Selected research
Market Structure
Global Contactless Power and Sensing ICs Market by Size, by Type, by Application, by Region, History and Forecast 2021-2032
Market perspective
The global Contactless Power and Sensing ICs market is projected to grow from US$ million in 2026 to US$ million by 2032, implying a CAGR of % over 2026-2032.
The US & Canada market for Contactless Power and Sensing ICs is projected to increase from US$ million in 2026 to US$ million by 2032, at a CAGR of % over 2026-2032.
The Europe market for Contactless Power and Sensing ICs is projected to increase from US$ million in 2026 to US$ million by 2032, at a CAGR of % over 2026-2032.
Read the full market overview
The Asia Pacific market for Contactless Power and Sensing ICs is projected to increase from US$ million in 2026 to US$ million by 2032, at a CAGR of % over 2026-2032.
The China market for Contactless Power and Sensing ICs is projected to increase from US$ million in 2026 to US$ million by 2032, at a CAGR of % over 2026-2032.
Leading global manufacturers of Contactless Power and Sensing ICs include Analog Devices (ADI), ams OSRAM, Broadcom Inc., Cirrus Logic, Texas Instruments (TI), Infineon Technologies, Maxim Integrated (now part of Analog Devices), Microchip Technology and NXP Semiconductors, among others. In 2025, the top three vendors together accounted for approximately % of global revenue.
On the production side, the report examines Contactless Power and Sensing ICs output, growth rates, and market shares by manufacturer and by region (at regional and country level) for 2021-2026, with forecasts through 2032.
On the consumption side, the report analyzes sales of Contactless Power and Sensing ICs by region (regional and country level), company, type, and application for 2021-2026 and provides forecasts through 2032.
The report provides an overview of the global Contactless Power and Sensing ICs market in terms of capacity, output, revenue, and price, analyzing global market trends using historical revenue and sales data for 2021-2025, estimates for 2026, and projected CAGRs through 2032.
The study covers key producers of Contactless Power and Sensing ICs and consumption patterns in major regions and countries, assesses future market potential, and highlights priority regions and countries for segmenting the market into sub-sectors, with country-specific market value data for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, the Middle East, Africa, and other countries.
The report also presents Contactless Power and Sensing ICs sales, revenue, market share, and industry ranking for the main manufacturers for 2021-2026, identifies the major stakeholders in the global market, and analyzes their competitive landscape and market positioning based on recent developments and segmental revenues.
In addition, the report analyzes segment data by type and application—covering sales, revenue, and price—for 2021-2032, and evaluates and forecasts the Contactless Power and Sensing ICs market size, projected growth trends, production technologies, key applications, and end-use industries.
Contactless Power and Sensing ICs Segment by Company
Analog Devices (ADI)
ams OSRAM
Broadcom Inc.
Cirrus Logic
Texas Instruments (TI)
Infineon Technologies
Maxim Integrated (now part of Analog Devices)
Microchip Technology
NXP Semiconductors
ON Semiconductor (onsemi)
Powercast Corporation
Renesas Electronics
ROHM Semiconductor
STMicroelectronics
Contactless Power and Sensing ICs Segment by Type
Low Power (<1w)
Medium Power (1–10w)
High Frequency and High Power (>10w)
Contactless Power and Sensing ICs Segment by Application
Automotive
Medical
Consumer Electronics
Other
Contactless Power and Sensing ICs Segment by Region
North America
United States
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Spain
Netherlands
Switzerland
Sweden
Poland
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Southeast Asia
South America
Brazil
Argentina
Chile
Middle East & Africa
Egypt
South Africa
Israel
Türkiye
GCC Countries
Study Objectives
1. To analyze and research the global status and future forecast, involving, production, value, consumption, growth rate (CAGR), market share, historical and forecast.
2. To present the key manufacturers, capacity, production, revenue, market share, and Recent Developments.
3. To split the breakdown data by regions, type, manufacturers, and Application.
4. To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints, and risks.
5. To identify significant trends, drivers, influence factors in global and regions.
6. To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
Reasons to Buy This Report
1. This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global Contactless Power and Sensing ICs market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.
2. This report will help stakeholders to understand the global industry status and trends of Contactless Power and Sensing ICs and provides them with information on key market drivers, restraints, challenges, and opportunities.
