Selected research
Market Analysis & Forecast
Global Mutual Capacitance Chip Market Analysis and Forecast 2026-2032
Market perspective
The global Mutual Capacitance Chip market is projected to grow from US$ million in 2026 to US$ million by 2032, at a Compound Annual Growth Rate (CAGR) of % during the forecast period.
Mutual Capacitance Chip's global sales reached XX (k units) with a value of US$ XX Million, marking an change of XX% compared to the previous year. This performance has positioned Shenzhen AXS Technology as the global sales leader, a title it has maintained for several consecutive years. Notably, Shenzhen AXS Technology's performance in primary markets is also remarkable. In the Chinese market, sales were XX (k units), a change of XX% from the previous year. In Europe, sales were XX (k units), showing a year-on-year of XX%. In the US, sales were XX (k units), a year-on-year change of XX%.
The major global manufacturers in the Mutual Capacitance Chip market include Shenzhen AXS Technology, Shanghai Hynitron Technology, 3M, Microchip, Infineon, Focaltech System, GigaDevice Semiconductor, Chipsemi SEMICONDUCTOR (Ningbo) and ShenZhen Betterlife Electronic Science And Technology, etc. In 2025, the top three vendors accounted for approximately % of the revenue.
Read the full market overview
In terms of production side, this report researches the Mutual Capacitance Chip production, growth rate, market share by manufacturers and by region (region level and country level), from 2021 to 2026, and forecast to 2032.
In terms of consumption side, this report focuses on the sales of Mutual Capacitance Chip by region (region level and country level), by Company, by Type and by Application. from 2021 to 2026 and forecast to 2032.
This report presents an overview of global market for Mutual Capacitance Chip, capacity, output, revenue and price. Analyses of the global market trends, with historic market revenue or sales data for 2021 - 2025, estimates for 2026, and projections of CAGR through 2032.
This report researches the key producers of Mutual Capacitance Chip, also provides the consumption of main regions and countries. Of the upcoming market potential for Mutual Capacitance Chip, and key regions or countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the Mutual Capacitance Chip sales, revenue, market share and industry ranking of main manufacturers, data from 2021 to 2026. Identification of the major stakeholders in the global Mutual Capacitance Chip market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by Type and by Application, sales, revenue, and price, from 2021 to 2032. Evaluation and forecast the market size for Mutual Capacitance Chip sales, projected growth trends, production technology, application and end-user industry.
Mutual Capacitance Chip Segment by Company
Shenzhen AXS Technology
Shanghai Hynitron Technology
3M
Microchip
Infineon
Focaltech System
GigaDevice Semiconductor
Chipsemi SEMICONDUCTOR (Ningbo)
ShenZhen Betterlife Electronic Science And Technology
Mutual Capacitance Chip Segment by Type
Up to 10 Touch Points
Above 10 Touch Points
Mutual Capacitance Chip Segment by Application
Wearables Device
Consumer Electronics
Automotive
Industrial
Others
Mutual Capacitance Chip Segment by Region
North America
United States
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Spain
Netherlands
Switzerland
Sweden
Poland
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Southeast Asia
South America
Brazil
Argentina
Chile
Middle East & Africa
Egypt
South Africa
Israel
Türkiye
GCC Countries
Study Objectives
1. To analyze and research the global status and future forecast, involving, production, value, consumption, growth rate (CAGR), market share, historical and forecast.
2. To present the key manufacturers, capacity, production, revenue, market share, and Recent Developments.
3. To split the breakdown data by regions, type, manufacturers, and Application.
4. To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints, and risks.
5. To identify significant trends, drivers, influence factors in global and regions.
6. To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
Reasons to Buy This Report
1. This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global Mutual Capacitance Chip market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.
2. This report will help stakeholders to understand the global industry status and trends of Mutual Capacitance Chip and provides them with information on key market drivers, restraints, challenges, and opportunities.
