Selected research
Industry Research
AI Data Center Direct to Chip Cooling Industry Research Report 2026
Market perspective
The global AI Data Center Direct to Chip Cooling market was valued at US$ million in 2025 and is projected to reach US$ million by 2032, implying a CAGR of % over 2026–2032.
North America: the AI Data Center Direct to Chip Cooling market is projected to increase from US$ million in 2026 to US$ million by 2032, reflecting a CAGR of % over 2026–2032. Europe: the AI Data Center Direct to Chip Cooling market is projected to rise from US$ million in 2026 to US$ million by 2032, registering a CAGR of % over 2026–2032. Asia Pacific: the AI Data Center Direct to Chip Cooling market is expected to grow from US$ million in 2026 to US$ million by 2032, at a CAGR of % over 2026–2032. Leading global service providers of AI Data Center Direct to Chip Cooling include Vertiv, nVent, Lenovo, Supermicro, Schneider Electric, Flex Ltd., CoolIT System, Modine and DCX Liquid Cooling Systems, among others; in 2025, the top three vendors together accounted for approximately % of global revenue.
Report Scope
Read the full market overview
This report quantifies the global AI Data Center Direct to Chip Cooling market in terms of revenue (US$ million) and, where applicable, service volume (k units), using 2024 as the base year and providing annual historical and forecast data for 2021–2032.
It standardizes definitions of service Types and end-use Applications, harmonizes provider attribution, and delivers comparable time series by company, Type, Application, and region or country, including indicative price bands (US$/k units) and concentration ratios (CR5/CR10). Outputs are intended to support service design, budgeting, capacity planning, and benchmarking for providers, platforms, channel partners, and investors; the report also reviews technology shifts and notable service innovations relevant to AI Data Center Direct to Chip Cooling.
Key Companies & Market Share Insights
This section profiles leading service providers with 2021–2025 results and a 2026–2032 outlook—covering revenue, market share, price bands, service portfolio and client mix, regional and channel mix, and key developments (M&A, network expansion, certifications). It also provides global revenue, average price, and—where applicable—volume metrics by provider, and calculates CR5/CR10 and rank changes to support comparative benchmarking.
AI Data Center Direct to Chip Cooling Market by Company
Vertiv
nVent
Lenovo
Supermicro
Schneider Electric
Flex Ltd.
CoolIT System
Modine
DCX Liquid Cooling Systems
Inspur
Malico
ZutaCore
Chilldyne
Accelsius
Delta Power Solutions
Stulz
Iceotope Precision Liquid Cooling
Iceotope
BOYD
Wiwynn Corporation
Kaori
Rittal GmbH & Co. KG
LiquidStack
Taisol Electronics
Quanta
Shenzhen Green Cloud Map Technology
Goaland Energy Conservation Tech
AI Data Center Direct to Chip Cooling Segment by Type
Water-based Coolant Direct Cooling
Non-water-based Coolant Direct Cooling
AI Data Center Direct to Chip Cooling Segment by Application
Cloud Data Centers
AI Data Centers / AI Servers
High-Performance Computing (HPC)
Enterprise Data Centers
Others
AI Data Center Direct to Chip Cooling Segment by Region
North America
United States
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Spain
Russia
Netherlands
Nordic Countries
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Southeast Asia
South America
Brazil
Argentina
Chile
Colombia
Middle East & Africa
Saudi Arabia
Israel
United Arab Emirates
Turkey
Iran
Egypt
Key Drivers & Barriers
High-impact rendering factors and drivers have been studied in this report to aid the readers to understand the general development. Moreover, the report includes restraints and challenges that may act as stumbling blocks on the way of the players. This will assist the users to be attentive and make informed decisions related to business. Specialists have also laid their focus on the upcoming business prospects.
Reasons to Buy This Report
1. This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global AI Data Center Direct to Chip Cooling market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.
2. This report will help stakeholders to understand the global industry status and trends of AI Data Center Direct to Chip Cooling and provides them with information on key market drivers, restraints, challenges, and opportunities.
3. This report will help stakeholders to understand competitors better and gain more insights to strengthen their position in their businesses. The competitive landscape section includes the market share and rank (in volume and value), competitor ecosystem, new product development, expansion, and acquisition.
4. This report stays updated with novel technology integration, features, and the latest developments in the market
5. This report helps stakeholders to gain insights into which regions to target globally
6. This report helps stakeholders to gain insights into the end-user perception concerning the adoption of AI Data Center Direct to Chip Cooling.
7. This report helps stakeholders to identify some of the key players in the market and understand their valuable contribution.
