Machinery & Equipment
Semiconductor Assembly Process Equipment
- Types
- Die Bonders · Wire Bonders · Packaging Equipment
- Applications
- IDMs · OSAT
5 editions5 June 2026
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Microfocus X-ray Sources were specifically developed for X-ray nondestructive inspection. A small focal point prevents blurring of X-ray images and delivers a sharp enlarged image. An RS-232C interface is provided as standard for external control. These microfocus X-ray Sources also yield clear, sharp enlarged X-ray images even during 3D observation.
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