3. This report will help stakeholders to understand competitors better and gain more insights to strengthen their position in their businesses. The competitive landscape section includes the market share and rank (in volume and value), competitor ecosystem, new product development, expansion, and acquisition.
4. This report stays updated with novel technology integration, features, and the latest developments in the market.
5. This report helps stakeholders to gain insights into which regions to target globally.
6. This report helps stakeholders to gain insights into the end-user perception concerning the adoption of Mutual Capacitance Chip.
7. This report helps stakeholders to identify some of the key players in the market and understand their valuable contribution.
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by type and by application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Mutual Capacitance Chip production/output of global and key producers (regions/countries). It provides a quantitative analysis of the production, and development potential of each producer in the next six years.
Chapter 4: Sales (consumption), revenue of Mutual Capacitance Chip in global, regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 5: Detailed analysis of Mutual Capacitance Chip manufacturers competitive landscape, price, sales, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 6: Provides the analysis of various market segments by type, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 7: Provides the analysis of various market segments by application, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 8: Provides profiles of key manufacturers, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Mutual Capacitance Chip sales, revenue, price, gross margin, and recent development, etc.
Chapter 9: North America by type, by application and by country, sales, and revenue for each segment.
Chapter 10: Europe by type, by application and by country, sales, and revenue for each segment.
Chapter 11: China by type, by application, sales, and revenue for each segment.
Chapter 12: Asia (Excluding China) by type, by application and by region, sales, and revenue for each segment.
Chapter 13: South America, Middle East and Africa by type, by application and by country, sales, and revenue for each segment.
Chapter 14: Analysis of industrial chain, sales channel, key raw materials, distributors and customers.
Chapter 15: The main concluding insights of the report.
More report detail
Tables and figures
Scope & coverage.
Types
- Up to 10 Touch Points
- Above 10 Touch Points
Applications
- Wearables Device
- Consumer Electronics
- Automotive
- Industrial
- Others
Companies covered
- Shenzhen AXS Technology
- Shanghai Hynitron Technology
- 3M
- Microchip
- Infineon
- Focaltech System
- GigaDevice Semiconductor
- Chipsemi SEMICONDUCTOR (Ningbo)
- ShenZhen Betterlife Electronic Science And Technology
Inside the report.
1 Market Overview
- 1.1 Product Definition
- 1.2 Mutual Capacitance Chip Market by Type
- 1.2.1 Global Mutual Capacitance Chip Market Size by Type, 2021 VS 2025 VS 2032
- 1.2.2 Up to 10 Touch Points
- 1.2.3 Above 10 Touch Points
