Machinery & Equipment
TCB Bonder
Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the die in a process called "Thermo Compression Bonding". The bumps are forced against their opposing pads and a second metallic bond is formed where the bond comes into contact with the package metallization. This technique typically requires the use of heat as high as 350° to 400°C, and forces of as much as 100 g/bump.
- Types
- Automatic TCB Bonder · Manual TCB Bonder
- Applications
- IDMs · OSAT
5 editions26 December 2025
$3,450Single user · USD · Industry Growth & TrendsExplore product: TCB BonderCompare research options for TCB Bonder