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Industry Research
Contactless Power and Sensing ICs Industry Research Report 2026
Market perspective
The global Contactless Power and Sensing ICs market was valued at US$ million in 2025 and is projected to reach US$ million by 2032, implying a CAGR of % over 2026–2032.
The North America market for Contactless Power and Sensing ICs is forecast to increase from US$ million in 2026 to US$ million by 2032, corresponding to a CAGR of % over 2026–2032.
The Europe market for Contactless Power and Sensing ICs is projected to rise from US$ million in 2026 to US$ million by 2032, registering a CAGR of % over 2026–2032.
Read the full market overview
The Asia Pacific market for Contactless Power and Sensing ICs is expected to grow from US$ million in 2026 to US$ million by 2032, at a CAGR of % over 2026–2032.
Leading global manufacturers of Contactless Power and Sensing ICs include , among others. In 2025, the top three vendors together accounted for approximately % of global revenue.
Report Scope
This report quantifies the global Contactless Power and Sensing ICs market in revenue (US$ million) and, where applicable, sales volume (k units), using 2025 as the base year and providing annual historical and forecast data for 2021–2032.
It standardizes definitions of types and applications, harmonizes vendor attribution, and presents comparable time series by company, type, application, and region/country, including indicative price bands (US$/k units) and concentration ratios (CR5/CR10).
The outputs are intended to support strategy development, budgeting, and performance benchmarking for manufacturers, new entrants, channel partners, and investors; the report also reviews technology shifts and notable product introductions relevant to Contactless Power and Sensing ICs.
Key Companies & Market Share Insights
This section profiles leading manufacturers, combining 2021–2025 results with a 2026–2032 outlook. It reports revenue, market share, price bands, product and application mix, regional and channel mix, and key developments (M&A, capacity additions, certifications). It also provides global revenue, average price, and—where applicable—sales volume by manufacturer, and calculates CR5/CR10 and rank changes to support comparative benchmarking.
Contactless Power and Sensing ICs Market by Company
Analog Devices (ADI)
ams OSRAM
Broadcom Inc.
Cirrus Logic
Texas Instruments (TI)
Infineon Technologies
Maxim Integrated (now part of Analog Devices)
Microchip Technology
NXP Semiconductors
ON Semiconductor (onsemi)
Powercast Corporation
Renesas Electronics
ROHM Semiconductor
STMicroelectronics
Contactless Power and Sensing ICs Segment by Type
Low Power (<1w)
Medium Power (1–10w)
High Frequency and High Power (>10w)
Contactless Power and Sensing ICs Segment by Application
Automotive
Medical
Consumer Electronics
Other
Contactless Power and Sensing ICs Segment by Region
North America
United States
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Spain
Netherlands
Switzerland
Sweden
Poland
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Southeast Asia
South America
Brazil
Argentina
Chile
Middle East & Africa
Egypt
South Africa
Israel
Türkiye
GCC Countries
Key Drivers & Barriers
High-impact rendering factors and drivers have been studied in this report to aid the readers to understand the general development. Moreover, the report includes restraints and challenges that may act as stumbling blocks on the way of the players. This will assist the users to be attentive and make informed decisions related to business. Specialists have also laid their focus on the upcoming business prospects.
Reasons to Buy This Report
1. This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global Contactless Power and Sensing ICs market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.
2. This report will help stakeholders to understand the global industry status and trends of Contactless Power and Sensing ICs and provides them with information on key market drivers, restraints, challenges, and opportunities.
3. This report will help stakeholders to understand competitors better and gain more insights to strengthen their position in their businesses. The competitive landscape section includes the market share and rank (in volume and value), competitor ecosystem, new product development, expansion, and acquisition.
4. This report stays updated with novel technology integration, features, and the latest developments in the market
5. This report helps stakeholders to gain insights into which regions to target globally
6. This report helps stakeholders to gain insights into the end-user perception concerning the adoption of Contactless Power and Sensing ICs.
7. This report helps stakeholders to identify some of the key players in the market and understand their valuable contribution.
