Selected research
Market Structure
Global Dry Etching Equipment for Semiconductor Market by Size, by Type, by Application, by Region, History and Forecast 2021-2032
Market perspective
The global Dry Etching Equipment for Semiconductor market is projected to grow from US$ million in 2026 to US$ million by 2032, implying a CAGR of % over 2026-2032.
The US & Canada market for Dry Etching Equipment for Semiconductor is projected to increase from US$ million in 2026 to US$ million by 2032, at a CAGR of % over 2026-2032.
The Europe market for Dry Etching Equipment for Semiconductor is projected to increase from US$ million in 2026 to US$ million by 2032, at a CAGR of % over 2026-2032.
Read the full market overview
The Asia Pacific market for Dry Etching Equipment for Semiconductor is projected to increase from US$ million in 2026 to US$ million by 2032, at a CAGR of % over 2026-2032.
The China market for Dry Etching Equipment for Semiconductor is projected to increase from US$ million in 2026 to US$ million by 2032, at a CAGR of % over 2026-2032.
Leading global manufacturers of Dry Etching Equipment for Semiconductor include Lam Research, Tokyo Electron Limited, Applied Materials, Hitachi High-Tech, SEMES, AMEC, NAURA, SPTS Technologies (KLA) and Oxford Instruments, among others. In 2025, the top three vendors together accounted for approximately % of global revenue.
On the production side, the report examines Dry Etching Equipment for Semiconductor output, growth rates, and market shares by manufacturer and by region (at regional and country level) for 2021-2026, with forecasts through 2032.
On the consumption side, the report analyzes sales of Dry Etching Equipment for Semiconductor by region (regional and country level), company, type, and application for 2021-2026 and provides forecasts through 2032.
The report provides an overview of the global Dry Etching Equipment for Semiconductor market in terms of capacity, output, revenue, and price, analyzing global market trends using historical revenue and sales data for 2021-2025, estimates for 2026, and projected CAGRs through 2032.
The study covers key producers of Dry Etching Equipment for Semiconductor and consumption patterns in major regions and countries, assesses future market potential, and highlights priority regions and countries for segmenting the market into sub-sectors, with country-specific market value data for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, the Middle East, Africa, and other countries.
The report also presents Dry Etching Equipment for Semiconductor sales, revenue, market share, and industry ranking for the main manufacturers for 2021-2026, identifies the major stakeholders in the global market, and analyzes their competitive landscape and market positioning based on recent developments and segmental revenues.
In addition, the report analyzes segment data by type and application—covering sales, revenue, and price—for 2021-2032, and evaluates and forecasts the Dry Etching Equipment for Semiconductor market size, projected growth trends, production technologies, key applications, and end-use industries.
Dry Etching Equipment for Semiconductor Segment by Company
Lam Research
Tokyo Electron Limited
Applied Materials
Hitachi High-Tech
SEMES
AMEC
NAURA
SPTS Technologies (KLA)
Oxford Instruments
ULVAC
Plasma-Therm
GigaLane
VM
Jusung Engineering
SAMCO
Dry Etching Equipment for Semiconductor Segment by Type
Inductively Coupled Plasma (ICP)
Capacitive Coupled Plasma (CCP)
Reactive Ion Etching (RIE)
Deep Reactive Ion Etching (DRIE)
Others
Dry Etching Equipment for Semiconductor Segment by Application
Logic and Memory
Power Device
MEMS
Others
Dry Etching Equipment for Semiconductor Segment by Region
North America
United States
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Spain
Netherlands
Switzerland
Sweden
Poland
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Southeast Asia
South America
Brazil
Argentina
Chile
Middle East & Africa
Egypt
South Africa
Israel
Türkiye
GCC Countries
Study Objectives
1. To analyze and research the global status and future forecast, involving, production, value, consumption, growth rate (CAGR), market share, historical and forecast.
2. To present the key manufacturers, capacity, production, revenue, market share, and Recent Developments.
3. To split the breakdown data by regions, type, manufacturers, and Application.
4. To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints, and risks.
5. To identify significant trends, drivers, influence factors in global and regions.
6. To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
Reasons to Buy This Report
1. This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global Dry Etching Equipment for Semiconductor market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.
2. This report will help stakeholders to understand the global industry status and trends of Dry Etching Equipment for Semiconductor and provides them with information on key market drivers, restraints, challenges, and opportunities.
