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Electronics & Semiconductor

Flexible Biosensors

Types
Wearable Biosensors · Implantable Biosensors · In Vitro Diagnostic Biosensors
Applications
Healthcare · Environmental Monitoring · Food Safety

5 editions5 June 2026

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Electronics & Semiconductor

Power Semiconductor Switches

Power Semiconductor Switches are the discrete power device. A discrete power device (or discrete component) is an electronic component with just one circuit element, other than an integrated circuit. It is an electronic component widely used in automotive & transportation, industrial, consumer, communication and among others. The power transistors and thyristors are called Power Semiconductor Switches, which include PowerMOSFETs, IGBTs, Bipolar Power Transistors, SCR, GTO…

Types
Power MOSFETs · IGBTs · Bipolar Power Transistors
Applications
Automotive & Transportation · Industrial & Power · Consumer

5 editions21 December 2025

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Electronics & Semiconductor

NAND Flash Master Control Chips

Types
Expandable Flash Controllers · SSD Flash Controllers · Embedded Flash Controllers
Applications
Consumer Electronics · Solid State Drives · Automotive

5 editions4 May 2026

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Electronics & Semiconductor

HD Mini-Sas Adapters

Types
Mini-SAS to SATA Adapter · Mini-SAS to Mini-SAS Adapter · Mini-SAS to SAS Adapter
Applications
Aerospace · Defense · Communication

5 editions3 July 2026

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$4,250Single user · USD · Market Outlook & Growth OpportunitiesExplore product: HD Mini-Sas AdaptersCompare research options for HD Mini-Sas Adapters

Electronics & Semiconductor

Rotating Target

Types
ITO Rotating Target · Silicon Rotating Target · Molybdenum Rotating Target
Applications
Flat Panel Display · Solar Energy · Others

5 editions3 May 2026

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$4,250Single user · USD · Market Outlook & Growth OpportunitiesExplore product: Rotating TargetCompare research options for Rotating Target

Electronics & Semiconductor

Through Glass Via (TGV) Wafer

Through glass vias substrate is a new glass substrate, which make holes through thin glass without damaging glass shape. A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). This report studies the TGV substrate (TGV wafer).

Types
300 mm · 200 mm · Below150 mm
Applications
Biotechnology/Medical · Consumer Electronics · Automotive

5 editions20 December 2025

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