Chapter Outline
Chapter 1: Research objectives, research methods, data sources, data cross-validation;
Chapter 2: Introduces the report scope of the report, executive summary of different market segments (by region, product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 3: Detailed analysis of Contactless Power and Sensing ICs manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 5: Production/output, value of Contactless Power and Sensing ICs by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 6: Consumption of Contactless Power and Sensing ICs in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 7: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 8: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 9: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 10: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 11: The main points and conclusions of the report.
More report detail
Tables and figures
Scope & coverage.
Types
- Low Power (<1w)
- Medium Power (1–10w)
- High Frequency and High Power (>10w)
Applications
- Automotive
- Medical
- Consumer Electronics
- Other
Companies covered
- Analog Devices (ADI)
- ams OSRAM
- Broadcom Inc.
- Cirrus Logic
- Texas Instruments (TI)
- Infineon Technologies
- Maxim Integrated (now part of Analog Devices)
- Microchip Technology
- NXP Semiconductors
- ON Semiconductor (onsemi)
- Powercast Corporation
- Renesas Electronics
- ROHM Semiconductor
- STMicroelectronics
Inside the report.
1 Preface
- 1.1 Scope of Report
- 1.2 Reasons for Doing This Study
- 1.3 Research Methodology
- 1.4 Research Process
- 1.5 Data Source
- 1.5.1 Secondary Sources
- 1.5.2 Primary Sources
2 Market Overview
- 2.1 Product Definition
- 2.2 Contactless Power and Sensing ICs by Type
- 2.2.1 Market Value Comparison by Type (2021 VS 2025 VS 2032) & (US$ Million)
- 2.2.2 Low Power (<1w)
- 2.2.3 Medium Power (1–10w)
- 2.2.4 High Frequency and High Power (>10w)
- 2.3 Contactless Power and Sensing ICs by Application
- 2.3.1 Market Value Comparison by Application (2021 VS 2025 VS 2032) & (US$ Million)
- 2.3.2 Automotive
- 2.3.3 Medical
- 2.3.4 Consumer Electronics
- 2.3.5 Other
- 2.4 Global Market Growth Prospects
- 2.4.1 Global Contactless Power and Sensing ICs Production Value Estimates and Forecasts (2021-2032)
- 2.4.2 Global Contactless Power and Sensing ICs Production Capacity Estimates and Forecasts (2021-2032)
- 2.4.3 Global Contactless Power and Sensing ICs Production Estimates and Forecasts (2021-2032)
- 2.4.4 Global Contactless Power and Sensing ICs Market Average Price (2021-2032)
3 Market Competitive Landscape by Manufacturers
- 3.1 Global Contactless Power and Sensing ICs Production by Manufacturers (2021-2026)
- 3.2 Global Contactless Power and Sensing ICs Production Value by Manufacturers (2021-2026)
- 3.3 Global Contactless Power and Sensing ICs Average Price by Manufacturers (2021-2026)
- 3.4 Global Contactless Power and Sensing ICs Industry Manufacturers Ranking, 2024 VS 2025 VS 2026
- 3.5 Global Contactless Power and Sensing ICs Key Manufacturers, Manufacturing Sites & Headquarters
- 3.6 Global Contactless Power and Sensing ICs Manufacturers, Product Type & Application
- 3.7 Global Contactless Power and Sensing ICs Manufacturers Established Date
- 3.8 Global Contactless Power and Sensing ICs Market CR5 and HHI
- 3.9 Global Manufacturers Mergers & Acquisition
4 Manufacturers Profiled
- 4.1 Analog Devices (ADI)
- 4.1.1 Analog Devices (ADI) Contactless Power and Sensing ICs Company Information
- 4.1.2 Analog Devices (ADI) Contactless Power and Sensing ICs Business Overview
- 4.1.3 Analog Devices (ADI) Contactless Power and Sensing ICs Production, Value and Gross Margin (2021-2026)
- 4.1.4 Analog Devices (ADI) Product Portfolio
- 4.1.5 Analog Devices (ADI) Recent Developments
- 4.2 ams OSRAM
- 4.2.1 ams OSRAM Contactless Power and Sensing ICs Company Information
- 4.2.2 ams OSRAM Contactless Power and Sensing ICs Business Overview
- 4.2.3 ams OSRAM Contactless Power and Sensing ICs Production, Value and Gross Margin (2021-2026)
- 4.2.4 ams OSRAM Product Portfolio
- 4.2.5 ams OSRAM Recent Developments
- 4.3 Broadcom Inc.
