3 Dupont
- 4.3.1 Dupont Through-Hole Electronics Packaging Company Information
- 4.3.2 Dupont Through-Hole Electronics Packaging Business Overview
- 4.3.3 Dupont Through-Hole Electronics Packaging Production, Value and Gross Margin (2021-2026)
- 4.3.4 Dupont Product Portfolio
- 4.3.5 Dupont Recent Developments
- 4.4 Osram
- 4.4.1 Osram Through-Hole Electronics Packaging Company Information
- 4.4.2 Osram Through-Hole Electronics Packaging Business Overview
- 4.4.3 Osram Through-Hole Electronics Packaging Production, Value and Gross Margin (2021-2026)
- 4.4.4 Osram Product Portfolio
- 4.4.5 Osram Recent Developments
- 4.5 The Plastiform Company
- 4.5.1 The Plastiform Company Through-Hole Electronics Packaging Company Information
- 4.5.2 The Plastiform Company Through-Hole Electronics Packaging Business Overview
- 4.5.3 The Plastiform Company Through-Hole Electronics Packaging Production, Value and Gross Margin (2021-2026)
- 4.5.4 The Plastiform Company Product Portfolio
- 4.5.5 The Plastiform Company Recent Developments
- 4.6 Kiva Container
- 4.6.1 Kiva Container Through-Hole Electronics Packaging Company Information
- 4.6.2 Kiva Container Through-Hole Electronics Packaging Business Overview
- 4.6.3 Kiva Container Through-Hole Electronics Packaging Production, Value and Gross Margin (2021-2026)
- 4.6.4 Kiva Container Product Portfolio
- 4.6.5 Kiva Container Recent Developments
- 4.7 Primex Plastics Corporation.
- 4.7.1 Primex Plastics Corporation. Through-Hole Electronics Packaging Company Information
- 4.7.2 Primex Plastics Corporation. Through-Hole Electronics Packaging Business Overview
- 4.7.3 Primex Plastics Corporation. Through-Hole Electronics Packaging Production, Value and Gross Margin (2021-2026)
- 4.7.4 Primex Plastics Corporation. Product Portfolio
- 4.7.5 Primex Plastics Corporation. Recent Developments
- 4.8 Quality Foam Packaging Inc
- 4.8.1 Quality Foam Packaging Inc Through-Hole Electronics Packaging Company Information
- 4.8.2 Quality Foam Packaging Inc Through-Hole Electronics Packaging Business Overview
- 4.8.3 Quality Foam Packaging Inc Through-Hole Electronics Packaging Production, Value and Gross Margin (2021-2026)
- 4.8.4 Quality Foam Packaging Inc Product Portfolio
- 4.8.5 Quality Foam Packaging Inc Recent Developments
- 4.9 Ameson Packaging
- 4.9.1 Ameson Packaging Through-Hole Electronics Packaging Company Information
- 4.9.2 Ameson Packaging Through-Hole Electronics Packaging Business Overview
- 4.9.3 Ameson Packaging Through-Hole Electronics Packaging Production, Value and Gross Margin (2021-2026)
- 4.9.4 Ameson Packaging Product Portfolio
- 4.9.5 Ameson Packaging Recent Developments
- 4.10 Lithoflex, Inc.