3. This report will help stakeholders to understand competitors better and gain more insights to strengthen their position in their businesses. The competitive landscape section includes the market share and rank (in volume and value), competitor ecosystem, new product development, expansion, and acquisition.
4. This report stays updated with novel technology integration, features, and the latest developments in the market.
5. This report helps stakeholders to gain insights into which regions to target globally.
6. This report helps stakeholders to gain insights into the end-user perception concerning the adoption of Contactless Power and Sensing ICs.
7. This report helps stakeholders to identify some of the key players in the market and understand their valuable contribution.
Chapter Outline
Chapter 1: Provides an overview of the Contactless Power and Sensing ICs market, including product definition, global market growth prospects, production value, capacity, and average price forecasts (2021-2032).
Chapter 2: Analysis key trends, drivers, challenges, and opportunities within the global Contactless Power and Sensing ICs industry.
Chapter 3: Detailed analysis of Contactless Power and Sensing ICs market competition landscape. Including Contactless Power and Sensing ICs manufacturers' output value, output and average price from 2021 to 2026, as well as competition analysis indicators such as origin, product type, application, merger and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 7: Production/Production Value of Contactless Power and Sensing ICs by region. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 8: Consumption of Contactless Power and Sensing ICs in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 9: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 10: Concluding Insights of the report.
More report detail
Tables and figures
Scope & coverage.
Types
- Low Power (<1w)
- Medium Power (1–10w)
- High Frequency and High Power (>10w)
Applications
- Automotive
- Medical
- Consumer Electronics
- Other
Companies covered
- Analog Devices (ADI)
- ams OSRAM
- Broadcom Inc.
- Cirrus Logic
- Texas Instruments (TI)
- Infineon Technologies
- Maxim Integrated (now part of Analog Devices)
- Microchip Technology
- NXP Semiconductors
- ON Semiconductor (onsemi)
- Powercast Corporation
- Renesas Electronics
- ROHM Semiconductor
- STMicroelectronics
Inside the report.
1 Market Overview
- 1.1 Product Definition
- 1.2 Global Market Growth Prospects
- 1.2.1 Global Contactless Power and Sensing ICs Production Value Estimates and Forecasts (2021-2032)
- 1.2.2 Global Contactless Power and Sensing ICs Production Capacity Estimates and Forecasts (2021-2032)
- 1.2.3 Global Contactless Power and Sensing ICs Production Estimates and Forecasts (2021-2032)
- 1.2.4 Global Contactless Power and Sensing ICs Market Average Price (2021-2032)
- 1.3 Assumptions and Limitations
- 1.4 Study Goals and Objectives
2 Global Contactless Power and Sensing ICs Market Dynamics
- 2.1 Contactless Power and Sensing ICs Industry Trends
- 2.2 Contactless Power and Sensing ICs Industry Drivers
- 2.3 Contactless Power and Sensing ICs Industry Opportunities and Challenges
- 2.4 Contactless Power and Sensing ICs Industry Restraints
3 Contactless Power and Sensing ICs Market by Manufacturers
- 3.1 Global Contactless Power and Sensing ICs Production Value by Manufacturers (2021-2026)
- 3.2 Global Contactless Power and Sensing ICs Production by Manufacturers (2021-2026)
- 3.3 Global Contactless Power and Sensing ICs Average Price by Manufacturers (2021-2026)
- 3.4 Global Contactless Power and Sensing ICs Industry Manufacturers Ranking, 2024 VS 2025 VS 2026
- 3.5 Global Contactless Power and Sensing ICs Key Manufacturers Manufacturing Sites & Headquarters
