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Electronics & Semiconductor

3D Magnetic Sensing Chip

3D Magnetic Sensing Chip refers to semiconductor sensing components for the magnetic quantities named in the study.

Types
Hall Effect · Magnetoresistive Effect
Applications
Vehicle Electronics · Consumer Electronics · Automated Industrial

5 editions10 April 2026

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Electronics & Semiconductor

3D Magnetic Sensors

A 3D magnetic sensor measures magnetic-field components along three axes. A host or integrated processor uses those components to derive position, angle or other application quantities.

Types
Linear 3D Magnetic Sensors · Rotary 3D Magnetic Sensors
Applications
Automotive · Industrial · Consumer Electronics

5 editions13 August 2026

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Electronics & Semiconductor

3D MEMS Probe Card

3D MEMS Probe Card refers to wafer-test interface assemblies employing the named probe construction.

Types
Single Die · Multi-die
Applications
Semiconductor Industry · Automotive and Transportation Industry · Consumer Electronics Industry

5 editions11 April 2026

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Electronics & Semiconductor

3D Microfluidic Organ Chip

3D Microfluidic Organ Chip refers to microfluidic devices or research substrates for the named small-volume workflow.

Types
Brain-on-a-chip · Liver-on-a-chip · Kidney-on-a-chip
Applications
Hospital · Biotechnology · Others

5 editions31 January 2026

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Electronics & Semiconductor

3D Microscopy

3D Microscopy refers to optical imaging equipment for examining three-dimensional research specimens.

Types
Automatic Type · Manual Type
Applications
Medical · Food Science · The Medical

5 editions5 July 2026

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Electronics & Semiconductor

3D Mobile Sensing Hardware

3D Mobile Sensing Hardware refers to sensing hardware integrated with the named mobile or embedded platform.

Types
External Sensors · Built-in (Embedded, Internal) Sensors
Applications
Consumer Electronics · Security & Surveillance · Healthcare

5 editions3 May 2026

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Electronics & Semiconductor

3D Motion Capture System

3D Motion Capture System refers to sensing equipment or analytical tools for recording the named motion or body geometry.

Types
System · Services · Hardware
Applications
Entertainment · Life Science · Others

5 editions21 December 2025

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Electronics & Semiconductor

3D Multi-chip Integrated Packaging

3D Multi-chip Integrated Packaging refers to semiconductor devices, packages or fabrication services in the named process category.

Types
Through Silicon Via (TSV) · Through Glass Via (TGV) · Other
Applications
Automotive · Industrial · Medical

5 editions5 March 2026

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Electronics & Semiconductor

3D NAND Chip

3D NAND Chip refers to memory components or module technologies in the named architecture category.

Types
64 Layer · 96 Layer · 128 Layer
Applications
SSD · Consumer Electronics

5 editions2 May 2026

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Electronics & Semiconductor

3D NAND Flash Memory

3D NAND Flash Memory refers to memory components or module technologies in the named architecture category.

Types
MLC Type · TLC Type · Others
Applications
SSD · Consumer Electronics

5 editions21 December 2025

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Electronics & Semiconductor

3D NAND Memory

A non-volatile NAND-memory with memory cells organised in vertically stacked layers.

Types
Single-level Cell (SLC) · Multi-level Cell (MLC) · Triple-level Cell (TLC)
Applications
Consumer Electronics · Mass Storage · Industrial

5 editions13 August 2026

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Electronics & Semiconductor

3D Narrow Band Filters

A narrow-band optical-filter associated with three-dimensional optical sensing; its spectral passband and measurement configuration define the filter function.

Types
Visible Light Band · Near Infrared Band
Applications
Face Recognition · Autonomous Driving · Machine Vision

5 editions13 August 2026

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