- 4.3.1 Broadcom Inc. Contactless Power and Sensing ICs Company Information
- 4.3.2 Broadcom Inc. Contactless Power and Sensing ICs Business Overview
- 4.3.3 Broadcom Inc. Contactless Power and Sensing ICs Production, Value and Gross Margin (2021-2026)
- 4.3.4 Broadcom Inc. Product Portfolio
- 4.3.5 Broadcom Inc. Recent Developments
- 4.4 Cirrus Logic
- 4.4.1 Cirrus Logic Contactless Power and Sensing ICs Company Information
- 4.4.2 Cirrus Logic Contactless Power and Sensing ICs Business Overview
- 4.4.3 Cirrus Logic Contactless Power and Sensing ICs Production, Value and Gross Margin (2021-2026)
- 4.4.4 Cirrus Logic Product Portfolio
- 4.4.5 Cirrus Logic Recent Developments
- 4.5 Texas Instruments (TI)
- 4.5.1 Texas Instruments (TI) Contactless Power and Sensing ICs Company Information
- 4.5.2 Texas Instruments (TI) Contactless Power and Sensing ICs Business Overview
- 4.5.3 Texas Instruments (TI) Contactless Power and Sensing ICs Production, Value and Gross Margin (2021-2026)
- 4.5.4 Texas Instruments (TI) Product Portfolio
- 4.5.5 Texas Instruments (TI) Recent Developments
- 4.6 Infineon Technologies
- 4.6.1 Infineon Technologies Contactless Power and Sensing ICs Company Information
- 4.6.2 Infineon Technologies Contactless Power and Sensing ICs Business Overview
- 4.6.3 Infineon Technologies Contactless Power and Sensing ICs Production, Value and Gross Margin (2021-2026)
- 4.6.4 Infineon Technologies Product Portfolio
- 4.6.5 Infineon Technologies Recent Developments
- 4.7 Maxim Integrated (now part of Analog Devices)
- 4.7.1 Maxim Integrated (now part of Analog Devices) Contactless Power and Sensing ICs Company Information
- 4.7.2 Maxim Integrated (now part of Analog Devices) Contactless Power and Sensing ICs Business Overview
- 4.7.3 Maxim Integrated (now part of Analog Devices) Contactless Power and Sensing ICs Production, Value and Gross Margin (2021-2026)
- 4.7.4 Maxim Integrated (now part of Analog Devices) Product Portfolio
- 4.7.5 Maxim Integrated (now part of Analog Devices) Recent Developments
- 4.8 Microchip Technology
- 4.8.1 Microchip Technology Contactless Power and Sensing ICs Company Information
- 4.8.2 Microchip Technology Contactless Power and Sensing ICs Business Overview
- 4.8.3 Microchip Technology Contactless Power and Sensing ICs Production, Value and Gross Margin (2021-2026)
- 4.8.4 Microchip Technology Product Portfolio
- 4.8.5 Microchip Technology Recent Developments
- 4.9 NXP Semiconductors
- 4.9.1 NXP Semiconductors Contactless Power and Sensing ICs Company Information
- 4.9.2 NXP Semiconductors Contactless Power and Sensing ICs Business Overview
- 4.9.3 NXP Semiconductors Contactless Power and Sensing ICs Production, Value and Gross Margin (2021-2026)
- 4.9.4 NXP Semiconductors Product Portfolio
- 4.9.5 NXP Semiconductors Recent Developments
- 4.10 ON Semiconductor (onsemi)
- 4.10.1 ON Semiconductor (onsemi) Contactless Power and Sensing ICs Company Information
- 4.10.2 ON Semiconductor (onsemi) Contactless Power and Sensing ICs Business Overview
- 4.10.3 ON Semiconductor (onsemi) Contactless Power and Sensing ICs Production, Value and Gross Margin (2021-2026)
- 4.10.4 ON Semiconductor (onsemi) Product Portfolio
- 4.10.5 ON Semiconductor (onsemi) Recent Developments
- 4.11 Powercast Corporation
- 4.11.1 Powercast Corporation Contactless Power and Sensing ICs Company Information
- 4.11.2 Powercast Corporation Contactless Power and Sensing ICs Business Overview
- 4.11.3 Powercast Corporation Contactless Power and Sensing ICs Production, Value and Gross Margin (2021-2026)
- 4.11.4 Powercast Corporation Product Portfolio
- 4.11.5 Powercast Corporation Recent Developments