- 4.10.1 Lithoflex, Inc. Through-Hole Electronics Packaging Company Information
- 4.10.2 Lithoflex, Inc. Through-Hole Electronics Packaging Business Overview
- 4.10.3 Lithoflex, Inc. Through-Hole Electronics Packaging Production, Value and Gross Margin (2021-2026)
- 4.10.4 Lithoflex, Inc. Product Portfolio
- 4.10.5 Lithoflex, Inc. Recent Developments
- 4.11 UFP Technologies
- 4.11.1 UFP Technologies Through-Hole Electronics Packaging Company Information
- 4.11.2 UFP Technologies Through-Hole Electronics Packaging Business Overview
- 4.11.3 UFP Technologies Through-Hole Electronics Packaging Production, Value and Gross Margin (2021-2026)
- 4.11.4 UFP Technologies Product Portfolio
- 4.11.5 UFP Technologies Recent Developments
- 4.12 Intel Corporation
- 4.12.1 Intel Corporation Through-Hole Electronics Packaging Company Information
- 4.12.2 Intel Corporation Through-Hole Electronics Packaging Business Overview
- 4.12.3 Intel Corporation Through-Hole Electronics Packaging Production, Value and Gross Margin (2021-2026)
- 4.12.4 Intel Corporation Product Portfolio
- 4.12.5 Intel Corporation Recent Developments
- 4.13 STMicroelectronics
- 4.13.1 STMicroelectronics Through-Hole Electronics Packaging Company Information
- 4.13.2 STMicroelectronics Through-Hole Electronics Packaging Business Overview
- 4.13.3 STMicroelectronics Through-Hole Electronics Packaging Production, Value and Gross Margin (2021-2026)
- 4.13.4 STMicroelectronics Product Portfolio
- 4.13.5 STMicroelectronics Recent Developments
- 4.14 Advanced Micro Devices, Inc
- 4.14.1 Advanced Micro Devices, Inc Through-Hole Electronics Packaging Company Information
- 4.14.2 Advanced Micro Devices, Inc Through-Hole Electronics Packaging Business Overview
- 4.14.3 Advanced Micro Devices, Inc Through-Hole Electronics Packaging Production, Value and Gross Margin (2021-2026)
- 4.14.4 Advanced Micro Devices, Inc Product Portfolio
- 4.14.5 Advanced Micro Devices, Inc Recent Developments
- 4.15 SAMSUNG
- 4.15.1 SAMSUNG Through-Hole Electronics Packaging Company Information
- 4.15.2 SAMSUNG Through-Hole Electronics Packaging Business Overview
- 4.15.3 SAMSUNG Through-Hole Electronics Packaging Production, Value and Gross Margin (2021-2026)
- 4.15.4 SAMSUNG Product Portfolio
- 4.15.5 SAMSUNG Recent Developments
- 4.16 GY Packaging
- 4.16.1 GY Packaging Through-Hole Electronics Packaging Company Information
- 4.16.2 GY Packaging Through-Hole Electronics Packaging Business Overview
- 4.16.3 GY Packaging Through-Hole Electronics Packaging Production, Value and Gross Margin (2021-2026)
- 4.16.4 GY Packaging Product Portfolio
- 4.16.5 GY Packaging Recent Developments
- 4.17 Taiwan Semiconductor
- 4.17.1 Taiwan Semiconductor Through-Hole Electronics Packaging Company Information
- 4.17.2 Taiwan Semiconductor Through-Hole Electronics Packaging Business Overview
- 4.17.3 Taiwan Semiconductor Through-Hole Electronics Packaging Production, Value and Gross Margin (2021-2026)
- 4.17.4 Taiwan Semiconductor Product Portfolio
- 4.17.5 Taiwan Semiconductor Recent Developments
5 Global Through-Hole Electronics Packaging Production by Region
- 5.1 Global Through-Hole Electronics Packaging Production Estimates and Forecasts by Region: 2021 VS 2025 VS 2032
- 5.2 Global Through-Hole Electronics Packaging Production by Region: 2021-2032
- 5.2.1 Global Through-Hole Electronics Packaging Production by Region: 2021-2026
- 5.2.2 Global Through-Hole Electronics Packaging Production Forecast by Region (2027-2032)
- 5.3 Global Through-Hole Electronics Packaging Production Value Estimates and Forecasts by Region: 2021 VS 2025 VS 2032
- 5.4 Global Through-Hole Electronics Packaging Production Value by Region: 2021-2032
- 5.4.1 Global Through-Hole Electronics Packaging Production Value by Region: 2021-2026
- 5.4.2 Global Through-Hole Electronics Packaging Production Value Forecast by Region (2027-2032)
- 5.5 Global Through-Hole Electronics Packaging Market Price Analysis by Region (2021-2026)
- 5.6 Global Through-Hole Electronics Packaging Production and Value, YOY Growth
- 5.6.1 North America Through-Hole Electronics Packaging Production Value Estimates and Forecasts (2021-2032)
- 5.6.2 Europe Through-Hole Electronics Packaging Production Value Estimates and Forecasts (2021-2032)
- 5.6.3 China Through-Hole Electronics Packaging Production Value Estimates and Forecasts (2021-2032)
- 5.6.4 Japan Through-Hole Electronics Packaging Production Value Estimates and Forecasts (2021-2032)
- 5.6.5 South Korea Through-Hole Electronics Packaging Production Value Estimates and Forecasts (2021-2032)
6 Global Through-Hole Electronics Packaging Consumption by Region
- 6.1 Global Through-Hole Electronics Packaging Consumption Estimates and Forecasts by Region: 2021 VS 2025 VS 2032
- 6.2 Global Through-Hole Electronics Packaging Consumption by Region (2021-2032)
- 6.2.1 Global Through-Hole Electronics Packaging Consumption by Region: 2021-2026
- 6.2.2 Global Through-Hole Electronics Packaging Forecasted Consumption by Region (2027-2032)
- 6.3 North America
- 6.3.1 North America Through-Hole Electronics Packaging Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 6.3.2 North America Through-Hole Electronics Packaging Consumption by Country (2021-2032)
- 6.3.3 United States
- 6.3.4 Canada
- 6.3.5 Mexico
- 6.4 Europe
- 6.4.1 Europe Through-Hole Electronics Packaging Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 6.4.2 Europe Through-Hole Electronics Packaging Consumption by Country (2021-2032)
- 6.4.3 Germany
- 6.4.4 France
- 6.4.5 U.K.
