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Industry Research
Through-hole Passive Components Industry Research Report 2026
Market perspective
The global Through-hole Passive Components market was valued at US$ million in 2025 and is projected to reach US$ million by 2032, implying a CAGR of % over 2026–2032.
The North America market for Through-hole Passive Components is forecast to increase from US$ million in 2026 to US$ million by 2032, corresponding to a CAGR of % over 2026–2032.
The Europe market for Through-hole Passive Components is projected to rise from US$ million in 2026 to US$ million by 2032, registering a CAGR of % over 2026–2032.
Read the full market overview
The Asia Pacific market for Through-hole Passive Components is expected to grow from US$ million in 2026 to US$ million by 2032, at a CAGR of % over 2026–2032.
Leading global manufacturers of Through-hole Passive Components include , among others. In 2025, the top three vendors together accounted for approximately % of global revenue.
Report Scope
This report quantifies the global Through-hole Passive Components market in revenue (US$ million) and, where applicable, sales volume (k units), using 2025 as the base year and providing annual historical and forecast data for 2021–2032.
It standardizes definitions of types and applications, harmonizes vendor attribution, and presents comparable time series by company, type, application, and region/country, including indicative price bands (US$/k units) and concentration ratios (CR5/CR10).
The outputs are intended to support strategy development, budgeting, and performance benchmarking for manufacturers, new entrants, channel partners, and investors; the report also reviews technology shifts and notable product introductions relevant to Through-hole Passive Components.
Key Companies & Market Share Insights
This section profiles leading manufacturers, combining 2021–2025 results with a 2026–2032 outlook. It reports revenue, market share, price bands, product and application mix, regional and channel mix, and key developments (M&A, capacity additions, certifications). It also provides global revenue, average price, and—where applicable—sales volume by manufacturer, and calculates CR5/CR10 and rank changes to support comparative benchmarking.
Through-hole Passive Components Market by Company
Bourns, Inc.
KYOCERA AVX Components Corporation
Panasonic Holdings Corporation
Microchip Technology Inc.
Murata Manufacturing Co., Ltd
TDK Corporation
TE Connectivity
Vishay Intertechnology, Inc
YAGEO Group
AVX Corporation
KEMET Corporation
Rubycon Corporation
Nichicon Corporation
Walsin Technology Corporation
Taiyo Yuden Co., Ltd
Samsung Electro-Mechanics
EPCOS AG
Nippon Chemi-Con Corporation
Cornell Dubilier Electronics, Inc
TT Electronics PLC
Through-hole Passive Components Segment by Type
by Axial Leads
by Radial Leads
Through-hole Passive Components Segment by Application
Consumer Electronics
IT & Telecommunication
Automotive
Industrial
Aerospace & Defense
Healthcare
Others
Through-hole Passive Components Segment by Region
North America
United States
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Spain
Netherlands
Switzerland
Sweden
Poland
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Southeast Asia
South America
Brazil
Argentina
Chile
Middle East & Africa
Egypt
South Africa
Israel
Türkiye
GCC Countries
Key Drivers & Barriers
High-impact rendering factors and drivers have been studied in this report to aid the readers to understand the general development. Moreover, the report includes restraints and challenges that may act as stumbling blocks on the way of the players. This will assist the users to be attentive and make informed decisions related to business. Specialists have also laid their focus on the upcoming business prospects.
Reasons to Buy This Report
1. This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global Through-hole Passive Components market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.
2. This report will help stakeholders to understand the global industry status and trends of Through-hole Passive Components and provides them with information on key market drivers, restraints, challenges, and opportunities.
3. This report will help stakeholders to understand competitors better and gain more insights to strengthen their position in their businesses. The competitive landscape section includes the market share and rank (in volume and value), competitor ecosystem, new product development, expansion, and acquisition.
4. This report stays updated with novel technology integration, features, and the latest developments in the market
5. This report helps stakeholders to gain insights into which regions to target globally
6. This report helps stakeholders to gain insights into the end-user perception concerning the adoption of Through-hole Passive Components.
7. This report helps stakeholders to identify some of the key players in the market and understand their valuable contribution.
Chapter Outline
Chapter 1: Research objectives, research methods, data sources, data cross-validation;
Chapter 2: Introduces the report scope of the report, executive summary of different market segments (by region, product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 3: Detailed analysis of Through-hole Passive Components manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 5: Production/output, value of Through-hole Passive Components by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 6: Consumption of Through-hole Passive Components in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 7: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 8: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 9: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 10: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 11: The main points and conclusions of the report.
More report detail
Tables and figures
Scope & coverage.
