Selected research
Industry Growth & Trends
Global Hermetic Packages for Semiconductor Component Industry Growth and Trends Forecast to 2032
Market perspective
The global Hermetic Packages for Semiconductor Component market was valued at US$ million in 2026 and is projected to reach US$ million by 2032, implying a CAGR of xx% over 2026-2032.
The North America market for Hermetic Packages for Semiconductor Component is projected to increase from US$ million in 2026 to US$ million by 2032, corresponding to a CAGR of % over 2026-2032.
The Europe market for Hermetic Packages for Semiconductor Component is projected to increase from US$ million in 2026 to US$ million by 2032, registering a CAGR of % over 2026-2032.
Read the full market overview
The Asia Pacific market for Hermetic Packages for Semiconductor Component is projected to increase from US$ million in 2026 to US$ million by 2032, at a CAGR of % over 2026-2032.
Leading global manufacturers of Hermetic Packages for Semiconductor Component include SCHOTT, Texas Instruments, SGA Technologies, KYOCERA, Martec, AMETEK, Micross Components, Suron and ALTER Technology, among others. In 2025, the top three vendors together accounted for approximately % of global revenue.
Report Scope
This report provides a structured, data-driven view of the global Hermetic Packages for Semiconductor Component market, combining harmonized quantitative metrics with targeted qualitative insight to support business and growth strategy, market positioning, and capital allocation.
The Hermetic Packages for Semiconductor Component market size, estimates, and forecasts are presented in terms of sales volume (k units) and revenue (US$ million), with 2025 as the base year and historical and forecast data for 2021-2032. The report segments the global Hermetic Packages for Semiconductor Component market by Type, Application, region/country, and company, provides regional market sizes at the segment level, profiles the competitive landscape and key players and their market ranks, and reviews technology trends and new product developments relevant to Hermetic Packages for Semiconductor Component.
Key Companies & Market Share Insights
This section analyzes the strategies and performance of leading manufacturers in the global Hermetic Packages for Semiconductor Component market, including portfolio focus, innovation and product development, mergers and acquisitions, collaborations, and geographic expansion used to sustain or enhance competitive positions. It also summarizes recent corporate developments and key financial indicators and provides global revenue, price, and sales volume data by manufacturer for 2020-2025, enabling benchmarking of scale, pricing, and market share and supporting assessment of market concentration through indicators such as CR5 and CR10.
Hermetic Packages for Semiconductor Component Market by Company
SCHOTT
Texas Instruments
SGA Technologies
KYOCERA
Martec
AMETEK
Micross Components
Suron
ALTER Technology
Hermetix
Amkor Technology
Teledyne Technologies
Egide
Materion
Broadex Technologies
Complete Hermetics
NGK Spark Plug
Hermetic Packages for Semiconductor Component Segment by Type
Multilayer Ceramic Packages
Pressed Ceramic Packages
Metal Can Packages
Hermetic Packages for Semiconductor Component Segment by Application
Aerospace
Defense
Healthcare
Automotive
Telecom
Others
Hermetic Packages for Semiconductor Component Segment by Region
North America
United States
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Spain
Netherlands
Switzerland
Sweden
Poland
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Southeast Asia
South America
Brazil
Argentina
Chile
Middle East & Africa
Egypt
South Africa
Israel
Türkiye
GCC Countries
Key Drivers & Barriers
High-impact rendering factors and drivers have been studied in this report to aid the readers to understand the general development. Moreover, the report includes restraints and challenges that may act as stumbling blocks on the way of the players. This will assist the users to be attentive and make informed decisions related to business. Specialists have also laid their focus on the upcoming business prospects.
Reasons to Buy This Report
1. This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global Hermetic Packages for Semiconductor Component market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.
2. This report will help stakeholders to understand the global industry status and trends of Hermetic Packages for Semiconductor Component and provides them with information on key market drivers, restraints, challenges, and opportunities.
3. This report will help stakeholders to understand competitors better and gain more insights to strengthen their position in their businesses. The competitive landscape section includes the market share and rank (in volume and value), competitor ecosystem, new product development, expansion, and acquisition.
