APO RESEARCH · REPORT
Power ICs
PICs (power integrated circuits) are defined as ICs combining high-voltage and/or high-current components monolithically with low-voltage/low-current control components. Broadly, three classes of technologies, based on the techniques for isolating the high- and low-voltage components, have been developed for PICs: junction-isolated, self-isolated and dielectrically isolated. Each of these technologies has found its way into applications that result in optimal performance per unit cost. Simultaneously with the development of technologies, several advancements have been made in high-voltage/power devices suitable for integration. These included the reduced surface field lateral double diffused MOS transistor (RESURF LDMOS), the isolated vertical DMOS (VDMOS), the lateral insulated gate bipolar transistor (LIGBT), the high-voltage RESURF bipolar transistors, the Schottky injection FET (SINFET), and the trench sidewall channel DMOS (TDMOS).
Product & engineering
Understand the product.
PICs (power integrated circuits) are defined as ICs combining high-voltage and/or high-current components monolithically with low-voltage/low-current control components. Broadly, three classes of technologies, based on the techniques for isolating the high- and low-voltage components, have been developed for PICs: junction-isolated, self-isolated and dielectrically isolated. Each of these technologies has found its way into applications that result in optimal performance per unit cost. Simultaneously with the development of technologies, several advancements have been made in high-voltage/power devices suitable for integration. These included the reduced surface field lateral double diffused MOS transistor (RESURF LDMOS), the isolated vertical DMOS (VDMOS), the lateral insulated gate bipolar transistor (LIGBT), the high-voltage RESURF bipolar transistors, the Schottky injection FET (SINFET), and the trench sidewall channel DMOS (TDMOS).
Selected research
Industry Research
Power ICs Industry Research Report 2026
Market perspective
PICs (power integrated circuits) are defined as ICs combining high-voltage and/or high-current components monolithically with low-voltage/low-current control components. Broadly, three classes of technologies, based on the techniques for isolating the high- and low-voltage components, have been developed for PICs: junction-isolated, self-isolated and dielectrically isolated. Each of these technologies has found its way into applications that result in optimal performance per unit cost. Simultaneously with the development of technologies, several advancements have been made in high-voltage/power devices suitable for integration. These included the reduced surface field lateral double diffused MOS transistor (RESURF LDMOS), the isolated vertical DMOS (VDMOS), the lateral insulated gate bipolar transistor (LIGBT), the high-voltage RESURF bipolar transistors, the Schottky injection FET (SINFET), and the trench sidewall channel DMOS (TDMOS).
From the perspective of PIC applications, in recent years, with the emerging of smartphones, smart homes, wearable devices, VR (Virtual Reality) / AR (Augmented Reality) The booming consumer electronics market and the demand for intelligent and low-energy consumption of industrial automation robots, drones, electric vehicles and other industrial products. The rapid development of integrated circuit products in the direction of diversification has spawned a large number of new chip requirements, which has led to the steady development of the global PIC design industry.
From the perspective of overall market share, the main players in China's PIC market are mainly from European and American, accounting for more than 80% of the market share. The entire power Standard Power ICs design industry is showing a shift from the United States, Europe and Japan to China, China's power Standard Power ICs market is on the rise. As the manufacturing centers of end-consumer products are concentrated in Asia-Pacific and China, due to the impact of cost, large-scale ICs design companies in Europe and the United States have gradually faded out of the trend of civilian consumer markets, turning to other Vehicle Electronics, industrial, military, and even astronauts and other performance requirements.
Read the full market overview
Report Scope
This report quantifies the global Power ICs market in terms of revenue (US$ million) and, where applicable, service volume (), using 2024 as the base year and providing annual historical and forecast data for 2021–2032.
It standardizes definitions of service Types and end-use Applications, harmonizes provider attribution, and delivers comparable time series by company, Type, Application, and region or country, including indicative price bands (US$/) and concentration ratios (CR5/CR10). Outputs are intended to support service design, budgeting, capacity planning, and benchmarking for providers, platforms, channel partners, and investors; the report also reviews technology shifts and notable service innovations relevant to Power ICs.