Applications
- Consumer Electronics
- IT & Telecommunication
- Automotive
- Industrial
- Aerospace & Defense
- Healthcare
- Others
Companies covered
- Bourns, Inc.
- KYOCERA AVX Components Corporation
- Panasonic Holdings Corporation
- Microchip Technology Inc.
- Murata Manufacturing Co., Ltd
- TDK Corporation
- TE Connectivity
- Vishay Intertechnology, Inc
- YAGEO Group
- AVX Corporation
- KEMET Corporation
- Rubycon Corporation
- Nichicon Corporation
- Walsin Technology Corporation
- Taiyo Yuden Co., Ltd
- Samsung Electro-Mechanics
- EPCOS AG
- Nippon Chemi-Con Corporation
- Cornell Dubilier Electronics, Inc
- TT Electronics PLC
Inside the report.
1 Preface
- 1.1 Scope of Report
- 1.2 Reasons for Doing This Study
- 1.3 Research Methodology
- 1.4 Research Process
- 1.5 Data Source
- 1.5.1 Secondary Sources
- 1.5.2 Primary Sources
2 Market Overview
- 2.1 Product Definition
- 2.2 Through-hole Passive Components by Axial Leads
- 2.2.1 Market Value Comparison by Axial Leads (2021 VS 2025 VS 2032) & (US$ Million)
- 2.2.2 by Axial Leads
- 2.2.3 by Radial Leads
- 2.3 Through-hole Passive Components by Application
- 2.3.1 Market Value Comparison by Application (2021 VS 2025 VS 2032) & (US$ Million)
- 2.3.2 Consumer Electronics
- 2.3.3 IT & Telecommunication
- 2.3.4 Automotive
- 2.3.5 Industrial
- 2.3.6 Aerospace & Defense
- 2.3.7 Healthcare
- 2.3.8 Others
- 2.4 Global Market Growth Prospects
- 2.4.1 Global Through-hole Passive Components Production Value Estimates and Forecasts (2021-2032)
- 2.4.2 Global Through-hole Passive Components Production Capacity Estimates and Forecasts (2021-2032)
- 2.4.3 Global Through-hole Passive Components Production Estimates and Forecasts (2021-2032)
- 2.4.4 Global Through-hole Passive Components Market Average Price (2021-2032)
3 Market Competitive Landscape by Manufacturers
- 3.1 Global Through-hole Passive Components Production by Manufacturers (2021-2026)
- 3.2 Global Through-hole Passive Components Production Value by Manufacturers (2021-2026)
- 3.3 Global Through-hole Passive Components Average Price by Manufacturers (2021-2026)
- 3.4 Global Through-hole Passive Components Industry Manufacturers Ranking, 2024 VS 2025 VS 2026
- 3.5 Global Through-hole Passive Components Key Manufacturers, Manufacturing Sites & Headquarters
- 3.6 Global Through-hole Passive Components Manufacturers, Product Type & Application
- 3.7 Global Through-hole Passive Components Manufacturers Established Date
- 3.8 Global Through-hole Passive Components Market CR5 and HHI
- 3.9 Global Manufacturers Mergers & Acquisition
4 Manufacturers Profiled
- 4.1 Bourns, Inc.
- 4.1.1 Bourns, Inc. Through-hole Passive Components Company Information
- 4.1.2 Bourns, Inc. Through-hole Passive Components Business Overview
- 4.1.3 Bourns, Inc. Through-hole Passive Components Production, Value and Gross Margin (2021-2026)
- 4.1.4 Bourns, Inc. Product Portfolio
- 4.1.5 Bourns, Inc. Recent Developments
- 4.2 KYOCERA AVX Components Corporation
- 4.2.1 KYOCERA AVX Components Corporation Through-hole Passive Components Company Information
- 4.2.2 KYOCERA AVX Components Corporation Through-hole Passive Components Business Overview
- 4.2.3 KYOCERA AVX Components Corporation Through-hole Passive Components Production, Value and Gross Margin (2021-2026)
- 4.2.4 KYOCERA AVX Components Corporation Product Portfolio
- 4.2.5 KYOCERA AVX Components Corporation Recent Developments
- 4.3 Panasonic Holdings Corporation
- 4.3.1 Panasonic Holdings Corporation Through-hole Passive Components Company Information
- 4.3.2 Panasonic Holdings Corporation Through-hole Passive Components Business Overview
- 4.3.3 Panasonic Holdings Corporation Through-hole Passive Components Production, Value and Gross Margin (2021-2026)
- 4.3.4 Panasonic Holdings Corporation Product Portfolio
- 4.3.5 Panasonic Holdings Corporation Recent Developments
- 4.4 Microchip Technology Inc.