- 6.4.6 Italy
- 6.4.7 Russia
- 6.4.8 Spain
- 6.4.9 Netherlands
- 6.4.10 Switzerland
- 6.4.11 Sweden
- 6.4.12 Poland
- 6.5 Asia Pacific
- 6.5.1 Asia Pacific Through-Hole Electronics Packaging Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 6.5.2 Asia Pacific Through-Hole Electronics Packaging Consumption by Country (2021-2032)
- 6.5.3 China
- 6.5.4 Japan
- 6.5.5 South Korea
- 6.5.6 India
- 6.5.7 Australia
- 6.5.8 Taiwan
- 6.5.9 Southeast Asia
- 6.6 South America, Middle East & Africa
- 6.6.1 South America, Middle East & Africa Through-Hole Electronics Packaging Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 6.6.2 South America, Middle East & Africa Through-Hole Electronics Packaging Consumption by Country (2021-2032)
- 6.6.3 Brazil
- 6.6.4 Argentina
- 6.6.5 Chile
- 6.6.6 Turkey
- 6.6.7 GCC Countries
7 Segment by Type
- 7.1 Global Through-Hole Electronics Packaging Production by Type (2021-2032)
- 7.1.1 Global Through-Hole Electronics Packaging Production by Type (2021-2032) & (k units)
- 7.1.2 Global Through-Hole Electronics Packaging Production Market Share by Type (2021-2032)
- 7.2 Global Through-Hole Electronics Packaging Production Value by Type (2021-2032)
- 7.2.1 Global Through-Hole Electronics Packaging Production Value by Type (2021-2032) & (US$ Million)
- 7.2.2 Global Through-Hole Electronics Packaging Production Value Market Share by Type (2021-2032)
- 7.3 Global Through-Hole Electronics Packaging Price by Type (2021-2032)
8 Segment by Application
- 8.1 Global Through-Hole Electronics Packaging Production by Application (2021-2032)
- 8.1.1 Global Through-Hole Electronics Packaging Production by Application (2021-2032) & (k units)
- 8.1.2 Global Through-Hole Electronics Packaging Production Market Share by Application (2021-2032)
- 8.2 Global Through-Hole Electronics Packaging Production Value by Application (2021-2032)
- 8.2.1 Global Through-Hole Electronics Packaging Production Value by Application (2021-2032) & (US$ Million)
- 8.2.2 Global Through-Hole Electronics Packaging Production Value Market Share by Application (2021-2032)
- 8.3 Global Through-Hole Electronics Packaging Price by Application (2021-2032)
9 Value Chain and Sales Channels Analysis of the Market
- 9.1 Through-Hole Electronics Packaging Value Chain Analysis
- 9.1.1 Through-Hole Electronics Packaging Key Raw Materials
- 9.1.2 Raw Materials Key Suppliers
- 9.1.3 Through-Hole Electronics Packaging Production Mode & Process
- 9.2 Through-Hole Electronics Packaging Sales Channels Analysis
- 9.2.1 Direct Comparison with Distribution Share
- 9.2.2 Through-Hole Electronics Packaging Distributors
- 9.2.3 Through-Hole Electronics Packaging Customers
10 Global Through-Hole Electronics Packaging Analyzing Market Dynamics
- 10.1 Through-Hole Electronics Packaging Industry Trends
- 10.2 Through-Hole Electronics Packaging Industry Drivers
- 10.3 Through-Hole Electronics Packaging Industry Opportunities and Challenges
- 10.4 Through-Hole Electronics Packaging Industry Restraints
11 Report Conclusion
12 Disclaimer
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