- 3.6 Global Contactless Power and Sensing ICs Manufacturers, Product Type & Application
- 3.7 Global Contactless Power and Sensing ICs Manufacturers Established Date
- 3.8 Market Competitive Analysis
- 3.8.1 Global Contactless Power and Sensing ICs Market CR5 and HHI
- 3.8.2 Global Top 5 and 10 Contactless Power and Sensing ICs Players Market Share by Production Value in 2025
- 3.8.3 2025 Contactless Power and Sensing ICs Tier 1, Tier 2, and Tier 3
4 Contactless Power and Sensing ICs Market by Type
- 4.1 Contactless Power and Sensing ICs Type Introduction
- 4.1.1 Low Power (<1w)
- 4.1.2 Medium Power (1–10w)
- 4.1.3 High Frequency and High Power (>10w)
- 4.2 Global Contactless Power and Sensing ICs Production by Type
- 4.2.1 Global Contactless Power and Sensing ICs Production by Type (2021 VS 2025 VS 2032)
- 4.2.2 Global Contactless Power and Sensing ICs Production by Type (2021-2032)
- 4.2.3 Global Contactless Power and Sensing ICs Production Market Share by Type (2021-2032)
- 4.3 Global Contactless Power and Sensing ICs Production Value by Type
- 4.3.1 Global Contactless Power and Sensing ICs Production Value by Type (2021 VS 2025 VS 2032)
- 4.3.2 Global Contactless Power and Sensing ICs Production Value by Type (2021-2032)
- 4.3.3 Global Contactless Power and Sensing ICs Production Value Market Share by Type (2021-2032)
5 Contactless Power and Sensing ICs Market by Application
- 5.1 Contactless Power and Sensing ICs Application Introduction
- 5.1.1 Automotive
- 5.1.2 Medical
- 5.1.3 Consumer Electronics
- 5.1.4 Other
- 5.2 Global Contactless Power and Sensing ICs Production by Application
- 5.2.1 Global Contactless Power and Sensing ICs Production by Application (2021 VS 2025 VS 2032)
- 5.2.2 Global Contactless Power and Sensing ICs Production by Application (2021-2032)
- 5.2.3 Global Contactless Power and Sensing ICs Production Market Share by Application (2021-2032)
- 5.3 Global Contactless Power and Sensing ICs Production Value by Application
- 5.3.1 Global Contactless Power and Sensing ICs Production Value by Application (2021 VS 2025 VS 2032)
- 5.3.2 Global Contactless Power and Sensing ICs Production Value by Application (2021-2032)
- 5.3.3 Global Contactless Power and Sensing ICs Production Value Market Share by Application (2021-2032)
6 Company Profiles
- 6.1 Analog Devices (ADI)
- 6.1.1 Analog Devices (ADI) Company Information
- 6.1.2 Analog Devices (ADI) Business Overview
- 6.1.3 Analog Devices (ADI) Contactless Power and Sensing ICs Production, Value and Gross Margin (2021-2026)
- 6.1.4 Analog Devices (ADI) Contactless Power and Sensing ICs Product Portfolio
- 6.1.5 Analog Devices (ADI) Recent Developments
- 6.2 ams OSRAM
- 6.2.1 ams OSRAM Company Information
- 6.2.2 ams OSRAM Business Overview
- 6.2.3 ams OSRAM Contactless Power and Sensing ICs Production, Value and Gross Margin (2021-2026)
- 6.2.4 ams OSRAM Contactless Power and Sensing ICs Product Portfolio
- 6.2.5 ams OSRAM Recent Developments
- 6.3 Broadcom Inc.
- 6.3.1 Broadcom Inc. Company Information
- 6.3.2 Broadcom Inc. Business Overview
- 6.3.3 Broadcom Inc. Contactless Power and Sensing ICs Production, Value and Gross Margin (2021-2026)
- 6.3.4 Broadcom Inc. Contactless Power and Sensing ICs Product Portfolio
- 6.3.5 Broadcom Inc. Recent Developments
- 6.4 Cirrus Logic
- 6.4.1 Cirrus Logic Company Information
- 6.4.2 Cirrus Logic Business Overview
- 6.4.3 Cirrus Logic Contactless Power and Sensing ICs Production, Value and Gross Margin (2021-2026)
- 6.4.4 Cirrus Logic Contactless Power and Sensing ICs Product Portfolio
- 6.4.5 Cirrus Logic Recent Developments
- 6.5 Texas Instruments (TI)
- 6.5.1 Texas Instruments (TI) Company Information
- 6.5.2 Texas Instruments (TI) Business Overview
- 6.5.3 Texas Instruments (TI) Contactless Power and Sensing ICs Production, Value and Gross Margin (2021-2026)