- 4.4.1 Microchip Technology Inc. Through-hole Passive Components Company Information
- 4.4.2 Microchip Technology Inc. Through-hole Passive Components Business Overview
- 4.4.3 Microchip Technology Inc. Through-hole Passive Components Production, Value and Gross Margin (2021-2026)
- 4.4.4 Microchip Technology Inc. Product Portfolio
- 4.4.5 Microchip Technology Inc. Recent Developments
- 4.5 Murata Manufacturing Co., Ltd
- 4.5.1 Murata Manufacturing Co., Ltd Through-hole Passive Components Company Information
- 4.5.2 Murata Manufacturing Co., Ltd Through-hole Passive Components Business Overview
- 4.5.3 Murata Manufacturing Co., Ltd Through-hole Passive Components Production, Value and Gross Margin (2021-2026)
- 4.5.4 Murata Manufacturing Co., Ltd Product Portfolio
- 4.5.5 Murata Manufacturing Co., Ltd Recent Developments
- 4.6 TDK Corporation
- 4.6.1 TDK Corporation Through-hole Passive Components Company Information
- 4.6.2 TDK Corporation Through-hole Passive Components Business Overview
- 4.6.3 TDK Corporation Through-hole Passive Components Production, Value and Gross Margin (2021-2026)
- 4.6.4 TDK Corporation Product Portfolio
- 4.6.5 TDK Corporation Recent Developments
- 4.7 TE Connectivity
- 4.7.1 TE Connectivity Through-hole Passive Components Company Information
- 4.7.2 TE Connectivity Through-hole Passive Components Business Overview
- 4.7.3 TE Connectivity Through-hole Passive Components Production, Value and Gross Margin (2021-2026)
- 4.7.4 TE Connectivity Product Portfolio
- 4.7.5 TE Connectivity Recent Developments
- 4.8 Vishay Intertechnology, Inc
- 4.8.1 Vishay Intertechnology, Inc Through-hole Passive Components Company Information
- 4.8.2 Vishay Intertechnology, Inc Through-hole Passive Components Business Overview
- 4.8.3 Vishay Intertechnology, Inc Through-hole Passive Components Production, Value and Gross Margin (2021-2026)
- 4.8.4 Vishay Intertechnology, Inc Product Portfolio
- 4.8.5 Vishay Intertechnology, Inc Recent Developments
- 4.9 YAGEO Group
- 4.9.1 YAGEO Group Through-hole Passive Components Company Information
- 4.9.2 YAGEO Group Through-hole Passive Components Business Overview
- 4.9.3 YAGEO Group Through-hole Passive Components Production, Value and Gross Margin (2021-2026)
- 4.9.4 YAGEO Group Product Portfolio
- 4.9.5 YAGEO Group Recent Developments
- 4.10 AVX Corporation
- 4.10.1 AVX Corporation Through-hole Passive Components Company Information
- 4.10.2 AVX Corporation Through-hole Passive Components Business Overview
- 4.10.3 AVX Corporation Through-hole Passive Components Production, Value and Gross Margin (2021-2026)
- 4.10.4 AVX Corporation Product Portfolio
- 4.10.5 AVX Corporation Recent Developments
- 4.11 KEMET Corporation
- 4.11.1 KEMET Corporation Through-hole Passive Components Company Information
- 4.11.2 KEMET Corporation Through-hole Passive Components Business Overview
- 4.11.3 KEMET Corporation Through-hole Passive Components Production, Value and Gross Margin (2021-2026)
- 4.11.4 KEMET Corporation Product Portfolio
- 4.11.5 KEMET Corporation Recent Developments
- 4.12 Rubycon Corporation
- 4.12.1 Rubycon Corporation Through-hole Passive Components Company Information
- 4.12.2 Rubycon Corporation Through-hole Passive Components Business Overview
- 4.12.3 Rubycon Corporation Through-hole Passive Components Production, Value and Gross Margin (2021-2026)
- 4.12.4 Rubycon Corporation Product Portfolio
- 4.12.5 Rubycon Corporation Recent Developments
- 4.13 Nichicon Corporation
- 4.13.1 Nichicon Corporation Through-hole Passive Components Company Information
- 4.13.2 Nichicon Corporation Through-hole Passive Components Business Overview
- 4.13.3 Nichicon Corporation Through-hole Passive Components Production, Value and Gross Margin (2021-2026)
- 4.13.4 Nichicon Corporation Product Portfolio
- 4.13.5 Nichicon Corporation Recent Developments
- 4.14 Walsin Technology Corporation
- 4.14.1 Walsin Technology Corporation Through-hole Passive Components Company Information
- 4.14.2 Walsin Technology Corporation Through-hole Passive Components Business Overview
- 4.14.3 Walsin Technology Corporation Through-hole Passive Components Production, Value and Gross Margin (2021-2026)
- 4.14.4 Walsin Technology Corporation Product Portfolio
- 4.14.5 Walsin Technology Corporation Recent Developments
- 4.15 Taiyo Yuden Co., Ltd
- 4.15.1 Taiyo Yuden Co., Ltd Through-hole Passive Components Company Information
- 4.15.2 Taiyo Yuden Co., Ltd Through-hole Passive Components Business Overview
- 4.15.3 Taiyo Yuden Co., Ltd Through-hole Passive Components Production, Value and Gross Margin (2021-2026)
