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200mm Wafer Used Electrostatic Chuck
200mm Wafer Used Electrostatic Chuck is a wafer-support or thermal-processing component defined by its holding and process interfaces.
- Types
- Coulomb Type · Johnsen-Rahbek (JR) Type
- Applications
- Wafer Suppliers · Semiconductor Equipment Suppliers
5 editions6 January 2026
Electronics & Semiconductor
25 Wafer Capacity FOUP
25 Wafer Capacity FOUP is a protective semiconductor-wafer handling or transport container defined by the named carrier format.
- Types
- PC · PEEK · Others
- Applications
- IDM · Foundry
5 editions6 July 2026
Machinery & Equipment
2D Wafer AOI System
2D Wafer AOI System is semiconductor test or inspection equipment that positions wafers and acquires an identified electrical or optical result.
- Types
- Online · Offline
- Applications
- 8 Inches Wafer Testing · 12 Inches Wafer Testing · Others
5 editions10 April 2026
Electronics & Semiconductor
3 Inch or Larger Wafer Mapping Sensor
3 Inch or Larger Wafer Mapping Sensor is a sensing device or sensor grouping that converts the named physical quantity into usable data.
- Types
- LED Beam Mapping Sensor · Laser Beam Mapping Sensor
- Applications
- 6 Inch Wafer · 8 Inch Wafer · 5 Inch Wafer
5 editions4 June 2026
Electronics & Semiconductor
300 mm Semiconductor Wafer Carrier for Thin Wafer
300 mm Semiconductor Wafer Carrier for Thin Wafer is a protective semiconductor-wafer handling or transport container defined by the named carrier format.
- Types
- FOUP · FOSB
- Applications
- IDM · Foundry
5 editions6 July 2026
Electronics & Semiconductor
300 mm Through Glass Via Wafer
300 mm Through Glass Via Wafer is a semiconductor or functional substrate material supplied in the geometry and processing state named in the catalogue.
- Types
- Chemical Etching Technology · Laser Drilling Technology
- Applications
- Consumer Electronics · Automobile Electronics · Others
5 editions6 January 2026
Food & Beverages
300 mm Wafer CMP Pad Conditioners
300 mm Wafer CMP Pad Conditioners is a consumable or interface component for the named semiconductor processing or wafer-handling step.
- Types
- Conventional Pad Conditioners · CVD Diamond Pad Conditioners
- Applications
- Wafer Foundry · IDM
5 editions6 January 2026
Electronics & Semiconductor
300 mm Wafer CMP Retaining Rings
300 mm Wafer CMP Retaining Rings is a consumable or interface component for the named semiconductor processing or wafer-handling step.
- Types
- Polyetheretherketone (PEEK) · Polyphenylene Sulfide (PPS) · Polyethylene Terephthalate (PET)
- Applications
- Wafer Suppliers · Semiconductor Equipment Suppliers
5 editions1 January 2026
Electronics & Semiconductor
300 mm Wafer Electrostatic Chucks
300 mm Wafer Electrostatic Chucks is a wafer-support or thermal-processing component defined by its holding and process interfaces.
- Types
- Coulomb Type Electrostatic Chuck · Johnsen-Rahbek (JR) Type Electrostatic Chuck
- Applications
- Fab · Semiconductor Equipment Factory
5 editions1 January 2026
Electronics & Semiconductor
300 mm Wafer Front Opening Unified Pod
300 mm Wafer Front Opening Unified Pod is a front-opening semiconductor-wafer handling pod in the wafer-diameter class named in the catalogue.
- Types
- 13 Slot Wafers Front Opening Unified Pod · 25 Slot Wafers Front Opening Unified Pod
- Applications
- Wafer Foundry · IDM
5 editions10 April 2026
Electronics & Semiconductor
300 mm Wafer Probing Machines
300 mm Wafer Probing Machines is semiconductor test or inspection equipment that positions wafers and acquires an identified electrical or optical result.
- Types
- Semi-automatic · Fully automatic
- Applications
- IDMs · OSAT
5 editions31 January 2026










