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Industry Research
Cu Pilliar Bump Industry Research Report 2026
Market perspective
The global Cu Pilliar Bump market was valued at US$ million in 2025 and is projected to reach US$ million by 2032, implying a CAGR of % over 2026–2032.
The North America market for Cu Pilliar Bump is forecast to increase from US$ million in 2026 to US$ million by 2032, corresponding to a CAGR of % over 2026–2032.
The Europe market for Cu Pilliar Bump is projected to rise from US$ million in 2026 to US$ million by 2032, registering a CAGR of % over 2026–2032.
Read the full market overview
The Asia Pacific market for Cu Pilliar Bump is expected to grow from US$ million in 2026 to US$ million by 2032, at a CAGR of % over 2026–2032.
Leading global manufacturers of Cu Pilliar Bump include , among others. In 2025, the top three vendors together accounted for approximately % of global revenue.
Report Scope
This report quantifies the global Cu Pilliar Bump market in revenue (US$ million) and, where applicable, sales volume (k pcs), using 2025 as the base year and providing annual historical and forecast data for 2021–2032.
It standardizes definitions of types and applications, harmonizes vendor attribution, and presents comparable time series by company, type, application, and region/country, including indicative price bands (US$/k pcs) and concentration ratios (CR5/CR10).
The outputs are intended to support strategy development, budgeting, and performance benchmarking for manufacturers, new entrants, channel partners, and investors; the report also reviews technology shifts and notable product introductions relevant to Cu Pilliar Bump.
Key Companies & Market Share Insights
This section profiles leading manufacturers, combining 2021–2025 results with a 2026–2032 outlook. It reports revenue, market share, price bands, product and application mix, regional and channel mix, and key developments (M&A, capacity additions, certifications). It also provides global revenue, average price, and—where applicable—sales volume by manufacturer, and calculates CR5/CR10 and rank changes to support comparative benchmarking.
Cu Pilliar Bump Market by Company
ASE (SPIL)
Amkor Technology
TSMC
JCET
Intel
Samsung
SJSemi
HT-tech
Powertech Technology Inc. (PTI)
Tongfu Microelectronics (TFME)
Nepes
LB Semicon Inc
SFA Semicon
International Micro Industries, Inc. (IMI)
Raytek Semiconductor
Winstek Semiconductor
Hana Micron
ChipMOS TECHNOLOGIES
Chipbond Technology Corporation
Hefei Chipmore Technology
Ningbo ChipEx Semiconductor Co., Ltd
UTAC
Cu Pilliar Bump Segment by Type
Cu Bar Type
Standard Cu Pillar
Fine pitch Cu Pillar
Micro-bumps
Others
Cu Pilliar Bump Segment by Application
12 Inches (300 mm)
8 Inches (200 mm)
Others
Cu Pilliar Bump Segment by Region
North America
United States
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Spain
Netherlands
Switzerland
Sweden
Poland
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Southeast Asia
South America
Brazil
Argentina
Chile
Middle East & Africa
Egypt
South Africa
Israel
Türkiye
GCC Countries
Key Drivers & Barriers
High-impact rendering factors and drivers have been studied in this report to aid the readers to understand the general development. Moreover, the report includes restraints and challenges that may act as stumbling blocks on the way of the players. This will assist the users to be attentive and make informed decisions related to business. Specialists have also laid their focus on the upcoming business prospects.
Reasons to Buy This Report
1. This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global Cu Pilliar Bump market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.
2. This report will help stakeholders to understand the global industry status and trends of Cu Pilliar Bump and provides them with information on key market drivers, restraints, challenges, and opportunities.
3. This report will help stakeholders to understand competitors better and gain more insights to strengthen their position in their businesses. The competitive landscape section includes the market share and rank (in volume and value), competitor ecosystem, new product development, expansion, and acquisition.
4. This report stays updated with novel technology integration, features, and the latest developments in the market
5. This report helps stakeholders to gain insights into which regions to target globally
6. This report helps stakeholders to gain insights into the end-user perception concerning the adoption of Cu Pilliar Bump.