- 1.3 Mutual Capacitance Chip Market by Application
- 1.3.1 Global Mutual Capacitance Chip Market Size by Application, 2021 VS 2025 VS 2032
- 1.3.2 Wearables Device
- 1.3.3 Consumer Electronics
- 1.3.4 Automotive
- 1.3.5 Industrial
- 1.3.6 Others
- 1.4 Assumptions and Limitations
- 1.5 Study Goals and Objectives
2 Mutual Capacitance Chip Market Dynamics
- 2.1 Mutual Capacitance Chip Industry Trends
- 2.2 Mutual Capacitance Chip Industry Drivers
- 2.3 Mutual Capacitance Chip Industry Opportunities and Challenges
- 2.4 Mutual Capacitance Chip Industry Restraints
3 Global Mutual Capacitance Chip Production Overview
- 3.1 Global Mutual Capacitance Chip Production Capacity (2021-2032)
- 3.2 Global Mutual Capacitance Chip Production by Region: 2021 VS 2025 VS 2032
- 3.3 Global Mutual Capacitance Chip Production by Region
- 3.3.1 Global Mutual Capacitance Chip Production by Region (2021-2026)
- 3.3.2 Global Mutual Capacitance Chip Production by Region (2027-2032)
- 3.3.3 Global Mutual Capacitance Chip Production Market Share by Region (2021-2032)
- 3.4 North America
- 3.5 Europe
- 3.6 China
- 3.7 Japan
- 3.8 South Korea
4 Global Market Growth Prospects
- 4.1 Global Mutual Capacitance Chip Revenue Estimates and Forecasts (2021-2032)
- 4.2 Global Mutual Capacitance Chip Revenue by Region
- 4.2.1 Global Mutual Capacitance Chip Revenue by Region: 2021 VS 2025 VS 2032
- 4.2.2 Global Mutual Capacitance Chip Revenue by Region (2021-2026)
- 4.2.3 Global Mutual Capacitance Chip Revenue by Region (2027-2032)
- 4.2.4 Global Mutual Capacitance Chip Revenue Market Share by Region (2021-2032)
- 4.3 Global Mutual Capacitance Chip Sales Estimates and Forecasts 2021-2032
- 4.4 Global Mutual Capacitance Chip Sales by Region
- 4.4.1 Global Mutual Capacitance Chip Sales by Region: 2021 VS 2025 VS 2032
- 4.4.2 Global Mutual Capacitance Chip Sales by Region (2021-2026)
- 4.4.3 Global Mutual Capacitance Chip Sales by Region (2027-2032)
- 4.4.4 Global Mutual Capacitance Chip Sales Market Share by Region (2021-2032)
- 4.5 North America
- 4.6 Europe
- 4.7 China
- 4.8 Asia (Excluding China)
- 4.9 South America, Middle East and Africa
5 Market Competitive Landscape by Manufacturers
- 5.1 Global Mutual Capacitance Chip Revenue by Manufacturers
- 5.1.1 Global Mutual Capacitance Chip Revenue by Manufacturers (2021-2026)
- 5.1.2 Global Mutual Capacitance Chip Revenue Market Share by Manufacturers (2021-2026)
- 5.1.3 Global Mutual Capacitance Chip Manufacturers Revenue Share Top 10 and Top 5 in 2025
- 5.2 Global Mutual Capacitance Chip Sales by Manufacturers
- 5.2.1 Global Mutual Capacitance Chip Sales by Manufacturers (2021-2026)
- 5.2.2 Global Mutual Capacitance Chip Sales Market Share by Manufacturers (2021-2026)
- 5.2.3 Global Mutual Capacitance Chip Manufacturers Sales Share Top 10 and Top 5 in 2025
- 5.3 Global Mutual Capacitance Chip Sales Price by Manufacturers (2021-2026)
- 5.4 Global Mutual Capacitance Chip Key Manufacturers Ranking, 2024 VS 2025 VS 2026
- 5.5 Global Mutual Capacitance Chip Key Manufacturers Manufacturing Sites & Headquarters
- 5.6 Global Mutual Capacitance Chip Manufacturers, Product Type & Application
- 5.7 Global Mutual Capacitance Chip Manufacturers Commercialization Time
