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Electronics & Semiconductor

Digital Lidar Sensors

Types

Short Distance · Mid Distance · Long Distance

Applications

Intelligent Transportation · Industrial Automation · Others

5 editions4 June 2026

Electronics & Semiconductor

Industrial 5G Data Terminal

Types

5G DTU · 5G CPE · 5G Router

Applications

Logistics & Warehousing · Medical · Industrial

5 editions4 July 2026

Electronics & Semiconductor

Household Smart Lock

Types

With Camera · Without Camera

Applications

Online · Offline

5 editions11 April 2026

Electronics & Semiconductor

Photonic Quantum Chip

Types

Silicon Photonic Quantum Chip · Superconducting Quantum Chip

Applications

Defense and Security · Financial Industry · Artificial Intelligence Industry

5 editions5 July 2026

Electronics & Semiconductor

Wearable Device Quartz Crystal Resonator

Types

Crystal Oscillator · Crystal Resonator

Applications

Smart Watch · Smart Bracelet · Bluetooth Earphone

5 editions13 August 2026

Electronics & Semiconductor

Low Frequency Wake-Up Receivers

Types

One-channel · Two-channel · Three-channel

Applications

Active RFID Tags · Real-time Location Systems · Operator Identification

5 editions4 July 2026

Electronics & Semiconductor

High-Precision Pressure Sensor

Types

High-Precision Pressure Sensor · Ultra High-Precision Pressure Sensor

Applications

Ocean · Aerospace · Petroleum and Natural Gas

5 editions4 January 2026

Electronics & Semiconductor

High Countervoltage Triode

Types

High Power Triode (22kV, 35kV, etc.) · Small and Medium Power Transistors (200V, 230V, etc.)

Applications

Consumer Electronics · Vehicle Electronics · Medical Electronics

5 editions3 July 2026

Electronics & Semiconductor

Germanium Infrared Aspheric Lens

Types

Uncoated Lens · Anti-Reflective Coated Lens

Applications

Thermal Imaging Cameras · Infrared Censors · Spectroscopic Instruments

5 editions6 July 2026

Electronics & Semiconductor

Packaging Substrate

A packaging substrate is an organic laminated interconnect carrier that redistributes integrated-circuit I/O from on-die pitch to board pitch while providing mechanical support, power and ground planes, impedance-controlled signal routing, and a thermal and coefficient-of-expansion transition between the silicon die and the printed circuit board. It is built from glass-cloth reinforced epoxy or bismaleimide-triazine core and one or more build-up dielectric layers with…

Types

FC-BGA · FC-CSP · WB-BGA

Applications

Mobile & Consumer · Automotive · AI Servers & HPC & Networking

5 editions28 December 2025

Electronics & Semiconductor

Sensor Feedthrough

Types

Single Sensor · Dual Sensor

Applications

Thickness Monitor · Deposition Controllers

5 editions4 January 2026

Electronics & Semiconductor

IQ Modulator

Types

IF Processing Modulator · High Frequency Processing Modulator

Applications

Aerospace · Defense · Communication

5 editions2 May 2026