Chapter Outline
Chapter 1: Research objectives, research methods, data sources, data cross-validation;
Chapter 2: Introduces the report scope of the report, executive summary of different market segments (product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 3: Provides the analysis of various market segments product types, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 6: Detailed analysis of AI Data Center Direct to Chip Cooling companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 7, 8, 9, 10, 11: North America, Europe, Asia Pacific, South America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 12: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including revenue, gross margin, product introduction, recent development, etc.
Chapter 13: The main points and conclusions of the report.
More report detail
Tables and figures
Scope & coverage.
Types
- Water-based Coolant Direct Cooling
- Non-water-based Coolant Direct Cooling
Applications
- Cloud Data Centers
- AI Data Centers / AI Servers
- High-Performance Computing (HPC)
- Enterprise Data Centers
- Others
Companies covered
- Vertiv
- nVent
- Lenovo
- Supermicro
- Schneider Electric
- Flex Ltd.
- CoolIT System
- Modine
- DCX Liquid Cooling Systems
- Inspur
- Malico
- ZutaCore
- Chilldyne
- Accelsius
- Delta Power Solutions
- Stulz
- Iceotope Precision Liquid Cooling
- Iceotope
- BOYD
- Wiwynn Corporation
- Kaori
- Rittal GmbH & Co. KG
- LiquidStack
- Taisol Electronics
- Quanta
- Shenzhen Green Cloud Map Technology
- Goaland Energy Conservation Tech
Inside the report.
1 Preface
- 1.1 Scope of Report
- 1.2 Reasons for Doing This Study
- 1.3 Research Methodology
- 1.4 Research Process
- 1.5 Data Source
- 1.5.1 Secondary Sources
- 1.5.2 Primary Sources
2 Market Overview
- 2.1 Product Definition
- 2.2 AI Data Center Direct to Chip Cooling by Type
- 2.2.1 Market Value Comparison by Type (2021 VS 2025 VS 2032)
- 2.2.2 Water-based Coolant Direct Cooling
- 2.2.3 Non-water-based Coolant Direct Cooling
- 2.3 AI Data Center Direct to Chip Cooling by Application
- 2.3.1 Market Value Comparison by Application (2021 VS 2025 VS 2032)
- 2.3.2 Cloud Data Centers
- 2.3.3 AI Data Centers / AI Servers
- 2.3.4 High-Performance Computing (HPC)
- 2.3.5 Enterprise Data Centers
- 2.3.6 Others
- 2.4 Assumptions and Limitations
3 AI Data Center Direct to Chip Cooling Breakdown Data by Type
- 3.1 Global AI Data Center Direct to Chip Cooling Historic Market Size by Type (2021-2026)
- 3.2 Global AI Data Center Direct to Chip Cooling Forecasted Market Size by Type (2027-2032)
4 AI Data Center Direct to Chip Cooling Breakdown Data by Application
- 4.1 Global AI Data Center Direct to Chip Cooling Historic Market Size by Application (2021-2026)
- 4.2 Global AI Data Center Direct to Chip Cooling Forecasted Market Size by Application (2027-2032)
5 Global Growth Trends
- 5.1 Global AI Data Center Direct to Chip Cooling Market Perspective (2021-2032)
- 5.2 Global AI Data Center Direct to Chip Cooling Growth Trends by Region
- 5.2.1 Global AI Data Center Direct to Chip Cooling Market Size by Region: 2021 VS 2025 VS 2032
- 5.2.2 AI Data Center Direct to Chip Cooling Historic Market Size by Region (2021-2026)
- 5.2.3 AI Data Center Direct to Chip Cooling Forecasted Market Size by Region (2027-2032)
- 5.3 AI Data Center Direct to Chip Cooling Market Dynamics
- 5.3.1 AI Data Center Direct to Chip Cooling Industry Trends
- 5.3.2 AI Data Center Direct to Chip Cooling Market Drivers
- 5.3.3 AI Data Center Direct to Chip Cooling Market Challenges
- 5.3.4 AI Data Center Direct to Chip Cooling Market Restraints
6 Market Competitive Landscape by Players
- 6.1 Global Top AI Data Center Direct to Chip Cooling Players by Revenue
- 6.1.1 Global Top AI Data Center Direct to Chip Cooling Players by Revenue (2021-2026)
- 6.1.2 Global AI Data Center Direct to Chip Cooling Revenue Market Share by Players (2021-2026)
- 6.2 Global AI Data Center Direct to Chip Cooling Industry Players Ranking, 2023 VS 2024 VS 2025
- 6.3 Global Key Players of AI Data Center Direct to Chip Cooling Head Office and Area Served
- 6.4 Global AI Data Center Direct to Chip Cooling Players, Product Type & Application
- 6.5 Global AI Data Center Direct to Chip Cooling Manufacturers Established Date
- 6.6 Global AI Data Center Direct to Chip Cooling Market CR5 and HHI
- 6.7 Global Players Mergers & Acquisition
7 North America
- 7.1 North America AI Data Center Direct to Chip Cooling Market Size (2021-2032)
- 7.2 North America AI Data Center Direct to Chip Cooling Market Growth Rate by Country: 2021 VS 2025 VS 2032
- 7.3 North America AI Data Center Direct to Chip Cooling Market Size by Country (2021-2026)
- 7.4 North America AI Data Center Direct to Chip Cooling Market Size by Country (2027-2032)
- 7.5 United States
- 7.5 United States
- 7.6 Canada
- 7.7 Mexico
8 Europe
- 8.1 Europe AI Data Center Direct to Chip Cooling Market Size (2021-2032)
- 8.2 Europe AI Data Center Direct to Chip Cooling Market Growth Rate by Country: 2021 VS 2025 VS 2032
- 8.3 Europe AI Data Center Direct to Chip Cooling Market Size by Country (2021-2026)
- 8.4 Europe AI Data Center Direct to Chip Cooling Market Size by Country (2027-2032)
- 8.5 Germany
- 8.6 France
- 8.7 U.K.