3. This report will help stakeholders to understand competitors better and gain more insights to strengthen their position in their businesses. The competitive landscape section includes the market share and rank (in volume and value), competitor ecosystem, new product development, expansion, and acquisition.
4. This report stays updated with novel technology integration, features, and the latest developments in the market.
5. This report helps stakeholders to gain insights into which regions to target globally.
6. This report helps stakeholders to gain insights into the end-user perception concerning the adoption of Dry Etching Equipment for Semiconductor.
7. This report helps stakeholders to identify some of the key players in the market and understand their valuable contribution.
Chapter Outline
Chapter 1: Provides an overview of the Dry Etching Equipment for Semiconductor market, including product definition, global market growth prospects, production value, capacity, and average price forecasts (2021-2032).
Chapter 2: Analysis key trends, drivers, challenges, and opportunities within the global Dry Etching Equipment for Semiconductor industry.
Chapter 3: Detailed analysis of Dry Etching Equipment for Semiconductor market competition landscape. Including Dry Etching Equipment for Semiconductor manufacturers' output value, output and average price from 2021 to 2026, as well as competition analysis indicators such as origin, product type, application, merger and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 7: Production/Production Value of Dry Etching Equipment for Semiconductor by region. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 8: Consumption of Dry Etching Equipment for Semiconductor in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 9: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 10: Concluding Insights of the report.
More report detail
Tables and figures
Scope & coverage.
Types
- Inductively Coupled Plasma (ICP)
- Capacitive Coupled Plasma (CCP)
- Reactive Ion Etching (RIE)
- Deep Reactive Ion Etching (DRIE)
- Others
Applications
- Logic and Memory
- Power Device
- MEMS
- Others
Companies covered
- Lam Research
- Tokyo Electron Limited
- Applied Materials
- Hitachi High-Tech
- SEMES
- AMEC
- NAURA
- SPTS Technologies (KLA)
- Oxford Instruments
- ULVAC
- Plasma-Therm
- GigaLane
- VM
- Jusung Engineering
- SAMCO
Inside the report.
1 Market Overview
- 1.1 Product Definition
- 1.2 Global Market Growth Prospects
- 1.2.1 Global Dry Etching Equipment for Semiconductor Production Value Estimates and Forecasts (2021-2032)
- 1.2.2 Global Dry Etching Equipment for Semiconductor Production Capacity Estimates and Forecasts (2021-2032)
- 1.2.3 Global Dry Etching Equipment for Semiconductor Production Estimates and Forecasts (2021-2032)
- 1.2.4 Global Dry Etching Equipment for Semiconductor Market Average Price (2021-2032)
- 1.3 Assumptions and Limitations
- 1.4 Study Goals and Objectives
2 Global Dry Etching Equipment for Semiconductor Market Dynamics
- 2.1 Dry Etching Equipment for Semiconductor Industry Trends
- 2.2 Dry Etching Equipment for Semiconductor Industry Drivers
- 2.3 Dry Etching Equipment for Semiconductor Industry Opportunities and Challenges
- 2.4 Dry Etching Equipment for Semiconductor Industry Restraints
3 Dry Etching Equipment for Semiconductor Market by Manufacturers
- 3.1 Global Dry Etching Equipment for Semiconductor Production Value by Manufacturers (2021-2026)
- 3.2 Global Dry Etching Equipment for Semiconductor Production by Manufacturers (2021-2026)
- 3.3 Global Dry Etching Equipment for Semiconductor Average Price by Manufacturers (2021-2026)
- 3.4 Global Dry Etching Equipment for Semiconductor Industry Manufacturers Ranking, 2024 VS 2025 VS 2026
- 3.5 Global Dry Etching Equipment for Semiconductor Key Manufacturers Manufacturing Sites & Headquarters
