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Electronics & Semiconductor

Through-Silicon Vias (TSVs)

Silicon through-hole Technology (TSV) is a kind of circuit interconnection technology. It realizes interconnection between chips by making vertical conduction between chips and between wafers and between wafers. Different from the previous IC packaging bonding and dot coating stacking technology, TSV can maximize the chip stacking density in three-dimensional direction, reduce the chip size, increase the transistor density of the chip, improve the electrical interconnection…

Types
2.5D Through-Silicon Vias · 3D Through-Silicon Vias
Applications
Mobile And Consumer Electronics · Communication Equipment · Automotive And Transportation Electronics

5 editions28 December 2025

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Electronics & Semiconductor

Industrial Wireless Chipsets

Types
Processor Chipset · Wireless Communication Chipset · Sensor Chipset
Applications
Industrial Automation · Wireless Sensor Networks (WSN) · Smart Factories

5 editions5 June 2026

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Electronics & Semiconductor

Laser Diffuse Mode Sensor

Types
Class 1 Laser · Class 2 Laser · Red or Infrared Laser
Applications
Industrial Automation · Automotive Manufacturing · Food and Beverage

5 editions7 July 2026

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