7. This report helps stakeholders to identify some of the key players in the market and understand their valuable contribution.
Chapter Outline
Chapter 1: Research objectives, research methods, data sources, data cross-validation;
Chapter 2: Introduces the report scope of the report, executive summary of different market segments (by region, product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 3: Detailed analysis of Cu Pilliar Bump manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 5: Production/output, value of Cu Pilliar Bump by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 6: Consumption of Cu Pilliar Bump in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 7: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 8: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 9: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 10: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 11: The main points and conclusions of the report.
More report detail
Tables and figures
Scope & coverage.
Types
- Cu Bar Type
- Standard Cu Pillar
- Fine pitch Cu Pillar
- Micro-bumps
- Others
Applications
- 12 Inches (300 mm)
- 8 Inches (200 mm)
- Others
Companies covered
- ASE (SPIL)
- Amkor Technology
- TSMC
- JCET
- Intel
- Samsung
- SJSemi
- HT-tech
- Powertech Technology Inc. (PTI)
- Tongfu Microelectronics (TFME)
- Nepes
- LB Semicon Inc
- SFA Semicon
- International Micro Industries, Inc. (IMI)
- Raytek Semiconductor
- Winstek Semiconductor
- Hana Micron
- ChipMOS TECHNOLOGIES
- Chipbond Technology Corporation
- Hefei Chipmore Technology
- Ningbo ChipEx Semiconductor Co., Ltd
- UTAC
Inside the report.
1 Preface
- 1.1 Scope of Report
- 1.2 Reasons for Doing This Study
- 1.3 Research Methodology
- 1.4 Research Process
- 1.5 Data Source
- 1.5.1 Secondary Sources
- 1.5.2 Primary Sources
2 Market Overview
- 2.1 Product Definition
- 2.2 Cu Pilliar Bump by Type
- 2.2.1 Market Value Comparison by Type (2021 VS 2025 VS 2032) & (US$ Million)
- 2.2.2 Cu Bar Type
- 2.2.3 Standard Cu Pillar
- 2.2.4 Fine pitch Cu Pillar
- 2.2.5 Micro-bumps
- 2.2.6 Others
- 2.3 Cu Pilliar Bump by Application
- 2.3.1 Market Value Comparison by Application (2021 VS 2025 VS 2032) & (US$ Million)
- 2.3.2 12 Inches (300 mm)
- 2.3.3 8 Inches (200 mm)
- 2.3.4 Others
- 2.4 Global Market Growth Prospects
- 2.4.1 Global Cu Pilliar Bump Production Value Estimates and Forecasts (2021-2032)
- 2.4.2 Global Cu Pilliar Bump Production Capacity Estimates and Forecasts (2021-2032)
- 2.4.3 Global Cu Pilliar Bump Production Estimates and Forecasts (2021-2032)
- 2.4.4 Global Cu Pilliar Bump Market Average Price (2021-2032)
3 Market Competitive Landscape by Manufacturers
- 3.1 Global Cu Pilliar Bump Production by Manufacturers (2021-2026)
- 3.2 Global Cu Pilliar Bump Production Value by Manufacturers (2021-2026)
- 3.3 Global Cu Pilliar Bump Average Price by Manufacturers (2021-2026)
- 3.4 Global Cu Pilliar Bump Industry Manufacturers Ranking, 2024 VS 2025 VS 2026
- 3.5 Global Cu Pilliar Bump Key Manufacturers, Manufacturing Sites & Headquarters
- 3.6 Global Cu Pilliar Bump Manufacturers, Product Type & Application
