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Chemical & Material

Low-Stress Encapsulation Adhesive

Types
Epoxy-Based Low-Stress Encapsulation Adhesive · Silicone Low-Stress Encapsulation Adhesive · Urethane Low-Stress Encapsulation Adhesive
Applications
Semiconductor and Advanced Package · Power Electronics Module · Sensor and MEMS Module

5 editions13 August 2026

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Chemical & Material

Hydroxypropyl Dextran Gel

Types
Organic Solvent System · Water-organic Mixed System · Aqueous System
Applications
Life Science Research · Biopharmaceutical Industry · Others

5 editions2 January 2026

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