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Electronics & Semiconductor

Automobile Seat Control Unit

Types

Front Seat Control Unit · Rear Seat Control Unit

Applications

Passenger Cars · Commercial Vehicles

5 editions2 May 2026

Chemical & Material

Anti-fingerprint Coating

Types

Hydrophobic Coating · Oleophobic Coating

Applications

Electronic Consumer Goods · Building · Automobile

5 editions27 December 2025

Automobile & Transportation

Automotive Child Perception System

Types

Automotive Camera System · Video Driving Recording System · Ultrasonic Radar System

Applications

Fuel Vehicle · New Energy Vehicle

5 editions26 December 2025

Chemical & Material

Amino Acids Complexed and Chelated Fertilizer

Types

Complexed Fertilizer · Chelated Fertilizer

Applications

Fruits · Vegetables · Grains

5 editions23 December 2025

Service & Software

Animation Audio Production Services

Types

2D Animation · 3D Animation

Applications

Anime Production · Video Game Animation · Others

5 editions3 July 2026

Consumer Goods

Automatic Raw Rice Washing Machine

Types

Water Pressure Cleaning · Spin Cleaning

Applications

Commercial · Househeld

5 editions2 January 2026

Automobile & Transportation

Automotive Rear Suspension Module

Types

Independent Suspension Module · Semi-Dependent Suspension Module

Applications

Passenger Cars · Commercial Vehicles

5 editions17 January 2026

Automobile & Transportation

Automotive Seat Manual Slide Rail

Types

Folding · Fixed

Applications

Commercial Vehicles · Passenger Vehicles

5 editions24 December 2025

Automobile & Transportation

Automotive Vehicle Diagnostics

Types

Engine Diagnosis · Oil and Gas Tank Diagnosis · Exhaust Diagnosis

Applications

Passenger Cars · Commercial Vehicles

5 editions18 January 2026

Electronics & Semiconductor

Advanced Packaging

During the final stages of semiconductor development, a tiny block of materials (the silicon wafer, logic, and memory) is wrapped in a supporting case that prevents physical damage and corrosion and allows the chip to be connected to a circuit board. Typical packaging configurations have included the leadless chip carriers and pin-grid arrays of the 1980s, the system-in-package and package-on package setups of the 2000s, and, most recently, 2-D integrated-circuit…

Types

3.0 DIC · FO SIP · FO WLP

Applications

Analog & Mixed Signal · Wireless Connectivity · Optoelectronic

5 editions2 January 2026

Chemical & Material

Artificial Lightweight Aggregate

Types

Stone Sludge · Sintered Fly Ash · Expanded Perlite

Applications

Non-Structural Purpose · Structural Purpose

5 editions24 December 2025

Service & Software

Aircraft Design Software

Types

Cloud Based · Local Deployment

Applications

Commercial Aviation · General Aviation · Military Aviation

5 editions1 January 2026