- 5.8 Market Competitive Analysis
- 5.8.1 Global Mutual Capacitance Chip Market CR5 and HHI
- 5.8.2 2025 Mutual Capacitance Chip Tier 1, Tier 2, and Tier 3
6 Mutual Capacitance Chip Market by Type
- 6.1 Global Mutual Capacitance Chip Revenue by Type
- 6.1.1 Global Mutual Capacitance Chip Revenue by Type (2021-2032) & (US$ Million)
- 6.1.2 Global Mutual Capacitance Chip Revenue Market Share by Type (2021-2032)
- 6.2 Global Mutual Capacitance Chip Sales by Type
- 6.2.1 Global Mutual Capacitance Chip Sales by Type (2021-2032) & (k units)
- 6.2.2 Global Mutual Capacitance Chip Sales Market Share by Type (2021-2032)
- 6.3 Global Mutual Capacitance Chip Price by Type
7 Mutual Capacitance Chip Market by Application
- 7.1 Global Mutual Capacitance Chip Revenue by Application
- 7.1.1 Global Mutual Capacitance Chip Revenue by Application (2021-2032) & (US$ Million)
- 7.1.2 Global Mutual Capacitance Chip Revenue Market Share by Application (2021-2032)
- 7.2 Global Mutual Capacitance Chip Sales by Application
- 7.2.1 Global Mutual Capacitance Chip Sales by Application (2021-2032) & (k units)
- 7.2.2 Global Mutual Capacitance Chip Sales Market Share by Application (2021-2032)
- 7.3 Global Mutual Capacitance Chip Price by Application
8 Company Profiles
- 8.1 Shenzhen AXS Technology
- 8.1.1 Shenzhen AXS Technology Company Information
- 8.1.2 Shenzhen AXS Technology Business Overview
- 8.1.3 Shenzhen AXS Technology Mutual Capacitance Chip Sales, Revenue, Price and Gross Margin (2021-2026)
- 8.1.4 Shenzhen AXS Technology Mutual Capacitance Chip Product Portfolio
- 8.1.5 Shenzhen AXS Technology Recent Developments
- 8.2 Shanghai Hynitron Technology
- 8.2.1 Shanghai Hynitron Technology Company Information
- 8.2.2 Shanghai Hynitron Technology Business Overview
- 8.2.3 Shanghai Hynitron Technology Mutual Capacitance Chip Sales, Revenue, Price and Gross Margin (2021-2026)
- 8.2.4 Shanghai Hynitron Technology Mutual Capacitance Chip Product Portfolio
- 8.2.5 Shanghai Hynitron Technology Recent Developments
- 8.3 3M
- 8.3.1 3M Company Information
- 8.3.2 3M Business Overview
- 8.3.3 3M Mutual Capacitance Chip Sales, Revenue, Price and Gross Margin (2021-2026)
- 8.3.4 3M Mutual Capacitance Chip Product Portfolio
- 8.3.5 3M Recent Developments
- 8.4 Microchip
- 8.4.1 Microchip Company Information
- 8.4.2 Microchip Business Overview
- 8.4.3 Microchip Mutual Capacitance Chip Sales, Revenue, Price and Gross Margin (2021-2026)
- 8.4.4 Microchip Mutual Capacitance Chip Product Portfolio
- 8.4.5 Microchip Recent Developments
- 8.5 Infineon
- 8.5.1 Infineon Company Information
- 8.5.2 Infineon Business Overview
- 8.5.3 Infineon Mutual Capacitance Chip Sales, Revenue, Price and Gross Margin (2021-2026)
- 8.5.4 Infineon Mutual Capacitance Chip Product Portfolio
- 8.5.5 Infineon Recent Developments
- 8.6 Focaltech System
- 8.6.1 Focaltech System Company Information
- 8.6.2 Focaltech System Business Overview
- 8.6.3 Focaltech System Mutual Capacitance Chip Sales, Revenue, Price and Gross Margin (2021-2026)
- 8.6.4 Focaltech System Mutual Capacitance Chip Product Portfolio
- 8.6.5 Focaltech System Recent Developments
- 8.7 GigaDevice Semiconductor