Key Companies & Market Share Insights
This section profiles leading service providers with 2021–2025 results and a 2026–2032 outlook—covering revenue, market share, price bands, service portfolio and client mix, regional and channel mix, and key developments (M&A, network expansion, certifications). It also provides global revenue, average price, and—where applicable—volume metrics by provider, and calculates CR5/CR10 and rank changes to support comparative benchmarking.
Power ICs Market by Company
Texas Instruments
Infineon
Qualcomm
ON Semi
NXP
Maxim Integrated
Dialog Semiconductor
STMicroelectronics
Toshiba
Analog Devices
Silergy
Power Integrations
ROHM
MediaTek Inc.
Microchip
Skyworks
Renesas
Cypress Semiconductor
On-Bright Electronics
Alpha and Omega Semiconductor
Power ICs Segment by Type
Power Management IC (PMIC)
Driver IC
Power ICs Segment by Application
Smart Phone
Automotive
High Performance Computing
Industrial
IoT
Others
Power ICs Segment by Region
North America
United States
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Spain
Russia
Netherlands
Nordic Countries
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Southeast Asia
South America
Brazil
Argentina
Chile
Middle East & Africa
Saudi Arabia
Israel
United Arab Emirates
Turkey
Iran
Egypt
Key Drivers & Barriers
High-impact rendering factors and drivers have been studied in this report to aid the readers to understand the general development. Moreover, the report includes restraints and challenges that may act as stumbling blocks on the way of the players. This will assist the users to be attentive and make informed decisions related to business. Specialists have also laid their focus on the upcoming business prospects.
Reasons to Buy This Report
1. This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global Power ICs market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.
2. This report will help stakeholders to understand the global industry status and trends of Power ICs and provides them with information on key market drivers, restraints, challenges, and opportunities.
3. This report will help stakeholders to understand competitors better and gain more insights to strengthen their position in their businesses. The competitive landscape section includes the market share and rank (in volume and value), competitor ecosystem, new product development, expansion, and acquisition.
4. This report stays updated with novel technology integration, features, and the latest developments in the market
5. This report helps stakeholders to gain insights into which regions to target globally
6. This report helps stakeholders to gain insights into the end-user perception concerning the adoption of Power ICs.
7. This report helps stakeholders to identify some of the key players in the market and understand their valuable contribution.
Chapter Outline
Chapter 1: Research objectives, research methods, data sources, data cross-validation;
Chapter 2: Introduces the report scope of the report, executive summary of different market segments (product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 3: Provides the analysis of various market segments product types, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 6: Detailed analysis of Power ICs companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 7, 8, 9, 10, 11: North America, Europe, Asia Pacific, South America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 12: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including revenue, gross margin, product introduction, recent development, etc.
Chapter 13: The main points and conclusions of the report.
More report detail
Tables and figures
Scope & coverage.
Types
- Power Management IC (PMIC)
- Driver IC
Applications
- Smart Phone
- Automotive
- High Performance Computing
- Industrial
- IoT
- Others
Companies covered
- Texas Instruments
- Infineon
- Qualcomm
- ON Semi
- NXP
- Maxim Integrated
- Dialog Semiconductor
- STMicroelectronics
- Toshiba
- Analog Devices
- Silergy
- Power Integrations
- ROHM
- MediaTek Inc.
- Microchip
- Skyworks
- Renesas
- Cypress Semiconductor
- On-Bright Electronics
- Alpha and Omega Semiconductor
Inside the report.