- 4.12 Renesas Electronics
- 4.12.1 Renesas Electronics Contactless Power and Sensing ICs Company Information
- 4.12.2 Renesas Electronics Contactless Power and Sensing ICs Business Overview
- 4.12.3 Renesas Electronics Contactless Power and Sensing ICs Production, Value and Gross Margin (2021-2026)
- 4.12.4 Renesas Electronics Product Portfolio
- 4.12.5 Renesas Electronics Recent Developments
- 4.13 ROHM Semiconductor
- 4.13.1 ROHM Semiconductor Contactless Power and Sensing ICs Company Information
- 4.13.2 ROHM Semiconductor Contactless Power and Sensing ICs Business Overview
- 4.13.3 ROHM Semiconductor Contactless Power and Sensing ICs Production, Value and Gross Margin (2021-2026)
- 4.13.4 ROHM Semiconductor Product Portfolio
- 4.13.5 ROHM Semiconductor Recent Developments
- 4.14 STMicroelectronics
- 4.14.1 STMicroelectronics Contactless Power and Sensing ICs Company Information
- 4.14.2 STMicroelectronics Contactless Power and Sensing ICs Business Overview
- 4.14.3 STMicroelectronics Contactless Power and Sensing ICs Production, Value and Gross Margin (2021-2026)
- 4.14.4 STMicroelectronics Product Portfolio
- 4.14.5 STMicroelectronics Recent Developments
5 Global Contactless Power and Sensing ICs Production by Region
- 5.1 Global Contactless Power and Sensing ICs Production Estimates and Forecasts by Region: 2021 VS 2025 VS 2032
- 5.2 Global Contactless Power and Sensing ICs Production by Region: 2021-2032
- 5.2.1 Global Contactless Power and Sensing ICs Production by Region: 2021-2026
- 5.2.2 Global Contactless Power and Sensing ICs Production Forecast by Region (2027-2032)
- 5.3 Global Contactless Power and Sensing ICs Production Value Estimates and Forecasts by Region: 2021 VS 2025 VS 2032
- 5.4 Global Contactless Power and Sensing ICs Production Value by Region: 2021-2032
- 5.4.1 Global Contactless Power and Sensing ICs Production Value by Region: 2021-2026
- 5.4.2 Global Contactless Power and Sensing ICs Production Value Forecast by Region (2027-2032)
- 5.5 Global Contactless Power and Sensing ICs Market Price Analysis by Region (2021-2026)
- 5.6 Global Contactless Power and Sensing ICs Production and Value, YOY Growth
- 5.6.1 North America Contactless Power and Sensing ICs Production Value Estimates and Forecasts (2021-2032)
- 5.6.2 Europe Contactless Power and Sensing ICs Production Value Estimates and Forecasts (2021-2032)
- 5.6.3 China Contactless Power and Sensing ICs Production Value Estimates and Forecasts (2021-2032)
- 5.6.4 Japan Contactless Power and Sensing ICs Production Value Estimates and Forecasts (2021-2032)
- 5.6.5 South Korea Contactless Power and Sensing ICs Production Value Estimates and Forecasts (2021-2032)
6 Global Contactless Power and Sensing ICs Consumption by Region
- 6.1 Global Contactless Power and Sensing ICs Consumption Estimates and Forecasts by Region: 2021 VS 2025 VS 2032
- 6.2 Global Contactless Power and Sensing ICs Consumption by Region (2021-2032)
- 6.2.1 Global Contactless Power and Sensing ICs Consumption by Region: 2021-2026
- 6.2.2 Global Contactless Power and Sensing ICs Forecasted Consumption by Region (2027-2032)
- 6.3 North America
- 6.3.1 North America Contactless Power and Sensing ICs Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 6.3.2 North America Contactless Power and Sensing ICs Consumption by Country (2021-2032)
- 6.3.3 United States
- 6.3.4 Canada
- 6.3.5 Mexico
- 6.4 Europe
- 6.4.1 Europe Contactless Power and Sensing ICs Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 6.4.2 Europe Contactless Power and Sensing ICs Consumption by Country (2021-2032)
- 6.4.3 Germany
- 6.4.4 France
- 6.4.5 U.K.
