Machinery & Equipment
Solder Paste Inspection (SPI) System
Solder Paste Inspection is mainly done to check the solder paste deposits in the Printed Circuit Board (PCB) manufacturing process. It is observed that most of the solder joint defects in a PCB assembly are because of improper solder paste printing. With the help of solder paste inspection (SPI), you can reduce the defects related to soldering by a considerable amount.
- Types
- In-line SPI System · Off-line SPI System
- Applications
- Automotive Electronics · Consumer Electronics · Industrials
5 editions26 December 2025