4. This report stays updated with novel technology integration, features, and the latest developments in the market.
5. This report helps stakeholders to gain insights into which regions to target globally.
6. This report helps stakeholders to gain insights into the end-user perception concerning the adoption of Hermetic Packages for Semiconductor Component.
7. This report helps stakeholders to identify some of the key players in the market and understand their valuable contribution.
Chapter Outline
Chapter 1: Introduces the study scope of this report, executive summary of market segments by type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter 2: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Hermetic Packages for Semiconductor Component manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter 4: Sales, revenue of Hermetic Packages for Semiconductor Component in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter 5: Introduces market segments by application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter 6: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 7, 8, 9, 10 and 11: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter 12: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics.
Chapter 13: Concluding Insights of the report.
More report detail
Tables and figures
Scope & coverage.
Types
- Multilayer Ceramic Packages
- Pressed Ceramic Packages
- Metal Can Packages
Applications
- Aerospace
- Defense
- Healthcare
- Automotive
- Telecom
- Others
Companies covered
- SCHOTT
- Texas Instruments
- SGA Technologies
- KYOCERA
- Martec
- AMETEK
- Micross Components
- Suron
- ALTER Technology
- Hermetix
- Amkor Technology
- Teledyne Technologies
- Egide
- Materion
- Broadex Technologies
- Complete Hermetics
- NGK Spark Plug
Inside the report.
1 Market Overview
- 1.1 Product Definition
- 1.2 Global Market Growth Prospects
- 1.2.1 Global Hermetic Packages for Semiconductor Component Market Size Estimates and Forecasts (2021-2032)
- 1.2.2 Global Hermetic Packages for Semiconductor Component Sales Estimates and Forecasts (2021-2032)
- 1.3 Hermetic Packages for Semiconductor Component Market by Type
- 1.3.1 Multilayer Ceramic Packages
- 1.3.2 Pressed Ceramic Packages
- 1.3.3 Metal Can Packages
- 1.4 Global Hermetic Packages for Semiconductor Component Market Size by Type
- 1.4.1 Global Hermetic Packages for Semiconductor Component Market Size Overview by Type (2021-2032)
- 1.4.2 Global Hermetic Packages for Semiconductor Component Historic Market Size Review by Type (2021-2026)
- 1.4.3 Global Hermetic Packages for Semiconductor Component Forecasted Market Size by Type (2027-2032)
- 1.5 Key Regions Market Size by Type
- 1.5.1 North America Hermetic Packages for Semiconductor Component Sales Breakdown by Type (2021-2026)
- 1.5.2 Europe Hermetic Packages for Semiconductor Component Sales Breakdown by Type (2021-2026)
- 1.5.3 Asia-Pacific Hermetic Packages for Semiconductor Component Sales Breakdown by Type (2021-2026)
- 1.5.4 South America Hermetic Packages for Semiconductor Component Sales Breakdown by Type (2021-2026)
- 1.5.5 Middle East and Africa Hermetic Packages for Semiconductor Component Sales Breakdown by Type (2021-2026)
2 Global Market Dynamics
- 2.1 Hermetic Packages for Semiconductor Component Industry Trends
- 2.2 Hermetic Packages for Semiconductor Component Industry Drivers
- 2.3 Hermetic Packages for Semiconductor Component Industry Opportunities and Challenges
- 2.4 Hermetic Packages for Semiconductor Component Industry Restraints
3 Market Competitive Landscape by Company
