Compare the product scope, applications and research editions relevant to your next decision.
Electronics & Semiconductor
A large-format substrate-glass associated with generation 8.5 display manufacturing, supplied for specified panel-processing steps.
5 editions13 August 2026
Electronics & Semiconductor
A 12-inch wafer probe station supports a 300 mm wafer on a positioning chuck and aligns probes with device contact locations.
5 editions10 April 2026
Electronics & Semiconductor
A monostable relay has one defined resting state and returns to that state when its actuation input is removed.
5 editions4 March 2026
Electronics & Semiconductor
A food-and-beverage pressure sensor combines pressure measurement with a process interface selected for hygienic equipment and its cleaning conditions.
5 editions13 August 2026
Electronics & Semiconductor
An independent accelerometer component measuring acceleration for a specified automotive interface and sensing range.
5 editions13 August 2026
Electronics & Semiconductor
A PIR signal processing chip conditions signals from a pyroelectric infrared detector for presence or motion detection; filtering, thresholds and sensor coupling determine the interpreted event.
5 editions13 August 2026
Electronics & Semiconductor
A two-inch patterned sapphire substrate provides a patterned sapphire growth surface in a specified wafer format; pattern, surface and crystallographic quality determine epitaxial compatibility.
5 editions13 August 2026
Electronics & Semiconductor
A dielectric strength tester applies a defined electrical stress to insulation and measures its response; voltage waveform, exposure and trip criteria determine the test result.
5 editions13 August 2026
Electronics & Semiconductor
A wire-wound high-temperature strain gauge detects strain through a resistance-wire arrangement suited to specified thermal conditions; attachment, temperature compensation and drift determine the measurement.
5 editions13 August 2026
Electronics & Semiconductor
24-Fiber MPO Cable Assemblies is an electrical or optical interconnect component or cable assembly supplied for the named interface.
5 editions6 January 2026
Electronics & Semiconductor
A printed-circuit-board for 800G optical modules, specified by stack-up, signal path and assembly interfaces.
5 editions13 August 2026
Electronics & Semiconductor
A hydrostatic pressure sensor measures liquid pressure associated with fluid head, often using a submerged or connected diaphragm sensing arrangement.
5 editions5 July 2026