1 Preface
- 1.1 Scope of Report
- 1.2 Reasons for Doing This Study
- 1.3 Research Methodology
- 1.4 Research Process
- 1.5 Data Source
- 1.5.1 Secondary Sources
- 1.5.2 Primary Sources
2 Market Overview
- 2.1 Product Definition
- 2.2 Power ICs by Type
- 2.2.1 Market Value Comparison by Type (2021 VS 2025 VS 2032)
- 2.2.2 Power Management IC (PMIC)
- 2.2.3 Driver IC
- 2.3 Power ICs by Application
- 2.3.1 Market Value Comparison by Application (2021 VS 2025 VS 2032)
- 2.3.2 Smart Phone
- 2.3.3 Automotive
- 2.3.4 High Performance Computing
- 2.3.5 Industrial
- 2.3.6 IoT
- 2.3.7 Others
- 2.4 Assumptions and Limitations
3 Power ICs Breakdown Data by Type
- 3.1 Global Power ICs Historic Market Size by Type (2021-2026)
- 3.2 Global Power ICs Forecasted Market Size by Type (2027-2032)
4 Power ICs Breakdown Data by Application
- 4.1 Global Power ICs Historic Market Size by Application (2021-2026)
- 4.2 Global Power ICs Forecasted Market Size by Application (2027-2032)
5 Global Growth Trends
- 5.1 Global Power ICs Market Perspective (2021-2032)
- 5.2 Global Power ICs Growth Trends by Region
- 5.2.1 Global Power ICs Market Size by Region: 2021 VS 2025 VS 2032
- 5.2.2 Power ICs Historic Market Size by Region (2021-2026)
- 5.2.3 Power ICs Forecasted Market Size by Region (2027-2032)
- 5.3 Power ICs Market Dynamics
- 5.3.1 Power ICs Industry Trends
- 5.3.2 Power ICs Market Drivers
- 5.3.3 Power ICs Market Challenges
- 5.3.4 Power ICs Market Restraints
6 Market Competitive Landscape by Players
- 6.1 Global Top Power ICs Players by Revenue
- 6.1.1 Global Top Power ICs Players by Revenue (2021-2026)
- 6.1.2 Global Power ICs Revenue Market Share by Players (2021-2026)
- 6.2 Global Power ICs Industry Players Ranking, 2023 VS 2024 VS 2025
- 6.3 Global Key Players of Power ICs Head Office and Area Served
- 6.4 Global Power ICs Players, Product Type & Application
- 6.5 Global Power ICs Manufacturers Established Date
- 6.6 Global Power ICs Market CR5 and HHI
- 6.7 Global Players Mergers & Acquisition
7 North America
- 7.1 North America Power ICs Market Size (2021-2032)
- 7.2 North America Power ICs Market Growth Rate by Country: 2021 VS 2025 VS 2032
- 7.3 North America Power ICs Market Size by Country (2021-2026)
- 7.4 North America Power ICs Market Size by Country (2027-2032)
- 7.5 United States
- 7.5 United States
- 7.6 Canada
- 7.7 Mexico
8 Europe
- 8.1 Europe Power ICs Market Size (2021-2032)
- 8.2 Europe Power ICs Market Growth Rate by Country: 2021 VS 2025 VS 2032
- 8.3 Europe Power ICs Market Size by Country (2021-2026)
- 8.4 Europe Power ICs Market Size by Country (2027-2032)
- 8.5 Germany
- 8.6 France
- 8.7 U.K.