- 3.1 Global Top Players by Hermetic Packages for Semiconductor Component Revenue (2021-2026)
- 3.2 Global Top Players by Hermetic Packages for Semiconductor Component Sales (2021-2026)
- 3.3 Global Top Players by Hermetic Packages for Semiconductor Component Price (2021-2026)
- 3.4 Global Hermetic Packages for Semiconductor Component Industry Company Ranking, 2024 VS 2025 VS 2026
- 3.5 Global Hermetic Packages for Semiconductor Component Major Company Production Sites & Headquarters
- 3.6 Global Hermetic Packages for Semiconductor Component Company, Product Type & Application
- 3.7 Global Hermetic Packages for Semiconductor Component Company Establishment Date
- 3.8 Market Competitive Analysis
- 3.8.1 Global Hermetic Packages for Semiconductor Component Market CR5 and HHI
- 3.8.2 Global Top 5 and 10 Hermetic Packages for Semiconductor Component Players Market Share by Revenue in 2025
- 3.8.3 2025 Hermetic Packages for Semiconductor Component Tier 1, Tier 2, and Tier 3
4 Hermetic Packages for Semiconductor Component Regional Status and Outlook
- 4.1 Global Hermetic Packages for Semiconductor Component Market Size and CAGR by Region: 2021 VS 2025 VS 2032
- 4.2 Global Hermetic Packages for Semiconductor Component Historic Market Size by Region
- 4.2.1 Global Hermetic Packages for Semiconductor Component Sales in Volume by Region (2021-2026)
- 4.2.2 Global Hermetic Packages for Semiconductor Component Sales in Value by Region (2021-2026)
- 4.2.3 Global Hermetic Packages for Semiconductor Component Sales (Volume & Value), Price and Gross Margin (2021-2026)
- 4.3 Global Hermetic Packages for Semiconductor Component Forecasted Market Size by Region
- 4.3.1 Global Hermetic Packages for Semiconductor Component Sales in Volume by Region (2027-2032)
- 4.3.2 Global Hermetic Packages for Semiconductor Component Sales in Value by Region (2027-2032)
- 4.3.3 Global Hermetic Packages for Semiconductor Component Sales (Volume & Value), Price and Gross Margin (2027-2032)
5 Hermetic Packages for Semiconductor Component by Application
- 5.1 Hermetic Packages for Semiconductor Component Market by Application
- 5.1.1 Aerospace
- 5.1.2 Defense
- 5.1.3 Healthcare
- 5.1.4 Automotive
- 5.1.5 Telecom
- 5.1.6 Others
- 5.2 Global Hermetic Packages for Semiconductor Component Market Size by Application
- 5.2.1 Global Hermetic Packages for Semiconductor Component Market Size Overview by Application (2021-2032)
- 5.2.2 Global Hermetic Packages for Semiconductor Component Historic Market Size Review by Application (2021-2026)
- 5.2.3 Global Hermetic Packages for Semiconductor Component Forecasted Market Size by Application (2027-2032)
- 5.3 Key Regions Market Size by Application
- 5.3.1 North America Hermetic Packages for Semiconductor Component Sales Breakdown by Application (2021-2026)
- 5.3.2 Europe Hermetic Packages for Semiconductor Component Sales Breakdown by Application (2021-2026)
- 5.3.3 Asia-Pacific Hermetic Packages for Semiconductor Component Sales Breakdown by Application (2021-2026)
- 5.3.4 South America Hermetic Packages for Semiconductor Component Sales Breakdown by Application (2021-2026)
- 5.3.5 Middle East and Africa Hermetic Packages for Semiconductor Component Sales Breakdown by Application (2021-2026)
6 Company Profiles
- 6.1 SCHOTT
- 6.1.1 SCHOTT Company Information
- 6.1.2 SCHOTT Business Overview
- 6.1.3 SCHOTT Hermetic Packages for Semiconductor Component Sales, Revenue and Gross Margin (2021-2026)
- 6.1.4 SCHOTT Hermetic Packages for Semiconductor Component Product Portfolio
- 6.1.5 SCHOTT Recent Developments
- 6.2 Texas Instruments
