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Electronics & Semiconductor

InGaAs APD Array

An InGaAs avalanche photodiode array detects light across multiple elements with avalanche gain; spectral response, gain uniformity and noise determine the usable optical signal.

Types
Linear Array · Matrix Array · Multielement Array
Applications
Laser Ranging · Hyperspectral Imaging · Lidar

5 editions13 August 2026

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Electronics & Semiconductor

4-Inch GaN Free-Standing Substrate Wafer

4-Inch GaN Free-Standing Substrate Wafer refers to semiconductor materials or substrates within the named composition/process category.

Types
N-type Doping · Semi-insulating
Applications
Laser Diodes · Power Electronics · High Frequency Electronics

5 editions6 July 2026

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Electronics & Semiconductor

555 Timer IC

555 Timer IC refers to semiconductor components implementing the named electronic function.

Types
Using Bipolar Transistors · Adopt CMOS Design
Applications
Monostable Mode · Bistable Mode · No Steady State Mode

5 editions4 June 2026

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Electronics & Semiconductor

3D Silicon Interposer

3D Silicon Interposer refers to silicon interconnect substrates joining components within an identified package architecture.

Types
200 µm to 500 µm · 500 µm to 1000 µm · Others
Applications
Imaging & Optoelectronics · Memory · MEMS/sensors

5 editions23 January 2026

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Electronics & Semiconductor

3D XPoint Technology

3D XPoint Technology refers to the named non-volatile memory technology associated with Optane-era storage and persistent-memory products.

Types
750GB · 1.5 TB
Applications
Telecommunication · Consumer Electronics · Automotive

5 editions6 June 2026

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Electronics & Semiconductor

Board-to-Board Connectors for Electronics

Board-to-Board Connectors for Electronics refers to inter-board connectors whose contact arrangement and stacking geometry define the electrical interface. Contacts, insulation, mating geometry and shielding establish the installed electrical channel, with reliability depending on the whole connection.

Types
<1.00 mm · 1.00 mm~2.00 mm · > 2.00 mm
Applications
Transportation · Consumer Electronics · Communications

5 editions4 March 2026

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Electronics & Semiconductor

4 & 6 Inch SiC Wafer

4 & 6 Inch SiC Wafer refers to semiconductor materials or substrates within the named composition/process category.

Types
4 Inch SiC Wafer · 6 Inch SiC Wafer
Applications
Power Device · Electronics & Optoelectronics · Wireless Infrastructure

5 editions4 January 2026

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Electronics & Semiconductor

2D Position Sensors

2D Position Sensors is a sensing device or sensor grouping that converts the named physical quantity into usable data.

Types
Ge Type · InSb Type
Applications
Consumer Electronics · Healthcare · Aerospace & Defense

5 editions6 January 2026

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Electronics & Semiconductor

Gold Stud Bump Flip Chips

A gold stud-bump flip chip uses formed gold bumps as part of the die-to-substrate interconnection; bump geometry, bonding method and substrate compatibility determine the assembled connection.

Types
Display Driver Chip · Sensors and Other Chips
Applications
Smartphone · LCD TV · Notebook

5 editions13 August 2026

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Electronics & Semiconductor

28nm Smartphone Processors

28nm Smartphone Processors is a semiconductor processing, control or communications device supplied for the named digital or circuit function.

Types
Dual Core · Quad Core · Hexa Core
Applications
Entry-level Smartphone · High-end Smartphone

5 editions4 March 2026

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Electronics & Semiconductor

Automotive Digital Signal Sensor

A sensor providing a digital measurement or detection output for automotive systems.

Types
Automotive Built-In Magnetic Sensor · Automotive External Magnetic Sensor
Applications
Passenger Cars · Light Commercial Vehicles · Heavy Duty Trucks

5 editions13 August 2026

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Electronics & Semiconductor

3-Axis Force Sensor

3-Axis Force Sensor is a force-sensing assembly with the axis organisation named in the catalogue.

Types
Commercial Grade · Military Grade
Applications
Automotive · Robots · Others

5 editions6 January 2026

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