- 3.7 Global Cu Pilliar Bump Manufacturers Established Date
- 3.8 Global Cu Pilliar Bump Market CR5 and HHI
- 3.9 Global Manufacturers Mergers & Acquisition
4 Manufacturers Profiled
- 4.1 ASE (SPIL)
- 4.1.1 ASE (SPIL) Cu Pilliar Bump Company Information
- 4.1.2 ASE (SPIL) Cu Pilliar Bump Business Overview
- 4.1.3 ASE (SPIL) Cu Pilliar Bump Production, Value and Gross Margin (2021-2026)
- 4.1.4 ASE (SPIL) Product Portfolio
- 4.1.5 ASE (SPIL) Recent Developments
- 4.2 Amkor Technology
- 4.2.1 Amkor Technology Cu Pilliar Bump Company Information
- 4.2.2 Amkor Technology Cu Pilliar Bump Business Overview
- 4.2.3 Amkor Technology Cu Pilliar Bump Production, Value and Gross Margin (2021-2026)
- 4.2.4 Amkor Technology Product Portfolio
- 4.2.5 Amkor Technology Recent Developments
- 4.3 TSMC
- 4.3.1 TSMC Cu Pilliar Bump Company Information
- 4.3.2 TSMC Cu Pilliar Bump Business Overview
- 4.3.3 TSMC Cu Pilliar Bump Production, Value and Gross Margin (2021-2026)
- 4.3.4 TSMC Product Portfolio
- 4.3.5 TSMC Recent Developments
- 4.4 JCET
- 4.4.1 JCET Cu Pilliar Bump Company Information
- 4.4.2 JCET Cu Pilliar Bump Business Overview
- 4.4.3 JCET Cu Pilliar Bump Production, Value and Gross Margin (2021-2026)
- 4.4.4 JCET Product Portfolio
- 4.4.5 JCET Recent Developments
- 4.5 Intel
- 4.5.1 Intel Cu Pilliar Bump Company Information
- 4.5.2 Intel Cu Pilliar Bump Business Overview
- 4.5.3 Intel Cu Pilliar Bump Production, Value and Gross Margin (2021-2026)
- 4.5.4 Intel Product Portfolio
- 4.5.5 Intel Recent Developments
- 4.6 Samsung
- 4.6.1 Samsung Cu Pilliar Bump Company Information
- 4.6.2 Samsung Cu Pilliar Bump Business Overview
- 4.6.3 Samsung Cu Pilliar Bump Production, Value and Gross Margin (2021-2026)
- 4.6.4 Samsung Product Portfolio
- 4.6.5 Samsung Recent Developments
- 4.7 SJSemi
- 4.7.1 SJSemi Cu Pilliar Bump Company Information
- 4.7.2 SJSemi Cu Pilliar Bump Business Overview
- 4.7.3 SJSemi Cu Pilliar Bump Production, Value and Gross Margin (2021-2026)
- 4.7.4 SJSemi Product Portfolio
- 4.7.5 SJSemi Recent Developments
- 4.8 HT-tech
- 4.8.1 HT-tech Cu Pilliar Bump Company Information
- 4.8.2 HT-tech Cu Pilliar Bump Business Overview
- 4.8.3 HT-tech Cu Pilliar Bump Production, Value and Gross Margin (2021-2026)
- 4.8.4 HT-tech Product Portfolio
- 4.8.5 HT-tech Recent Developments
- 4.9 Powertech Technology Inc. (PTI)
- 4.9.1 Powertech Technology Inc. (PTI) Cu Pilliar Bump Company Information
- 4.9.2 Powertech Technology Inc. (PTI) Cu Pilliar Bump Business Overview
- 4.9.3 Powertech Technology Inc. (PTI) Cu Pilliar Bump Production, Value and Gross Margin (2021-2026)
- 4.9.4 Powertech Technology Inc. (PTI) Product Portfolio
- 4.9.5 Powertech Technology Inc. (PTI) Recent Developments
- 4.10 Tongfu Microelectronics (TFME)
- 4.10.1 Tongfu Microelectronics (TFME) Cu Pilliar Bump Company Information
- 4.10.2 Tongfu Microelectronics (TFME) Cu Pilliar Bump Business Overview
- 4.10.3 Tongfu Microelectronics (TFME) Cu Pilliar Bump Production, Value and Gross Margin (2021-2026)
- 4.10.4 Tongfu Microelectronics (TFME) Product Portfolio