- 6.5.4 Texas Instruments (TI) Contactless Power and Sensing ICs Product Portfolio
- 6.5.5 Texas Instruments (TI) Recent Developments
- 6.6 Infineon Technologies
- 6.6.1 Infineon Technologies Company Information
- 6.6.2 Infineon Technologies Business Overview
- 6.6.3 Infineon Technologies Contactless Power and Sensing ICs Production, Value and Gross Margin (2021-2026)
- 6.6.4 Infineon Technologies Contactless Power and Sensing ICs Product Portfolio
- 6.6.5 Infineon Technologies Recent Developments
- 6.7 Maxim Integrated (now part of Analog Devices)
- 6.7.1 Maxim Integrated (now part of Analog Devices) Company Information
- 6.7.2 Maxim Integrated (now part of Analog Devices) Business Overview
- 6.7.3 Maxim Integrated (now part of Analog Devices) Contactless Power and Sensing ICs Production, Value and Gross Margin (2021-2026)
- 6.7.4 Maxim Integrated (now part of Analog Devices) Contactless Power and Sensing ICs Product Portfolio
- 6.7.5 Maxim Integrated (now part of Analog Devices) Recent Developments
- 6.8 Microchip Technology
- 6.8.1 Microchip Technology Company Information
- 6.8.2 Microchip Technology Business Overview
- 6.8.3 Microchip Technology Contactless Power and Sensing ICs Production, Value and Gross Margin (2021-2026)
- 6.8.4 Microchip Technology Contactless Power and Sensing ICs Product Portfolio
- 6.8.5 Microchip Technology Recent Developments
- 6.9 NXP Semiconductors
- 6.9.1 NXP Semiconductors Company Information
- 6.9.2 NXP Semiconductors Business Overview
- 6.9.3 NXP Semiconductors Contactless Power and Sensing ICs Production, Value and Gross Margin (2021-2026)
- 6.9.4 NXP Semiconductors Contactless Power and Sensing ICs Product Portfolio
- 6.9.5 NXP Semiconductors Recent Developments
- 6.10 ON Semiconductor (onsemi)
- 6.10.1 ON Semiconductor (onsemi) Company Information
- 6.10.2 ON Semiconductor (onsemi) Business Overview
- 6.10.3 ON Semiconductor (onsemi) Contactless Power and Sensing ICs Production, Value and Gross Margin (2021-2026)
- 6.10.4 ON Semiconductor (onsemi) Contactless Power and Sensing ICs Product Portfolio
- 6.10.5 ON Semiconductor (onsemi) Recent Developments
- 6.11 Powercast Corporation
- 6.11.1 Powercast Corporation Company Information
- 6.11.2 Powercast Corporation Business Overview
- 6.11.3 Powercast Corporation Contactless Power and Sensing ICs Production, Value and Gross Margin (2021-2026)
- 6.11.4 Powercast Corporation Contactless Power and Sensing ICs Product Portfolio
- 6.11.5 Powercast Corporation Recent Developments
- 6.12 Renesas Electronics
- 6.12.1 Renesas Electronics Company Information
- 6.12.2 Renesas Electronics Business Overview
- 6.12.3 Renesas Electronics Contactless Power and Sensing ICs Production, Value and Gross Margin (2021-2026)
- 6.12.4 Renesas Electronics Contactless Power and Sensing ICs Product Portfolio
- 6.12.5 Renesas Electronics Recent Developments
- 6.13 ROHM Semiconductor
- 6.13.1 ROHM Semiconductor Company Information
- 6.13.2 ROHM Semiconductor Business Overview
- 6.13.3 ROHM Semiconductor Contactless Power and Sensing ICs Production, Value and Gross Margin (2021-2026)
- 6.13.4 ROHM Semiconductor Contactless Power and Sensing ICs Product Portfolio
- 6.13.5 ROHM Semiconductor Recent Developments
- 6.14 STMicroelectronics
- 6.14.1 STMicroelectronics Company Information
- 6.14.2 STMicroelectronics Business Overview
- 6.14.3 STMicroelectronics Contactless Power and Sensing ICs Production, Value and Gross Margin (2021-2026)
- 6.14.4 STMicroelectronics Contactless Power and Sensing ICs Product Portfolio
- 6.14.5 STMicroelectronics Recent Developments
7 Global Contactless Power and Sensing ICs Production by Region
- 7.1 Global Contactless Power and Sensing ICs Production by Region: 2021 VS 2025 VS 2032
- 7.2 Global Contactless Power and Sensing ICs Production by Region (2021-2032)