- 4.15.4 Taiyo Yuden Co., Ltd Product Portfolio
- 4.15.5 Taiyo Yuden Co., Ltd Recent Developments
- 4.16 Samsung Electro-Mechanics
- 4.16.1 Samsung Electro-Mechanics Through-hole Passive Components Company Information
- 4.16.2 Samsung Electro-Mechanics Through-hole Passive Components Business Overview
- 4.16.3 Samsung Electro-Mechanics Through-hole Passive Components Production, Value and Gross Margin (2021-2026)
- 4.16.4 Samsung Electro-Mechanics Product Portfolio
- 4.16.5 Samsung Electro-Mechanics Recent Developments
- 4.17 EPCOS AG
- 4.17.1 EPCOS AG Through-hole Passive Components Company Information
- 4.17.2 EPCOS AG Through-hole Passive Components Business Overview
- 4.17.3 EPCOS AG Through-hole Passive Components Production, Value and Gross Margin (2021-2026)
- 4.17.4 EPCOS AG Product Portfolio
- 4.17.5 EPCOS AG Recent Developments
- 4.18 Nippon Chemi-Con Corporation
- 4.18.1 Nippon Chemi-Con Corporation Through-hole Passive Components Company Information
- 4.18.2 Nippon Chemi-Con Corporation Through-hole Passive Components Business Overview
- 4.18.3 Nippon Chemi-Con Corporation Through-hole Passive Components Production, Value and Gross Margin (2021-2026)
- 4.18.4 Nippon Chemi-Con Corporation Product Portfolio
- 4.18.5 Nippon Chemi-Con Corporation Recent Developments
- 4.19 Cornell Dubilier Electronics, Inc
- 4.19.1 Cornell Dubilier Electronics, Inc Through-hole Passive Components Company Information
- 4.19.2 Cornell Dubilier Electronics, Inc Through-hole Passive Components Business Overview
- 4.19.3 Cornell Dubilier Electronics, Inc Through-hole Passive Components Production, Value and Gross Margin (2021-2026)
- 4.19.4 Cornell Dubilier Electronics, Inc Product Portfolio
- 4.19.5 Cornell Dubilier Electronics, Inc Recent Developments
- 4.20 TT Electronics PLC
- 4.20.1 TT Electronics PLC Through-hole Passive Components Company Information
- 4.20.2 TT Electronics PLC Through-hole Passive Components Business Overview
- 4.20.3 TT Electronics PLC Through-hole Passive Components Production, Value and Gross Margin (2021-2026)
- 4.20.4 TT Electronics PLC Product Portfolio
- 4.20.5 TT Electronics PLC Recent Developments
5 Global Through-hole Passive Components Production by Region
- 5.1 Global Through-hole Passive Components Production Estimates and Forecasts by Region: 2021 VS 2025 VS 2032
- 5.2 Global Through-hole Passive Components Production by Region: 2021-2032
- 5.2.1 Global Through-hole Passive Components Production by Region: 2021-2026
- 5.2.2 Global Through-hole Passive Components Production Forecast by Region (2027-2032)
- 5.3 Global Through-hole Passive Components Production Value Estimates and Forecasts by Region: 2021 VS 2025 VS 2032
- 5.4 Global Through-hole Passive Components Production Value by Region: 2021-2032
- 5.4.1 Global Through-hole Passive Components Production Value by Region: 2021-2026
- 5.4.2 Global Through-hole Passive Components Production Value Forecast by Region (2027-2032)
- 5.5 Global Through-hole Passive Components Market Price Analysis by Region (2021-2026)
- 5.6 Global Through-hole Passive Components Production and Value, YOY Growth
- 5.6.1 North America Through-hole Passive Components Production Value Estimates and Forecasts (2021-2032)
- 5.6.2 Europe Through-hole Passive Components Production Value Estimates and Forecasts (2021-2032)
- 5.6.3 China Through-hole Passive Components Production Value Estimates and Forecasts (2021-2032)
- 5.6.4 Japan Through-hole Passive Components Production Value Estimates and Forecasts (2021-2032)
- 5.6.5 South Korea Through-hole Passive Components Production Value Estimates and Forecasts (2021-2032)
6 Global Through-hole Passive Components Consumption by Region
- 6.1 Global Through-hole Passive Components Consumption Estimates and Forecasts by Region: 2021 VS 2025 VS 2032
- 6.2 Global Through-hole Passive Components Consumption by Region (2021-2032)
- 6.2.1 Global Through-hole Passive Components Consumption by Region: 2021-2026
- 6.2.2 Global Through-hole Passive Components Forecasted Consumption by Region (2027-2032)
- 6.3 North America
- 6.3.1 North America Through-hole Passive Components Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 6.3.2 North America Through-hole Passive Components Consumption by Country (2021-2032)
- 6.3.3 United States
- 6.3.4 Canada
- 6.3.5 Mexico
- 6.4 Europe
- 6.4.1 Europe Through-hole Passive Components Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 6.4.2 Europe Through-hole Passive Components Consumption by Country (2021-2032)
- 6.4.3 Germany
- 6.4.4 France
- 6.4.5 U.K.