- 3.6 Global Dry Etching Equipment for Semiconductor Manufacturers, Product Type & Application
- 3.7 Global Dry Etching Equipment for Semiconductor Manufacturers Established Date
- 3.8 Market Competitive Analysis
- 3.8.1 Global Dry Etching Equipment for Semiconductor Market CR5 and HHI
- 3.8.2 Global Top 5 and 10 Dry Etching Equipment for Semiconductor Players Market Share by Production Value in 2025
- 3.8.3 2025 Dry Etching Equipment for Semiconductor Tier 1, Tier 2, and Tier 3
4 Dry Etching Equipment for Semiconductor Market by Type
- 4.1 Dry Etching Equipment for Semiconductor Type Introduction
- 4.1.1 Inductively Coupled Plasma (ICP)
- 4.1.2 Capacitive Coupled Plasma (CCP)
- 4.1.3 Reactive Ion Etching (RIE)
- 4.1.4 Deep Reactive Ion Etching (DRIE)
- 4.1.5 Others
- 4.2 Global Dry Etching Equipment for Semiconductor Production by Type
- 4.2.1 Global Dry Etching Equipment for Semiconductor Production by Type (2021 VS 2025 VS 2032)
- 4.2.2 Global Dry Etching Equipment for Semiconductor Production by Type (2021-2032)
- 4.2.3 Global Dry Etching Equipment for Semiconductor Production Market Share by Type (2021-2032)
- 4.3 Global Dry Etching Equipment for Semiconductor Production Value by Type
- 4.3.1 Global Dry Etching Equipment for Semiconductor Production Value by Type (2021 VS 2025 VS 2032)
- 4.3.2 Global Dry Etching Equipment for Semiconductor Production Value by Type (2021-2032)
- 4.3.3 Global Dry Etching Equipment for Semiconductor Production Value Market Share by Type (2021-2032)
5 Dry Etching Equipment for Semiconductor Market by Application
- 5.1 Dry Etching Equipment for Semiconductor Application Introduction
- 5.1.1 Logic and Memory
- 5.1.2 Power Device
- 5.1.3 MEMS
- 5.1.4 Others
- 5.2 Global Dry Etching Equipment for Semiconductor Production by Application
- 5.2.1 Global Dry Etching Equipment for Semiconductor Production by Application (2021 VS 2025 VS 2032)
- 5.2.2 Global Dry Etching Equipment for Semiconductor Production by Application (2021-2032)
- 5.2.3 Global Dry Etching Equipment for Semiconductor Production Market Share by Application (2021-2032)
- 5.3 Global Dry Etching Equipment for Semiconductor Production Value by Application
- 5.3.1 Global Dry Etching Equipment for Semiconductor Production Value by Application (2021 VS 2025 VS 2032)
- 5.3.2 Global Dry Etching Equipment for Semiconductor Production Value by Application (2021-2032)
- 5.3.3 Global Dry Etching Equipment for Semiconductor Production Value Market Share by Application (2021-2032)
6 Company Profiles
- 6.1 Lam Research
- 6.1.1 Lam Research Company Information
- 6.1.2 Lam Research Business Overview
- 6.1.3 Lam Research Dry Etching Equipment for Semiconductor Production, Value and Gross Margin (2021-2026)
- 6.1.4 Lam Research Dry Etching Equipment for Semiconductor Product Portfolio
- 6.1.5 Lam Research Recent Developments
- 6.2 Tokyo Electron Limited
- 6.2.1 Tokyo Electron Limited Company Information
- 6.2.2 Tokyo Electron Limited Business Overview
- 6.2.3 Tokyo Electron Limited Dry Etching Equipment for Semiconductor Production, Value and Gross Margin (2021-2026)
- 6.2.4 Tokyo Electron Limited Dry Etching Equipment for Semiconductor Product Portfolio
- 6.2.5 Tokyo Electron Limited Recent Developments
- 6.3 Applied Materials
- 6.3.1 Applied Materials Company Information
- 6.3.2 Applied Materials Business Overview
- 6.3.3 Applied Materials Dry Etching Equipment for Semiconductor Production, Value and Gross Margin (2021-2026)
- 6.3.4 Applied Materials Dry Etching Equipment for Semiconductor Product Portfolio
- 6.3.5 Applied Materials Recent Developments
- 6.4 Hitachi High-Tech
- 6.4.1 Hitachi High-Tech Company Information
- 6.4.2 Hitachi High-Tech Business Overview
- 6.4.3 Hitachi High-Tech Dry Etching Equipment for Semiconductor Production, Value and Gross Margin (2021-2026)
- 6.4.4 Hitachi High-Tech Dry Etching Equipment for Semiconductor Product Portfolio
