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Clear all filtersElectronics & Semiconductor
300 mm CMP Pads is a consumable or interface component for the named semiconductor processing or wafer-handling step.
5 editions31 January 2026
Electronics & Semiconductor
300 mm FOUP Door Opener is a protective semiconductor-wafer handling or transport container defined by the named carrier format.
5 editions6 July 2026
Electronics & Semiconductor
300 mm Front Opening Unified Pods (FOUPs) is a protective semiconductor-wafer handling or transport container defined by the named carrier format.
5 editions23 January 2026
Electronics & Semiconductor
300 mm Semiconductor Wafer Carrier for Thin Wafer is a protective semiconductor-wafer handling or transport container defined by the named carrier format.
5 editions6 July 2026
Electronics & Semiconductor
300 mm Through Glass Via Wafer is a semiconductor or functional substrate material supplied in the geometry and processing state named in the catalogue.
5 editions6 January 2026
Electronics & Semiconductor
300 mm Wafer CMP Retaining Rings is a consumable or interface component for the named semiconductor processing or wafer-handling step.
5 editions1 January 2026
Electronics & Semiconductor
300 mm Wafer Electrostatic Chucks is a wafer-support or thermal-processing component defined by its holding and process interfaces.
5 editions1 January 2026
Electronics & Semiconductor
300 mm Wafer Front Opening Unified Pod is a front-opening semiconductor-wafer handling pod in the wafer-diameter class named in the catalogue.
5 editions10 April 2026
Electronics & Semiconductor
300 mm Wafer Probing Machines is semiconductor test or inspection equipment that positions wafers and acquires an identified electrical or optical result.
5 editions31 January 2026
Electronics & Semiconductor
300 mm Wafer Ring Frame is a frame used to support a wafer or wafer-mounted film within a defined handling process.
5 editions7 July 2026
Electronics & Semiconductor
300 mm Wafer Shippers and Carriers is a protective semiconductor-wafer handling or transport container defined by the named carrier format.
5 editions3 May 2026
Electronics & Semiconductor
An atomic layer deposition tool alternates precursor exposure and separation steps to build a film through surface reactions on 300 mm wafers.
5 editions6 January 2026