- 4.10.5 Tongfu Microelectronics (TFME) Recent Developments
- 4.11 Nepes
- 4.11.1 Nepes Cu Pilliar Bump Company Information
- 4.11.2 Nepes Cu Pilliar Bump Business Overview
- 4.11.3 Nepes Cu Pilliar Bump Production, Value and Gross Margin (2021-2026)
- 4.11.4 Nepes Product Portfolio
- 4.11.5 Nepes Recent Developments
- 4.12 LB Semicon Inc
- 4.12.1 LB Semicon Inc Cu Pilliar Bump Company Information
- 4.12.2 LB Semicon Inc Cu Pilliar Bump Business Overview
- 4.12.3 LB Semicon Inc Cu Pilliar Bump Production, Value and Gross Margin (2021-2026)
- 4.12.4 LB Semicon Inc Product Portfolio
- 4.12.5 LB Semicon Inc Recent Developments
- 4.13 SFA Semicon
- 4.13.1 SFA Semicon Cu Pilliar Bump Company Information
- 4.13.2 SFA Semicon Cu Pilliar Bump Business Overview
- 4.13.3 SFA Semicon Cu Pilliar Bump Production, Value and Gross Margin (2021-2026)
- 4.13.4 SFA Semicon Product Portfolio
- 4.13.5 SFA Semicon Recent Developments
- 4.14 International Micro Industries, Inc. (IMI)
- 4.14.1 International Micro Industries, Inc. (IMI) Cu Pilliar Bump Company Information
- 4.14.2 International Micro Industries, Inc. (IMI) Cu Pilliar Bump Business Overview
- 4.14.3 International Micro Industries, Inc. (IMI) Cu Pilliar Bump Production, Value and Gross Margin (2021-2026)
- 4.14.4 International Micro Industries, Inc. (IMI) Product Portfolio
- 4.14.5 International Micro Industries, Inc. (IMI) Recent Developments
- 4.15 Raytek Semiconductor
- 4.15.1 Raytek Semiconductor Cu Pilliar Bump Company Information
- 4.15.2 Raytek Semiconductor Cu Pilliar Bump Business Overview
- 4.15.3 Raytek Semiconductor Cu Pilliar Bump Production, Value and Gross Margin (2021-2026)
- 4.15.4 Raytek Semiconductor Product Portfolio
- 4.15.5 Raytek Semiconductor Recent Developments
- 4.16 Winstek Semiconductor
- 4.16.1 Winstek Semiconductor Cu Pilliar Bump Company Information
- 4.16.2 Winstek Semiconductor Cu Pilliar Bump Business Overview
- 4.16.3 Winstek Semiconductor Cu Pilliar Bump Production, Value and Gross Margin (2021-2026)
- 4.16.4 Winstek Semiconductor Product Portfolio
- 4.16.5 Winstek Semiconductor Recent Developments
- 4.17 Hana Micron
- 4.17.1 Hana Micron Cu Pilliar Bump Company Information
- 4.17.2 Hana Micron Cu Pilliar Bump Business Overview
- 4.17.3 Hana Micron Cu Pilliar Bump Production, Value and Gross Margin (2021-2026)
- 4.17.4 Hana Micron Product Portfolio
- 4.17.5 Hana Micron Recent Developments
- 4.18 ChipMOS TECHNOLOGIES
- 4.18.1 ChipMOS TECHNOLOGIES Cu Pilliar Bump Company Information
- 4.18.2 ChipMOS TECHNOLOGIES Cu Pilliar Bump Business Overview
- 4.18.3 ChipMOS TECHNOLOGIES Cu Pilliar Bump Production, Value and Gross Margin (2021-2026)
- 4.18.4 ChipMOS TECHNOLOGIES Product Portfolio
- 4.18.5 ChipMOS TECHNOLOGIES Recent Developments
- 4.19 Chipbond Technology Corporation
- 4.19.1 Chipbond Technology Corporation Cu Pilliar Bump Company Information
- 4.19.2 Chipbond Technology Corporation Cu Pilliar Bump Business Overview
- 4.19.3 Chipbond Technology Corporation Cu Pilliar Bump Production, Value and Gross Margin (2021-2026)
- 4.19.4 Chipbond Technology Corporation Product Portfolio