- 6.4.6 Italy
- 6.4.7 Russia
- 6.4.8 Spain
- 6.4.9 Netherlands
- 6.4.10 Switzerland
- 6.4.11 Sweden
- 6.4.12 Poland
- 6.5 Asia Pacific
- 6.5.1 Asia Pacific Through-hole Passive Components Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 6.5.2 Asia Pacific Through-hole Passive Components Consumption by Country (2021-2032)
- 6.5.3 China
- 6.5.4 Japan
- 6.5.5 South Korea
- 6.5.6 India
- 6.5.7 Australia
- 6.5.8 Taiwan
- 6.5.9 Southeast Asia
- 6.6 South America, Middle East & Africa
- 6.6.1 South America, Middle East & Africa Through-hole Passive Components Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 6.6.2 South America, Middle East & Africa Through-hole Passive Components Consumption by Country (2021-2032)
- 6.6.3 Brazil
- 6.6.4 Argentina
- 6.6.5 Chile
- 6.6.6 Turkey
- 6.6.7 GCC Countries
7 Segment by Type
- 7.1 Global Through-hole Passive Components Production by Type (2021-2032)
- 7.1.1 Global Through-hole Passive Components Production by Type (2021-2032) & (k units)
- 7.1.2 Global Through-hole Passive Components Production Market Share by Type (2021-2032)
- 7.2 Global Through-hole Passive Components Production Value by Type (2021-2032)
- 7.2.1 Global Through-hole Passive Components Production Value by Type (2021-2032) & (US$ Million)
- 7.2.2 Global Through-hole Passive Components Production Value Market Share by Type (2021-2032)
- 7.3 Global Through-hole Passive Components Price by Type (2021-2032)
8 Segment by Application
- 8.1 Global Through-hole Passive Components Production by Application (2021-2032)
- 8.1.1 Global Through-hole Passive Components Production by Application (2021-2032) & (k units)
- 8.1.2 Global Through-hole Passive Components Production Market Share by Application (2021-2032)
- 8.2 Global Through-hole Passive Components Production Value by Application (2021-2032)
- 8.2.1 Global Through-hole Passive Components Production Value by Application (2021-2032) & (US$ Million)
- 8.2.2 Global Through-hole Passive Components Production Value Market Share by Application (2021-2032)
- 8.3 Global Through-hole Passive Components Price by Application (2021-2032)
9 Value Chain and Sales Channels Analysis of the Market
- 9.1 Through-hole Passive Components Value Chain Analysis
- 9.1.1 Through-hole Passive Components Key Raw Materials
- 9.1.2 Raw Materials Key Suppliers
- 9.1.3 Through-hole Passive Components Production Mode & Process
- 9.2 Through-hole Passive Components Sales Channels Analysis
- 9.2.1 Direct Comparison with Distribution Share
- 9.2.2 Through-hole Passive Components Distributors
- 9.2.3 Through-hole Passive Components Customers
10 Global Through-hole Passive Components Analyzing Market Dynamics
- 10.1 Through-hole Passive Components Industry Trends
- 10.2 Through-hole Passive Components Industry Drivers
- 10.3 Through-hole Passive Components Industry Opportunities and Challenges
- 10.4 Through-hole Passive Components Industry Restraints
11 Report Conclusion
12 Disclaimer
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