- 6.2.1 Texas Instruments Company Information
- 6.2.2 Texas Instruments Business Overview
- 6.2.3 Texas Instruments Hermetic Packages for Semiconductor Component Sales, Revenue and Gross Margin (2021-2026)
- 6.2.4 Texas Instruments Hermetic Packages for Semiconductor Component Product Portfolio
- 6.2.5 Texas Instruments Recent Developments
- 6.3 SGA Technologies
- 6.3.1 SGA Technologies Company Information
- 6.3.2 SGA Technologies Business Overview
- 6.3.3 SGA Technologies Hermetic Packages for Semiconductor Component Sales, Revenue and Gross Margin (2021-2026)
- 6.3.4 SGA Technologies Hermetic Packages for Semiconductor Component Product Portfolio
- 6.3.5 SGA Technologies Recent Developments
- 6.4 KYOCERA
- 6.4.1 KYOCERA Company Information
- 6.4.2 KYOCERA Business Overview
- 6.4.3 KYOCERA Hermetic Packages for Semiconductor Component Sales, Revenue and Gross Margin (2021-2026)
- 6.4.4 KYOCERA Hermetic Packages for Semiconductor Component Product Portfolio
- 6.4.5 KYOCERA Recent Developments
- 6.5 Martec
- 6.5.1 Martec Company Information
- 6.5.2 Martec Business Overview
- 6.5.3 Martec Hermetic Packages for Semiconductor Component Sales, Revenue and Gross Margin (2021-2026)
- 6.5.4 Martec Hermetic Packages for Semiconductor Component Product Portfolio
- 6.5.5 Martec Recent Developments
- 6.6 AMETEK
- 6.6.1 AMETEK Company Information
- 6.6.2 AMETEK Business Overview
- 6.6.3 AMETEK Hermetic Packages for Semiconductor Component Sales, Revenue and Gross Margin (2021-2026)
- 6.6.4 AMETEK Hermetic Packages for Semiconductor Component Product Portfolio
- 6.6.5 AMETEK Recent Developments
- 6.7 Micross Components
- 6.7.1 Micross Components Company Information
- 6.7.2 Micross Components Business Overview
- 6.7.3 Micross Components Hermetic Packages for Semiconductor Component Sales, Revenue and Gross Margin (2021-2026)
- 6.7.4 Micross Components Hermetic Packages for Semiconductor Component Product Portfolio
- 6.7.5 Micross Components Recent Developments
- 6.8 Suron
- 6.8.1 Suron Company Information
- 6.8.2 Suron Business Overview
- 6.8.3 Suron Hermetic Packages for Semiconductor Component Sales, Revenue and Gross Margin (2021-2026)
- 6.8.4 Suron Hermetic Packages for Semiconductor Component Product Portfolio
- 6.8.5 Suron Recent Developments
- 6.9 ALTER Technology
- 6.9.1 ALTER Technology Company Information
- 6.9.2 ALTER Technology Business Overview
- 6.9.3 ALTER Technology Hermetic Packages for Semiconductor Component Sales, Revenue and Gross Margin (2021-2026)
- 6.9.4 ALTER Technology Hermetic Packages for Semiconductor Component Product Portfolio
- 6.9.5 ALTER Technology Recent Developments
- 6.10 Hermetix
- 6.10.1 Hermetix Company Information
- 6.10.2 Hermetix Business Overview
- 6.10.3 Hermetix Hermetic Packages for Semiconductor Component Sales, Revenue and Gross Margin (2021-2026)
- 6.10.4 Hermetix Hermetic Packages for Semiconductor Component Product Portfolio
- 6.10.5 Hermetix Recent Developments
- 6.11 Amkor Technology
- 6.11.1 Amkor Technology Company Information
- 6.11.2 Amkor Technology Business Overview
- 6.11.3 Amkor Technology Hermetic Packages for Semiconductor Component Sales, Revenue and Gross Margin (2021-2026)
- 6.11.4 Amkor Technology Hermetic Packages for Semiconductor Component Product Portfolio
- 6.11.5 Amkor Technology Recent Developments
- 6.12 Teledyne Technologies
- 6.12.1 Teledyne Technologies Company Information
- 6.12.2 Teledyne Technologies Business Overview
- 6.12.3 Teledyne Technologies Hermetic Packages for Semiconductor Component Sales, Revenue and Gross Margin (2021-2026)