- 8.8 Italy
- 8.9 Spain
- 8.10 Russia
- 8.11 Netherlands
- 8.12 Nordic Countries
9 Asia-Pacific
- 9.1 Asia-Pacific Power ICs Market Size (2021-2032)
- 9.2 Asia-Pacific Power ICs Market Growth Rate by Country: 2021 VS 2025 VS 2032
- 9.3 Asia-Pacific Power ICs Market Size by Country (2021-2026)
- 9.4 Asia-Pacific Power ICs Market Size by Country (2027-2032)
- 9.5 China
- 9.6 Japan
- 9.7 South Korea
- 9.8 India
- 9.9 Australia
- 9.10 China Taiwan
- 9.11 Southeast Asia
10 South America
- 10.1 South America Power ICs Market Size (2021-2032)
- 10.2 South America Power ICs Market Growth Rate by Country: 2021 VS 2025 VS 2032
- 10.3 South America Power ICs Market Size by Country (2021-2026)
- 10.4 South America Power ICs Market Size by Country (2027-2032)
- 10.5 Brazil
- 10.6 Argentina
- 10.7 Chile
- 10.8 Colombia
- 10.9 Peru
11 Middle East & Africa
- 11.1 Middle East & Africa Power ICs Market Size (2021-2032)
- 11.2 Middle East & Africa Power ICs Market Growth Rate by Country: 2021 VS 2025 VS 2032
- 11.3 Middle East & Africa Power ICs Market Size by Country (2021-2026)
- 11.4 Middle East & Africa Power ICs Market Size by Country (2027-2032)
- 11.5 Saudi Arabia
- 11.6 Israel
- 11.7 United Arab Emirates
- 11.8 Turkey
- 11.9 Iran
- 11.10 Egypt
12 Players Profiled
- 12.1 Texas Instruments
- 12.1.1 Texas Instruments Company Information
- 12.1.2 Texas Instruments Business Overview
- 12.1.3 Texas Instruments Revenue in Power ICs Business (2021-2026)
- 12.1.4 Texas Instruments Power ICs Product Portfolio
- 12.1.5 Texas Instruments Recent Developments
- 12.2 Infineon
- 12.2.1 Infineon Company Information
- 12.2.2 Infineon Business Overview
- 12.2.3 Infineon Revenue in Power ICs Business (2021-2026)
- 12.2.4 Infineon Power ICs Product Portfolio
- 12.2.5 Infineon Recent Developments
- 12.3 Qualcomm
- 12.3.1 Qualcomm Company Information
- 12.3.2 Qualcomm Business Overview
- 12.3.3 Qualcomm Revenue in Power ICs Business (2021-2026)
- 12.3.4 Qualcomm Power ICs Product Portfolio
- 12.3.5 Qualcomm Recent Developments
- 12.4 ON Semi
- 12.4.1 ON Semi Company Information
- 12.4.2 ON Semi Business Overview
- 12.4.3 ON Semi Revenue in Power ICs Business (2021-2026)
- 12.4.4 ON Semi Power ICs Product Portfolio
- 12.4.5 ON Semi Recent Developments
- 12.5 NXP
- 12.5.1 NXP Company Information
- 12.5.2 NXP Business Overview
- 12.5.3 NXP Revenue in Power ICs Business (2021-2026)
- 12.5.4 NXP Power ICs Product Portfolio
- 12.5.5 NXP Recent Developments
- 12.6 Maxim Integrated
- 12.6.1 Maxim Integrated Company Information
- 12.6.2 Maxim Integrated Business Overview
- 12.6.3 Maxim Integrated Revenue in Power ICs Business (2021-2026)
- 12.6.4 Maxim Integrated Power ICs Product Portfolio
- 12.6.5 Maxim Integrated Recent Developments
- 12.7 Dialog Semiconductor
- 12.7.1 Dialog Semiconductor Company Information
- 12.7.2 Dialog Semiconductor Business Overview
- 12.7.3 Dialog Semiconductor Revenue in Power ICs Business (2021-2026)
- 12.7.4 Dialog Semiconductor Power ICs Product Portfolio
- 12.7.5 Dialog Semiconductor Recent Developments
- 12.8 STMicroelectronics
- 12.8.1 STMicroelectronics Company Information
- 12.8.2 STMicroelectronics Business Overview
- 12.8.3 STMicroelectronics Revenue in Power ICs Business (2021-2026)
- 12.8.4 STMicroelectronics Power ICs Product Portfolio
- 12.8.5 STMicroelectronics Recent Developments
