Electronics & Semiconductor
Fan-Out Wafer Level Packaging
The Fan-Out WLP technique involves cutting and separating the chip and then embedding the chip inside the panel. The procedure is to attach the chip face down to the Carrier, and the chip spacing should conform to the Pitch specification of the circuit design, while the receiver performs Molding to form a Panel. Follow-up will be separation, sealant panel and a vehicle for sealant panel Wafer shape, also called reconstruct Wafer (Reconstituted Wafer), can be widely used…
- Types
- High Density Fan-Out Package · Core Fan-Out Package
- Applications
- CMOS Image Sensor · A Wireless Connection · Logic and Memory Integrated Circuits
5 editions27 December 2025
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