- 8.7.1 GigaDevice Semiconductor Company Information
- 8.7.2 GigaDevice Semiconductor Business Overview
- 8.7.3 GigaDevice Semiconductor Mutual Capacitance Chip Sales, Revenue, Price and Gross Margin (2021-2026)
- 8.7.4 GigaDevice Semiconductor Mutual Capacitance Chip Product Portfolio
- 8.7.5 GigaDevice Semiconductor Recent Developments
- 8.8 Chipsemi SEMICONDUCTOR (Ningbo)
- 8.8.1 Chipsemi SEMICONDUCTOR (Ningbo) Company Information
- 8.8.2 Chipsemi SEMICONDUCTOR (Ningbo) Business Overview
- 8.8.3 Chipsemi SEMICONDUCTOR (Ningbo) Mutual Capacitance Chip Sales, Revenue, Price and Gross Margin (2021-2026)
- 8.8.4 Chipsemi SEMICONDUCTOR (Ningbo) Mutual Capacitance Chip Product Portfolio
- 8.8.5 Chipsemi SEMICONDUCTOR (Ningbo) Recent Developments
- 8.9 ShenZhen Betterlife Electronic Science And Technology
- 8.9.1 ShenZhen Betterlife Electronic Science And Technology Company Information
- 8.9.2 ShenZhen Betterlife Electronic Science And Technology Business Overview
- 8.9.3 ShenZhen Betterlife Electronic Science And Technology Mutual Capacitance Chip Sales, Revenue, Price and Gross Margin (2021-2026)
- 8.9.4 ShenZhen Betterlife Electronic Science And Technology Mutual Capacitance Chip Product Portfolio
- 8.9.5 ShenZhen Betterlife Electronic Science And Technology Recent Developments
9 North America
- 9.1 North America Mutual Capacitance Chip Market Size by Type
- 9.1.1 North America Mutual Capacitance Chip Revenue by Type (2021-2032)
- 9.1.2 North America Mutual Capacitance Chip Sales by Type (2021-2032)
- 9.1.3 North America Mutual Capacitance Chip Price by Type (2021-2032)
- 9.2 North America Mutual Capacitance Chip Market Size by Application
- 9.2.1 North America Mutual Capacitance Chip Revenue by Application (2021-2032)
- 9.2.2 North America Mutual Capacitance Chip Sales by Application (2021-2032)
- 9.2.3 North America Mutual Capacitance Chip Price by Application (2021-2032)
- 9.3 North America Mutual Capacitance Chip Market Size by Country
- 9.3.1 North America Mutual Capacitance Chip Revenue Grow Rate by Country (2021 VS 2025 VS 2032)
- 9.3.2 North America Mutual Capacitance Chip Sales by Country (2021 VS 2025 VS 2032)
- 9.3.3 North America Mutual Capacitance Chip Price by Country (2021-2032)
- 9.3.4 United States
- 9.3.5 Canada
- 9.3.6 Mexico
10 Europe
- 10.1 Europe Mutual Capacitance Chip Market Size by Type
- 10.1.1 Europe Mutual Capacitance Chip Revenue by Type (2021-2032)
- 10.1.2 Europe Mutual Capacitance Chip Sales by Type (2021-2032)
- 10.1.3 Europe Mutual Capacitance Chip Price by Type (2021-2032)
- 10.2 Europe Mutual Capacitance Chip Market Size by Application
- 10.2.1 Europe Mutual Capacitance Chip Revenue by Application (2021-2032)
- 10.2.2 Europe Mutual Capacitance Chip Sales by Application (2021-2032)
- 10.2.3 Europe Mutual Capacitance Chip Price by Application (2021-2032)
- 10.3 Europe Mutual Capacitance Chip Market Size by Country
- 10.3.1 Europe Mutual Capacitance Chip Revenue Grow Rate by Country (2021 VS 2025 VS 2032)
- 10.3.2 Europe Mutual Capacitance Chip Sales by Country (2021 VS 2025 VS 2032)
- 10.3.3 Europe Mutual Capacitance Chip Price by Country (2021-2032)
- 10.3.4 Germany
- 10.3.5 France
- 10.3.6 U.K.