- 6.4.6 Italy
- 6.4.7 Russia
- 6.4.8 Spain
- 6.4.9 Netherlands
- 6.4.10 Switzerland
- 6.4.11 Sweden
- 6.4.12 Poland
- 6.5 Asia Pacific
- 6.5.1 Asia Pacific Contactless Power and Sensing ICs Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 6.5.2 Asia Pacific Contactless Power and Sensing ICs Consumption by Country (2021-2032)
- 6.5.3 China
- 6.5.4 Japan
- 6.5.5 South Korea
- 6.5.6 India
- 6.5.7 Australia
- 6.5.8 Taiwan
- 6.5.9 Southeast Asia
- 6.6 South America, Middle East & Africa
- 6.6.1 South America, Middle East & Africa Contactless Power and Sensing ICs Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 6.6.2 South America, Middle East & Africa Contactless Power and Sensing ICs Consumption by Country (2021-2032)
- 6.6.3 Brazil
- 6.6.4 Argentina
- 6.6.5 Chile
- 6.6.6 Turkey
- 6.6.7 GCC Countries
7 Segment by Type
- 7.1 Global Contactless Power and Sensing ICs Production by Type (2021-2032)
- 7.1.1 Global Contactless Power and Sensing ICs Production by Type (2021-2032) & (k units)
- 7.1.2 Global Contactless Power and Sensing ICs Production Market Share by Type (2021-2032)
- 7.2 Global Contactless Power and Sensing ICs Production Value by Type (2021-2032)
- 7.2.1 Global Contactless Power and Sensing ICs Production Value by Type (2021-2032) & (US$ Million)
- 7.2.2 Global Contactless Power and Sensing ICs Production Value Market Share by Type (2021-2032)
- 7.3 Global Contactless Power and Sensing ICs Price by Type (2021-2032)
8 Segment by Application
- 8.1 Global Contactless Power and Sensing ICs Production by Application (2021-2032)
- 8.1.1 Global Contactless Power and Sensing ICs Production by Application (2021-2032) & (k units)
- 8.1.2 Global Contactless Power and Sensing ICs Production Market Share by Application (2021-2032)
- 8.2 Global Contactless Power and Sensing ICs Production Value by Application (2021-2032)
- 8.2.1 Global Contactless Power and Sensing ICs Production Value by Application (2021-2032) & (US$ Million)
- 8.2.2 Global Contactless Power and Sensing ICs Production Value Market Share by Application (2021-2032)
- 8.3 Global Contactless Power and Sensing ICs Price by Application (2021-2032)
9 Value Chain and Sales Channels Analysis of the Market
- 9.1 Contactless Power and Sensing ICs Value Chain Analysis
- 9.1.1 Contactless Power and Sensing ICs Key Raw Materials
- 9.1.2 Raw Materials Key Suppliers
- 9.1.3 Contactless Power and Sensing ICs Production Mode & Process
- 9.2 Contactless Power and Sensing ICs Sales Channels Analysis
- 9.2.1 Direct Comparison with Distribution Share
- 9.2.2 Contactless Power and Sensing ICs Distributors
- 9.2.3 Contactless Power and Sensing ICs Customers
10 Global Contactless Power and Sensing ICs Analyzing Market Dynamics
- 10.1 Contactless Power and Sensing ICs Industry Trends
- 10.2 Contactless Power and Sensing ICs Industry Drivers
- 10.3 Contactless Power and Sensing ICs Industry Opportunities and Challenges
- 10.4 Contactless Power and Sensing ICs Industry Restraints
11 Report Conclusion
12 Disclaimer
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