- 7.2.1 Global Contactless Power and Sensing ICs Production by Region (2021-2026)
- 7.2.2 Global Contactless Power and Sensing ICs Production Forecast by Region (2027-2032)
- 7.3 Global Contactless Power and Sensing ICs Production by Region: 2021 VS 2025 VS 2032
- 7.4 Global Contactless Power and Sensing ICs Production Value by Region (2021-2032)
- 7.4.1 Global Contactless Power and Sensing ICs Production Value by Region (2021-2026)
- 7.4.2 Global Contactless Power and Sensing ICs Production Value by Region (2027-2032)
- 7.5 Global Contactless Power and Sensing ICs Market Price Analysis by Region (2021-2032)
- 7.6 Regional Production Value Trends (2021-2032)
- 7.6.1 North America Contactless Power and Sensing ICs Production Value (2021-2032)
- 7.6.2 Europe Contactless Power and Sensing ICs Production Value (2021-2032)
- 7.6.3 Asia-Pacific Contactless Power and Sensing ICs Production Value (2021-2032)
- 7.6.4 South America Contactless Power and Sensing ICs Production Value (2021-2032)
- 7.6.5 Middle East & Africa Contactless Power and Sensing ICs Production Value (2021-2032)
8 Global Contactless Power and Sensing ICs Consumption by Region
- 8.1 Global Contactless Power and Sensing ICs Consumption by Region: 2021 VS 2025 VS 2032
- 8.2 Global Contactless Power and Sensing ICs Consumption by Region (2021-2032)
- 8.2.1 Global Contactless Power and Sensing ICs Consumption by Region (2021-2026)
- 8.2.2 Global Contactless Power and Sensing ICs Consumption by Region (2027-2032)
- 8.3 North America
- 8.3.1 North America Contactless Power and Sensing ICs Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 8.3.2 North America Contactless Power and Sensing ICs Consumption by Country (2021-2032)
- 8.3.3 U.S.
- 8.3.4 Canada
- 8.3.5 Mexico
- 8.4 Europe
- 8.4.1 Europe Contactless Power and Sensing ICs Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 8.4.2 Europe Contactless Power and Sensing ICs Consumption by Country (2021-2032)
- 8.4.3 Germany
- 8.4.4 France
- 8.4.5 U.K.
- 8.4.6 Italy
- 8.4.7 Netherlands
- 8.5 Asia Pacific
- 8.5.1 Asia Pacific Contactless Power and Sensing ICs Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 8.5.2 Asia Pacific Contactless Power and Sensing ICs Consumption by Country (2021-2032)
- 8.5.3 China
- 8.5.4 Japan
- 8.5.5 South Korea
- 8.5.6 Southeast Asia
- 8.5.7 India
- 8.5.8 Australia
- 8.6 South America
- 8.6.1 South America Contactless Power and Sensing ICs Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 8.6.2 South America Contactless Power and Sensing ICs Consumption by Country (2021-2032)
- 8.6.3 Brazil
- 8.6.4 Argentina
- 8.6.5 Chile
- 8.6.6 Colombia
- 8.7 Middle East & Africa
- 8.7.1 Middle East & Africa Contactless Power and Sensing ICs Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 8.7.2 Middle East & Africa Contactless Power and Sensing ICs Consumption by Country (2021-2032)
- 8.7.3 Egypt
- 8.7.4 South Africa
- 8.7.5 Israel
- 8.7.6 Türkiye
- 8.7.7 GCC Countries
9 Value Chain and Sales Channels Analysis
- 9.1 Contactless Power and Sensing ICs Value Chain Analysis
- 9.1.1 Contactless Power and Sensing ICs Key Raw Materials
- 9.1.2 Raw Materials Key Suppliers
- 9.1.3 Manufacturing Cost Structure
- 9.1.4 Contactless Power and Sensing ICs Production Mode & Process
- 9.2 Contactless Power and Sensing ICs Sales Channels Analysis
- 9.2.1 Direct Comparison with Distribution Share
- 9.2.2 Contactless Power and Sensing ICs Distributors
- 9.2.3 Contactless Power and Sensing ICs Customers
10 Concluding Insights
11 Appendix
- 11.1 Reasons for Doing This Study
- 11.2 Research Methodology
- 11.3 Research Process
- 11.4 Authors List of This Report
- 11.5 Data Source
- 11.5.1 Secondary Sources
- 11.5.2 Primary Sources
- 11.6 Disclaimer
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