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Electronics & Semiconductor

2.4GHz Wireless MCU Chip

2.4GHz Wireless MCU Chip is a semiconductor processing, control or communications device supplied for the named digital or circuit function.

Types
Single Transmitter · Transmitter And Receiver In One
Applications
Smart Home · IoT · Unlimited Sensor Network

5 editions3 May 2026

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Electronics & Semiconductor

2.5D and 3D IC Packaging

2.5D and 3D IC Packaging is a software, technical-service or implementation offering with the deliverable named in the catalogue.

Types
2.5D · 3D TSV · 3D Wafer-level Chip-scale Packaging
Applications
Consumer Electronics · Medical Devices · Communications and Telecom

5 editions4 July 2026

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Electronics & Semiconductor

2.5D and 3D Semiconductor Packaging

2.5D and 3D Semiconductor Packaging is a software, technical-service or implementation offering with the deliverable named in the catalogue.

Types
3D Wire Bonding · 3D TSV · 3D Fan Out
Applications
Consumer Electronics · Industrial · Automotive and Transport

5 editions31 January 2026

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Electronics & Semiconductor

2.5D Heterogeneous and 3D Wafer-Level Stack Packaging Technology

2.5D Heterogeneous and 3D Wafer-Level Stack Packaging Technology is a software, technical-service or implementation offering with the deliverable named in the catalogue.

Types
Fan-in Wafer Level Packaging · Fan-out Wafer Level Packaging
Applications
Automotive · Consumer Electronics · Others

5 editions2 May 2026

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Electronics & Semiconductor

2.5D Interposer

2.5D Interposer is an intermediate interconnect substrate used within an identified semiconductor-packaging architecture.

Types
Silicon · Organic and Glass
Applications
CIS · CPU/GPU · MEMS 3D Capping Interposer

5 editions24 January 2026

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Electronics & Semiconductor

2.5D MEMS Probe Card

2.5D MEMS Probe Card is a probe-card assembly for electrical contact with semiconductor devices under test.

Types
MEMS Probe Card · Vertical Probe Card · Cantilever Probe Card
Applications
High-Performance Computing and AI Chips · High-End Memory · Networking and Communication Chips

5 editions5 July 2026

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$4,950Single user · USD · Market Analysis & ForecastExplore product: 2.5D MEMS Probe CardCompare research options for 2.5D MEMS Probe Card

Electronics & Semiconductor

2.5D Silicon Interposer

2.5D Silicon Interposer is a silicon-based interconnect substrate for an identified semiconductor-packaging boundary.

Types
200 µm to 500 µm · 500 µm to 1000 µm · Others
Applications
Imaging & Optoelectronics · Memory · MEMS/sensors

5 editions23 January 2026

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Electronics & Semiconductor

2.5G APD Avalanche Photodetector

2.5G APD Avalanche Photodetector is a semiconductor optical source, receiver or related chip supplied for the named communications function.

Types
Line-Mode · Geiger-Mode
Applications
Laser Application · Optical Communications · Biomedical

5 editions24 January 2026

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Electronics & Semiconductor

2.5G DFB Laser Chip

2.5G DFB Laser Chip is a semiconductor optical source, receiver or related chip supplied for the named communications function.

Types
1310nm DFB Laser Chip · 1490nm DFB Laser Chip · 1270nm DFB Laser Chip
Applications
GPON · XG-PON · 40/80km Fiber Access

5 editions23 January 2026

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Electronics & Semiconductor

2.5G Ethernet Physical Layer Chip

2.5G Ethernet Physical Layer Chip is a semiconductor processing, control or communications device supplied for the named digital or circuit function.

Types
Single-Port · Multi-Port
Applications
Data Centers · Industrial Automation · Consumer Electronics

5 editions1 January 2026

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Electronics & Semiconductor

200 mm Thin Wafer

A 200 mm thin wafer is a semiconductor substrate with specified diameter, reduced thickness and handling requirements.

Types
Temporary Bonding & Debonding · Carrier-less/Taiko Process
Applications
MEMS · CMOS Image Sensors · Memory

5 editions13 August 2026

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$4,950Single user · USD · Market Analysis & ForecastExplore product: 200 mm Thin WaferCompare research options for 200 mm Thin Wafer

Electronics & Semiconductor

200 mm Wafer Chemical Mechanical Polishing Machines

200 mm Wafer Chemical Mechanical Polishing Machines is wafer chemical-mechanical polishing equipment in the diameter class named in the catalogue.

Types
Copper CMP Machines · Silicon Oxide CMP Machines · Front-end Tungsten CMP Machines
Applications
IDM · Foundry

5 editions6 January 2026

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$4,950Single user · USD · Market Analysis & ForecastExplore product: 200 mm Wafer Chemical Mechanical Polishing MachinesCompare research options for 200 mm Wafer Chemical Mechanical Polishing Machines
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