- 6.12.4 Teledyne Technologies Hermetic Packages for Semiconductor Component Product Portfolio
- 6.12.5 Teledyne Technologies Recent Developments
- 6.13 Egide
- 6.13.1 Egide Company Information
- 6.13.2 Egide Business Overview
- 6.13.3 Egide Hermetic Packages for Semiconductor Component Sales, Revenue and Gross Margin (2021-2026)
- 6.13.4 Egide Hermetic Packages for Semiconductor Component Product Portfolio
- 6.13.5 Egide Recent Developments
- 6.14 Materion
- 6.14.1 Materion Company Information
- 6.14.2 Materion Business Overview
- 6.14.3 Materion Hermetic Packages for Semiconductor Component Sales, Revenue and Gross Margin (2021-2026)
- 6.14.4 Materion Hermetic Packages for Semiconductor Component Product Portfolio
- 6.14.5 Materion Recent Developments
- 6.15 Broadex Technologies
- 6.15.1 Broadex Technologies Company Information
- 6.15.2 Broadex Technologies Business Overview
- 6.15.3 Broadex Technologies Hermetic Packages for Semiconductor Component Sales, Revenue and Gross Margin (2021-2026)
- 6.15.4 Broadex Technologies Hermetic Packages for Semiconductor Component Product Portfolio
- 6.15.5 Broadex Technologies Recent Developments
- 6.16 Complete Hermetics
- 6.16.1 Complete Hermetics Company Information
- 6.16.2 Complete Hermetics Business Overview
- 6.16.3 Complete Hermetics Hermetic Packages for Semiconductor Component Sales, Revenue and Gross Margin (2021-2026)
- 6.16.4 Complete Hermetics Hermetic Packages for Semiconductor Component Product Portfolio
- 6.16.5 Complete Hermetics Recent Developments
- 6.17 NGK Spark Plug
- 6.17.1 NGK Spark Plug Company Information
- 6.17.2 NGK Spark Plug Business Overview
- 6.17.3 NGK Spark Plug Hermetic Packages for Semiconductor Component Sales, Revenue and Gross Margin (2021-2026)
- 6.17.4 NGK Spark Plug Hermetic Packages for Semiconductor Component Product Portfolio
- 6.17.5 NGK Spark Plug Recent Developments
7 North America by Country
- 7.1 North America Hermetic Packages for Semiconductor Component Sales by Country
- 7.1.1 North America Hermetic Packages for Semiconductor Component Sales Growth Rate (CAGR) by Country: 2021 VS 2025 VS 2032
- 7.1.2 North America Hermetic Packages for Semiconductor Component Sales by Country (2021-2026)
- 7.1.3 North America Hermetic Packages for Semiconductor Component Sales Forecast by Country (2027-2032)
- 7.2 North America Hermetic Packages for Semiconductor Component Market Size by Country
- 7.2.1 North America Hermetic Packages for Semiconductor Component Market Size Growth Rate (CAGR) by Country: 2021 VS 2025 VS 2032
- 7.2.2 North America Hermetic Packages for Semiconductor Component Market Size by Country (2021-2026)
- 7.2.3 North America Hermetic Packages for Semiconductor Component Market Size Forecast by Country (2027-2032)
8 Europe by Country
- 8.1 Europe Hermetic Packages for Semiconductor Component Sales by Country
- 8.1.1 Europe Hermetic Packages for Semiconductor Component Sales Growth Rate (CAGR) by Country: 2021 VS 2025 VS 2032
- 8.1.2 Europe Hermetic Packages for Semiconductor Component Sales by Country (2021-2026)
- 8.1.3 Europe Hermetic Packages for Semiconductor Component Sales Forecast by Country (2027-2032)
- 8.2 Europe Hermetic Packages for Semiconductor Component Market Size by Country
- 8.2.1 Europe Hermetic Packages for Semiconductor Component Market Size Growth Rate (CAGR) by Country: 2021 VS 2025 VS 2032
- 8.2.2 Europe Hermetic Packages for Semiconductor Component Market Size by Country (2021-2026)
- 8.2.3 Europe Hermetic Packages for Semiconductor Component Market Size Forecast by Country (2027-2032)
9 Asia-Pacific by Country