- 12.9 Toshiba
- 12.9.1 Toshiba Company Information
- 12.9.2 Toshiba Business Overview
- 12.9.3 Toshiba Revenue in Power ICs Business (2021-2026)
- 12.9.4 Toshiba Power ICs Product Portfolio
- 12.9.5 Toshiba Recent Developments
- 12.10 Analog Devices
- 12.10.1 Analog Devices Company Information
- 12.10.2 Analog Devices Business Overview
- 12.10.3 Analog Devices Revenue in Power ICs Business (2021-2026)
- 12.10.4 Analog Devices Power ICs Product Portfolio
- 12.10.5 Analog Devices Recent Developments
- 12.11 Silergy
- 12.11.1 Silergy Company Information
- 12.11.2 Silergy Business Overview
- 12.11.3 Silergy Revenue in Power ICs Business (2021-2026)
- 12.11.4 Silergy Power ICs Product Portfolio
- 12.11.5 Silergy Recent Developments
- 12.12 Power Integrations
- 12.12.1 Power Integrations Company Information
- 12.12.2 Power Integrations Business Overview
- 12.12.3 Power Integrations Revenue in Power ICs Business (2021-2026)
- 12.12.4 Power Integrations Power ICs Product Portfolio
- 12.12.5 Power Integrations Recent Developments
- 12.13 ROHM
- 12.13.1 ROHM Company Information
- 12.13.2 ROHM Business Overview
- 12.13.3 ROHM Revenue in Power ICs Business (2021-2026)
- 12.13.4 ROHM Power ICs Product Portfolio
- 12.13.5 ROHM Recent Developments
- 12.14 MediaTek Inc.
- 12.14.1 MediaTek Inc. Company Information
- 12.14.2 MediaTek Inc. Business Overview
- 12.14.3 MediaTek Inc. Revenue in Power ICs Business (2021-2026)
- 12.14.4 MediaTek Inc. Power ICs Product Portfolio
- 12.14.5 MediaTek Inc. Recent Developments
- 12.15 Microchip
- 12.15.1 Microchip Company Information
- 12.15.2 Microchip Business Overview
- 12.15.3 Microchip Revenue in Power ICs Business (2021-2026)
- 12.15.4 Microchip Power ICs Product Portfolio
- 12.15.5 Microchip Recent Developments
- 12.16 Skyworks
- 12.16.1 Skyworks Company Information
- 12.16.2 Skyworks Business Overview
- 12.16.3 Skyworks Revenue in Power ICs Business (2021-2026)
- 12.16.4 Skyworks Power ICs Product Portfolio
- 12.16.5 Skyworks Recent Developments
- 12.17 Renesas
- 12.17.1 Renesas Company Information
- 12.17.2 Renesas Business Overview
- 12.17.3 Renesas Revenue in Power ICs Business (2021-2026)
- 12.17.4 Renesas Power ICs Product Portfolio
- 12.17.5 Renesas Recent Developments
- 12.18 Cypress Semiconductor
- 12.18.1 Cypress Semiconductor Company Information
- 12.18.2 Cypress Semiconductor Business Overview
- 12.18.3 Cypress Semiconductor Revenue in Power ICs Business (2021-2026)
- 12.18.4 Cypress Semiconductor Power ICs Product Portfolio
- 12.18.5 Cypress Semiconductor Recent Developments
- 12.19 On-Bright Electronics
- 12.19.1 On-Bright Electronics Company Information
- 12.19.2 On-Bright Electronics Business Overview
- 12.19.3 On-Bright Electronics Revenue in Power ICs Business (2021-2026)
- 12.19.4 On-Bright Electronics Power ICs Product Portfolio
- 12.19.5 On-Bright Electronics Recent Developments
- 12.20 Alpha and Omega Semiconductor
- 12.20.1 Alpha and Omega Semiconductor Company Information
- 12.20.2 Alpha and Omega Semiconductor Business Overview
- 12.20.3 Alpha and Omega Semiconductor Revenue in Power ICs Business (2021-2026)
- 12.20.4 Alpha and Omega Semiconductor Power ICs Product Portfolio
- 12.20.5 Alpha and Omega Semiconductor Recent Developments
13 Report Conclusion
14 Disclaimer
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