- 4.19.5 Chipbond Technology Corporation Recent Developments
- 4.20 Hefei Chipmore Technology
- 4.20.1 Hefei Chipmore Technology Cu Pilliar Bump Company Information
- 4.20.2 Hefei Chipmore Technology Cu Pilliar Bump Business Overview
- 4.20.3 Hefei Chipmore Technology Cu Pilliar Bump Production, Value and Gross Margin (2021-2026)
- 4.20.4 Hefei Chipmore Technology Product Portfolio
- 4.20.5 Hefei Chipmore Technology Recent Developments
- 4.21 Ningbo ChipEx Semiconductor Co., Ltd
- 4.21.1 Ningbo ChipEx Semiconductor Co., Ltd Cu Pilliar Bump Company Information
- 4.21.2 Ningbo ChipEx Semiconductor Co., Ltd Cu Pilliar Bump Business Overview
- 4.21.3 Ningbo ChipEx Semiconductor Co., Ltd Cu Pilliar Bump Production, Value and Gross Margin (2021-2026)
- 4.21.4 Ningbo ChipEx Semiconductor Co., Ltd Product Portfolio
- 4.21.5 Ningbo ChipEx Semiconductor Co., Ltd Recent Developments
- 4.22 UTAC
- 4.22.1 UTAC Cu Pilliar Bump Company Information
- 4.22.2 UTAC Cu Pilliar Bump Business Overview
- 4.22.3 UTAC Cu Pilliar Bump Production, Value and Gross Margin (2021-2026)
- 4.22.4 UTAC Product Portfolio
- 4.22.5 UTAC Recent Developments
5 Global Cu Pilliar Bump Production by Region
- 5.1 Global Cu Pilliar Bump Production Estimates and Forecasts by Region: 2021 VS 2025 VS 2032
- 5.2 Global Cu Pilliar Bump Production by Region: 2021-2032
- 5.2.1 Global Cu Pilliar Bump Production by Region: 2021-2026
- 5.2.2 Global Cu Pilliar Bump Production Forecast by Region (2027-2032)
- 5.3 Global Cu Pilliar Bump Production Value Estimates and Forecasts by Region: 2021 VS 2025 VS 2032
- 5.4 Global Cu Pilliar Bump Production Value by Region: 2021-2032
- 5.4.1 Global Cu Pilliar Bump Production Value by Region: 2021-2026
- 5.4.2 Global Cu Pilliar Bump Production Value Forecast by Region (2027-2032)
- 5.5 Global Cu Pilliar Bump Market Price Analysis by Region (2021-2026)
- 5.6 Global Cu Pilliar Bump Production and Value, YOY Growth
- 5.6.1 North America Cu Pilliar Bump Production Value Estimates and Forecasts (2021-2032)
- 5.6.2 Europe Cu Pilliar Bump Production Value Estimates and Forecasts (2021-2032)
- 5.6.3 China Cu Pilliar Bump Production Value Estimates and Forecasts (2021-2032)
- 5.6.4 Japan Cu Pilliar Bump Production Value Estimates and Forecasts (2021-2032)
- 5.6.5 South Korea Cu Pilliar Bump Production Value Estimates and Forecasts (2021-2032)
6 Global Cu Pilliar Bump Consumption by Region
- 6.1 Global Cu Pilliar Bump Consumption Estimates and Forecasts by Region: 2021 VS 2025 VS 2032
- 6.2 Global Cu Pilliar Bump Consumption by Region (2021-2032)
- 6.2.1 Global Cu Pilliar Bump Consumption by Region: 2021-2026
- 6.2.2 Global Cu Pilliar Bump Forecasted Consumption by Region (2027-2032)
- 6.3 North America
- 6.3.1 North America Cu Pilliar Bump Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 6.3.2 North America Cu Pilliar Bump Consumption by Country (2021-2032)
- 6.3.3 United States
- 6.3.4 Canada
- 6.3.5 Mexico
- 6.4 Europe
- 6.4.1 Europe Cu Pilliar Bump Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 6.4.2 Europe Cu Pilliar Bump Consumption by Country (2021-2032)
- 6.4.3 Germany
- 6.4.4 France
- 6.4.5 U.K.