- 10.3.7 Italy
- 10.3.8 Russia
- 10.3.9 Spain
- 10.3.10 Netherlands
- 10.3.11 Switzerland
- 10.3.12 Sweden
11 China
- 11.1 China Mutual Capacitance Chip Market Size by Type
- 11.1.1 China Mutual Capacitance Chip Revenue by Type (2021-2032)
- 11.1.2 China Mutual Capacitance Chip Sales by Type (2021-2032)
- 11.1.3 China Mutual Capacitance Chip Price by Type (2021-2032)
- 11.2 China Mutual Capacitance Chip Market Size by Application
- 11.2.1 China Mutual Capacitance Chip Revenue by Application (2021-2032)
- 11.2.2 China Mutual Capacitance Chip Sales by Application (2021-2032)
- 11.2.3 China Mutual Capacitance Chip Price by Application (2021-2032)
12 Asia (Excluding China)
- 12.1 Asia Mutual Capacitance Chip Market Size by Type
- 12.1.1 Asia Mutual Capacitance Chip Revenue by Type (2021-2032)
- 12.1.2 Asia Mutual Capacitance Chip Sales by Type (2021-2032)
- 12.1.3 Asia Mutual Capacitance Chip Price by Type (2021-2032)
- 12.2 Asia Mutual Capacitance Chip Market Size by Application
- 12.2.1 Asia Mutual Capacitance Chip Revenue by Application (2021-2032)
- 12.2.2 Asia Mutual Capacitance Chip Sales by Application (2021-2032)
- 12.2.3 Asia Mutual Capacitance Chip Price by Application (2021-2032)
- 12.3 Asia Mutual Capacitance Chip Market Size by Country
- 12.3.1 Asia Mutual Capacitance Chip Revenue Grow Rate by Country (2021 VS 2025 VS 2032)
- 12.3.2 Asia Mutual Capacitance Chip Sales by Country (2021 VS 2025 VS 2032)
- 12.3.3 Asia Mutual Capacitance Chip Price by Country (2021-2032)
- 12.3.4 Japan
- 12.3.5 South Korea
- 12.3.6 India
- 12.3.7 Australia
- 12.3.8 Taiwan
- 12.3.9 Southeast Asia
13 South America, Middle East and Africa
- 13.1 SAMEA Mutual Capacitance Chip Market Size by Type
- 13.1.1 SAMEA Mutual Capacitance Chip Revenue by Type (2021-2032)
- 13.1.2 SAMEA Mutual Capacitance Chip Sales by Type (2021-2032)
- 13.1.3 SAMEA Mutual Capacitance Chip Price by Type (2021-2032)
- 13.2 SAMEA Mutual Capacitance Chip Market Size by Application
- 13.2.1 SAMEA Mutual Capacitance Chip Revenue by Application (2021-2032)
- 13.2.2 SAMEA Mutual Capacitance Chip Sales by Application (2021-2032)
- 13.2.3 SAMEA Mutual Capacitance Chip Price by Application (2021-2032)
- 13.3 SAMEA Mutual Capacitance Chip Market Size by Country
- 13.3.1 SAMEA Mutual Capacitance Chip Revenue Grow Rate by Country (2021 VS 2025 VS 2032)
- 13.3.2 SAMEA Mutual Capacitance Chip Sales by Country (2021 VS 2025 VS 2032)
- 13.3.3 SAMEA Mutual Capacitance Chip Price by Country (2021-2032)
- 13.3.4 Brazil
- 13.3.5 Argentina
- 13.3.6 Chile
- 13.3.7 Colombia
- 13.3.8 Peru
- 13.3.9 Saudi Arabia
- 13.3.10 Israel
- 13.3.11 UAE
- 13.3.12 Turkey
- 13.3.13 Iran
- 13.3.14 Egypt
14 Value Chain and Sales Channels Analysis
- 14.1 Mutual Capacitance Chip Value Chain Analysis
- 14.1.1 Mutual Capacitance Chip Key Raw Materials
- 14.1.2 Raw Materials Key Suppliers
- 14.1.3 Manufacturing Cost Structure
- 14.1.4 Mutual Capacitance Chip Production Mode & Process
- 14.2 Mutual Capacitance Chip Sales Channels Analysis
- 14.2.1 Direct Comparison with Distribution Share
- 14.2.2 Mutual Capacitance Chip Distributors
- 14.2.3 Mutual Capacitance Chip Customers
15 Concluding Insights
16 Appendix
- 16.1 Reasons for Doing This Study
- 16.2 Research Methodology
- 16.3 Research Process
- 16.4 Authors List of This Report
- 16.5 Data Source
- 16.5.1 Secondary Sources
- 16.5.2 Primary Sources
- 16.6 Disclaimer
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