- 9.1 Asia-Pacific Hermetic Packages for Semiconductor Component Sales by Country
- 9.1.1 Asia-Pacific Hermetic Packages for Semiconductor Component Sales Growth Rate (CAGR) by Country: 2021 VS 2025 VS 2032
- 9.1.2 Asia-Pacific Hermetic Packages for Semiconductor Component Sales by Country (2021-2026)
- 9.1.3 Asia-Pacific Hermetic Packages for Semiconductor Component Sales Forecast by Country (2027-2032)
- 9.2 Asia-Pacific Hermetic Packages for Semiconductor Component Market Size by Country
- 9.2.1 Asia-Pacific Hermetic Packages for Semiconductor Component Market Size Growth Rate (CAGR) by Country: 2021 VS 2025 VS 2032
- 9.2.2 Asia-Pacific Hermetic Packages for Semiconductor Component Market Size by Country (2021-2026)
- 9.2.3 Asia-Pacific Hermetic Packages for Semiconductor Component Market Size Forecast by Country (2027-2032)
10 South America by Country
- 10.1 South America Hermetic Packages for Semiconductor Component Sales by Country
- 10.1.1 South America Hermetic Packages for Semiconductor Component Sales Growth Rate (CAGR) by Country: 2021 VS 2025 VS 2032
- 10.1.2 South America Hermetic Packages for Semiconductor Component Sales by Country (2021-2026)
- 10.1.3 South America Hermetic Packages for Semiconductor Component Sales Forecast by Country (2027-2032)
- 10.2 South America Hermetic Packages for Semiconductor Component Market Size by Country
- 10.2.1 South America Hermetic Packages for Semiconductor Component Market Size Growth Rate (CAGR) by Country: 2021 VS 2025 VS 2032
- 10.2.2 South America Hermetic Packages for Semiconductor Component Market Size by Country (2021-2026)
- 10.2.3 South America Hermetic Packages for Semiconductor Component Market Size Forecast by Country (2027-2032)
11 Middle East and Africa by Country
- 11.1 Middle East and Africa Hermetic Packages for Semiconductor Component Sales by Country
- 11.1.1 Middle East and Africa Hermetic Packages for Semiconductor Component Sales Growth Rate (CAGR) by Country: 2021 VS 2025 VS 2032
- 11.1.2 Middle East and Africa Hermetic Packages for Semiconductor Component Sales by Country (2021-2026)
- 11.1.3 Middle East and Africa Hermetic Packages for Semiconductor Component Sales Forecast by Country (2027-2032)
- 11.2 Middle East and Africa Hermetic Packages for Semiconductor Component Market Size by Country
- 11.2.1 Middle East and Africa Hermetic Packages for Semiconductor Component Market Size Growth Rate (CAGR) by Country: 2021 VS 2025 VS 2032
- 11.2.2 Middle East and Africa Hermetic Packages for Semiconductor Component Market Size by Country (2021-2026)
- 11.2.3 Middle East and Africa Hermetic Packages for Semiconductor Component Market Size Forecast by Country (2027-2032)
12 Value Chain and Sales Channels Analysis
- 12.1 Hermetic Packages for Semiconductor Component Value Chain Analysis
- 12.1.1 Hermetic Packages for Semiconductor Component Key Raw Materials
- 12.1.2 Key Raw Materials Price
- 12.1.3 Raw Materials Key Suppliers
- 12.1.4 Manufacturing Cost Structure
- 12.1.5 Hermetic Packages for Semiconductor Component Production Mode & Process
- 12.2 Hermetic Packages for Semiconductor Component Sales Channels Analysis
- 12.2.1 Direct Comparison with Distribution Share
- 12.2.2 Hermetic Packages for Semiconductor Component Distributors
- 12.2.3 Hermetic Packages for Semiconductor Component Customers
13 Concluding Insights
14 Appendix
- 14.1 Reasons for Doing This Study
- 14.2 Research Methodology
- 14.3 Research Process
- 14.4 Authors List of This Report
- 14.5 Data Source
- 14.5.1 Secondary Sources
- 14.5.2 Primary Sources
- 14.6 Disclaimer
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