- 6.4.6 Italy
- 6.4.7 Russia
- 6.4.8 Spain
- 6.4.9 Netherlands
- 6.4.10 Switzerland
- 6.4.11 Sweden
- 6.4.12 Poland
- 6.5 Asia Pacific
- 6.5.1 Asia Pacific Cu Pilliar Bump Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 6.5.2 Asia Pacific Cu Pilliar Bump Consumption by Country (2021-2032)
- 6.5.3 China
- 6.5.4 Japan
- 6.5.5 South Korea
- 6.5.6 India
- 6.5.7 Australia
- 6.5.8 Taiwan
- 6.5.9 Southeast Asia
- 6.6 South America, Middle East & Africa
- 6.6.1 South America, Middle East & Africa Cu Pilliar Bump Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 6.6.2 South America, Middle East & Africa Cu Pilliar Bump Consumption by Country (2021-2032)
- 6.6.3 Brazil
- 6.6.4 Argentina
- 6.6.5 Chile
- 6.6.6 Turkey
- 6.6.7 GCC Countries
7 Segment by Type
- 7.1 Global Cu Pilliar Bump Production by Type (2021-2032)
- 7.1.1 Global Cu Pilliar Bump Production by Type (2021-2032) & (k pcs)
- 7.1.2 Global Cu Pilliar Bump Production Market Share by Type (2021-2032)
- 7.2 Global Cu Pilliar Bump Production Value by Type (2021-2032)
- 7.2.1 Global Cu Pilliar Bump Production Value by Type (2021-2032) & (US$ Million)
- 7.2.2 Global Cu Pilliar Bump Production Value Market Share by Type (2021-2032)
- 7.3 Global Cu Pilliar Bump Price by Type (2021-2032)
8 Segment by Application
- 8.1 Global Cu Pilliar Bump Production by Application (2021-2032)
- 8.1.1 Global Cu Pilliar Bump Production by Application (2021-2032) & (k pcs)
- 8.1.2 Global Cu Pilliar Bump Production Market Share by Application (2021-2032)
- 8.2 Global Cu Pilliar Bump Production Value by Application (2021-2032)
- 8.2.1 Global Cu Pilliar Bump Production Value by Application (2021-2032) & (US$ Million)
- 8.2.2 Global Cu Pilliar Bump Production Value Market Share by Application (2021-2032)
- 8.3 Global Cu Pilliar Bump Price by Application (2021-2032)
9 Value Chain and Sales Channels Analysis of the Market
- 9.1 Cu Pilliar Bump Value Chain Analysis
- 9.1.1 Cu Pilliar Bump Key Raw Materials
- 9.1.2 Raw Materials Key Suppliers
- 9.1.3 Cu Pilliar Bump Production Mode & Process
- 9.2 Cu Pilliar Bump Sales Channels Analysis
- 9.2.1 Direct Comparison with Distribution Share
- 9.2.2 Cu Pilliar Bump Distributors
- 9.2.3 Cu Pilliar Bump Customers
10 Global Cu Pilliar Bump Analyzing Market Dynamics
- 10.1 Cu Pilliar Bump Industry Trends
- 10.2 Cu Pilliar Bump Industry Drivers
- 10.3 Cu Pilliar Bump Industry Opportunities and Challenges
- 10.4 Cu Pilliar Bump Industry Restraints
11 Report Conclusion
12 Disclaimer
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