- 6.4.5 Hitachi High-Tech Recent Developments
- 6.5 SEMES
- 6.5.1 SEMES Company Information
- 6.5.2 SEMES Business Overview
- 6.5.3 SEMES Dry Etching Equipment for Semiconductor Production, Value and Gross Margin (2021-2026)
- 6.5.4 SEMES Dry Etching Equipment for Semiconductor Product Portfolio
- 6.5.5 SEMES Recent Developments
- 6.6 AMEC
- 6.6.1 AMEC Company Information
- 6.6.2 AMEC Business Overview
- 6.6.3 AMEC Dry Etching Equipment for Semiconductor Production, Value and Gross Margin (2021-2026)
- 6.6.4 AMEC Dry Etching Equipment for Semiconductor Product Portfolio
- 6.6.5 AMEC Recent Developments
- 6.7 NAURA
- 6.7.1 NAURA Company Information
- 6.7.2 NAURA Business Overview
- 6.7.3 NAURA Dry Etching Equipment for Semiconductor Production, Value and Gross Margin (2021-2026)
- 6.7.4 NAURA Dry Etching Equipment for Semiconductor Product Portfolio
- 6.7.5 NAURA Recent Developments
- 6.8 SPTS Technologies (KLA)
- 6.8.1 SPTS Technologies (KLA) Company Information
- 6.8.2 SPTS Technologies (KLA) Business Overview
- 6.8.3 SPTS Technologies (KLA) Dry Etching Equipment for Semiconductor Production, Value and Gross Margin (2021-2026)
- 6.8.4 SPTS Technologies (KLA) Dry Etching Equipment for Semiconductor Product Portfolio
- 6.8.5 SPTS Technologies (KLA) Recent Developments
- 6.9 Oxford Instruments
- 6.9.1 Oxford Instruments Company Information
- 6.9.2 Oxford Instruments Business Overview
- 6.9.3 Oxford Instruments Dry Etching Equipment for Semiconductor Production, Value and Gross Margin (2021-2026)
- 6.9.4 Oxford Instruments Dry Etching Equipment for Semiconductor Product Portfolio
- 6.9.5 Oxford Instruments Recent Developments
- 6.10 ULVAC
- 6.10.1 ULVAC Company Information
- 6.10.2 ULVAC Business Overview
- 6.10.3 ULVAC Dry Etching Equipment for Semiconductor Production, Value and Gross Margin (2021-2026)
- 6.10.4 ULVAC Dry Etching Equipment for Semiconductor Product Portfolio
- 6.10.5 ULVAC Recent Developments
- 6.11 Plasma-Therm
- 6.11.1 Plasma-Therm Company Information
- 6.11.2 Plasma-Therm Business Overview
- 6.11.3 Plasma-Therm Dry Etching Equipment for Semiconductor Production, Value and Gross Margin (2021-2026)
- 6.11.4 Plasma-Therm Dry Etching Equipment for Semiconductor Product Portfolio
- 6.11.5 Plasma-Therm Recent Developments
- 6.12 GigaLane
- 6.12.1 GigaLane Company Information
- 6.12.2 GigaLane Business Overview
- 6.12.3 GigaLane Dry Etching Equipment for Semiconductor Production, Value and Gross Margin (2021-2026)
- 6.12.4 GigaLane Dry Etching Equipment for Semiconductor Product Portfolio
- 6.12.5 GigaLane Recent Developments
- 6.13 VM
- 6.13.1 VM Company Information
- 6.13.2 VM Business Overview
- 6.13.3 VM Dry Etching Equipment for Semiconductor Production, Value and Gross Margin (2021-2026)
- 6.13.4 VM Dry Etching Equipment for Semiconductor Product Portfolio
- 6.13.5 VM Recent Developments
- 6.14 Jusung Engineering
- 6.14.1 Jusung Engineering Company Information
- 6.14.2 Jusung Engineering Business Overview
- 6.14.3 Jusung Engineering Dry Etching Equipment for Semiconductor Production, Value and Gross Margin (2021-2026)
- 6.14.4 Jusung Engineering Dry Etching Equipment for Semiconductor Product Portfolio
- 6.14.5 Jusung Engineering Recent Developments
- 6.15 SAMCO
- 6.15.1 SAMCO Company Information
- 6.15.2 SAMCO Business Overview
- 6.15.3 SAMCO Dry Etching Equipment for Semiconductor Production, Value and Gross Margin (2021-2026)
- 6.15.4 SAMCO Dry Etching Equipment for Semiconductor Product Portfolio
- 6.15.5 SAMCO Recent Developments
7 Global Dry Etching Equipment for Semiconductor Production by Region
- 7.1 Global Dry Etching Equipment for Semiconductor Production by Region: 2021 VS 2025 VS 2032
- 7.2 Global Dry Etching Equipment for Semiconductor Production by Region (2021-2032)
- 7.2.1 Global Dry Etching Equipment for Semiconductor Production by Region (2021-2026)
- 7.2.2 Global Dry Etching Equipment for Semiconductor Production Forecast by Region (2027-2032)
- 7.3 Global Dry Etching Equipment for Semiconductor Production by Region: 2021 VS 2025 VS 2032
- 7.4 Global Dry Etching Equipment for Semiconductor Production Value by Region (2021-2032)
- 7.4.1 Global Dry Etching Equipment for Semiconductor Production Value by Region (2021-2026)
- 7.4.2 Global Dry Etching Equipment for Semiconductor Production Value by Region (2027-2032)
- 7.5 Global Dry Etching Equipment for Semiconductor Market Price Analysis by Region (2021-2032)
- 7.6 Regional Production Value Trends (2021-2032)
- 7.6.1 North America Dry Etching Equipment for Semiconductor Production Value (2021-2032)
- 7.6.2 Europe Dry Etching Equipment for Semiconductor Production Value (2021-2032)
- 7.6.3 Asia-Pacific Dry Etching Equipment for Semiconductor Production Value (2021-2032)
- 7.6.4 South America Dry Etching Equipment for Semiconductor Production Value (2021-2032)
- 7.6.5 Middle East & Africa Dry Etching Equipment for Semiconductor Production Value (2021-2032)
8 Global Dry Etching Equipment for Semiconductor Consumption by Region
- 8.1 Global Dry Etching Equipment for Semiconductor Consumption by Region: 2021 VS 2025 VS 2032
- 8.2 Global Dry Etching Equipment for Semiconductor Consumption by Region (2021-2032)
- 8.2.1 Global Dry Etching Equipment for Semiconductor Consumption by Region (2021-2026)
- 8.2.2 Global Dry Etching Equipment for Semiconductor Consumption by Region (2027-2032)
- 8.3 North America
- 8.3.1 North America Dry Etching Equipment for Semiconductor Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 8.3.2 North America Dry Etching Equipment for Semiconductor Consumption by Country (2021-2032)
- 8.3.3 U.S.
- 8.3.4 Canada
- 8.3.5 Mexico
- 8.4 Europe
- 8.4.1 Europe Dry Etching Equipment for Semiconductor Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 8.4.2 Europe Dry Etching Equipment for Semiconductor Consumption by Country (2021-2032)
- 8.4.3 Germany
- 8.4.4 France
- 8.4.5 U.K.
- 8.4.6 Italy
- 8.4.7 Netherlands
- 8.5 Asia Pacific
- 8.5.1 Asia Pacific Dry Etching Equipment for Semiconductor Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 8.5.2 Asia Pacific Dry Etching Equipment for Semiconductor Consumption by Country (2021-2032)
- 8.5.3 China
- 8.5.4 Japan
- 8.5.5 South Korea
- 8.5.6 Southeast Asia
- 8.5.7 India
- 8.5.8 Australia
- 8.6 South America
- 8.6.1 South America Dry Etching Equipment for Semiconductor Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 8.6.2 South America Dry Etching Equipment for Semiconductor Consumption by Country (2021-2032)
- 8.6.3 Brazil
- 8.6.4 Argentina
- 8.6.5 Chile
- 8.6.6 Colombia
- 8.7 Middle East & Africa
- 8.7.1 Middle East & Africa Dry Etching Equipment for Semiconductor Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 8.7.2 Middle East & Africa Dry Etching Equipment for Semiconductor Consumption by Country (2021-2032)
- 8.7.3 Egypt
- 8.7.4 South Africa
- 8.7.5 Israel
- 8.7.6 Türkiye
- 8.7.7 GCC Countries
9 Value Chain and Sales Channels Analysis
- 9.1 Dry Etching Equipment for Semiconductor Value Chain Analysis
- 9.1.1 Dry Etching Equipment for Semiconductor Key Raw Materials
- 9.1.2 Raw Materials Key Suppliers
- 9.1.3 Manufacturing Cost Structure
- 9.1.4 Dry Etching Equipment for Semiconductor Production Mode & Process
- 9.2 Dry Etching Equipment for Semiconductor Sales Channels Analysis
- 9.2.1 Direct Comparison with Distribution Share
- 9.2.2 Dry Etching Equipment for Semiconductor Distributors
- 9.2.3 Dry Etching Equipment for Semiconductor Customers
10 Concluding Insights
11 Appendix
- 11.1 Reasons for Doing This Study
- 11.2 Research Methodology
- 11.3 Research Process
- 11.4 Authors List of This Report
- 11.5 Data Source
- 11.5.1 Secondary Sources
- 11.5.2 Primary Sources
- 11.6 Disclaimer
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