- 8.8 Italy
- 8.9 Spain
- 8.10 Russia
- 8.11 Netherlands
- 8.12 Nordic Countries
9 Asia-Pacific
- 9.1 Asia-Pacific AI Data Center Direct to Chip Cooling Market Size (2021-2032)
- 9.2 Asia-Pacific AI Data Center Direct to Chip Cooling Market Growth Rate by Country: 2021 VS 2025 VS 2032
- 9.3 Asia-Pacific AI Data Center Direct to Chip Cooling Market Size by Country (2021-2026)
- 9.4 Asia-Pacific AI Data Center Direct to Chip Cooling Market Size by Country (2027-2032)
- 9.5 China
- 9.6 Japan
- 9.7 South Korea
- 9.8 India
- 9.9 Australia
- 9.10 China Taiwan
- 9.11 Southeast Asia
10 South America
- 10.1 South America AI Data Center Direct to Chip Cooling Market Size (2021-2032)
- 10.2 South America AI Data Center Direct to Chip Cooling Market Growth Rate by Country: 2021 VS 2025 VS 2032
- 10.3 South America AI Data Center Direct to Chip Cooling Market Size by Country (2021-2026)
- 10.4 South America AI Data Center Direct to Chip Cooling Market Size by Country (2027-2032)
- 10.5 Brazil
- 10.6 Argentina
- 10.7 Chile
- 10.8 Colombia
- 10.9 Peru
11 Middle East & Africa
- 11.1 Middle East & Africa AI Data Center Direct to Chip Cooling Market Size (2021-2032)
- 11.2 Middle East & Africa AI Data Center Direct to Chip Cooling Market Growth Rate by Country: 2021 VS 2025 VS 2032
- 11.3 Middle East & Africa AI Data Center Direct to Chip Cooling Market Size by Country (2021-2026)
- 11.4 Middle East & Africa AI Data Center Direct to Chip Cooling Market Size by Country (2027-2032)
- 11.5 Saudi Arabia
- 11.6 Israel
- 11.7 United Arab Emirates
- 11.8 Turkey
- 11.9 Iran
- 11.10 Egypt
12 Players Profiled
- 12.1 Vertiv
- 12.1.1 Vertiv Company Information
- 12.1.2 Vertiv Business Overview
- 12.1.3 Vertiv Revenue in AI Data Center Direct to Chip Cooling Business (2021-2026)
- 12.1.4 Vertiv AI Data Center Direct to Chip Cooling Product Portfolio
- 12.1.5 Vertiv Recent Developments
- 12.2 nVent
- 12.2.1 nVent Company Information
- 12.2.2 nVent Business Overview
- 12.2.3 nVent Revenue in AI Data Center Direct to Chip Cooling Business (2021-2026)
- 12.2.4 nVent AI Data Center Direct to Chip Cooling Product Portfolio
- 12.2.5 nVent Recent Developments
- 12.3 Lenovo
- 12.3.1 Lenovo Company Information
- 12.3.2 Lenovo Business Overview
- 12.3.3 Lenovo Revenue in AI Data Center Direct to Chip Cooling Business (2021-2026)
- 12.3.4 Lenovo AI Data Center Direct to Chip Cooling Product Portfolio
- 12.3.5 Lenovo Recent Developments
- 12.4 Supermicro
- 12.4.1 Supermicro Company Information
- 12.4.2 Supermicro Business Overview
- 12.4.3 Supermicro Revenue in AI Data Center Direct to Chip Cooling Business (2021-2026)
- 12.4.4 Supermicro AI Data Center Direct to Chip Cooling Product Portfolio
- 12.4.5 Supermicro Recent Developments
- 12.5 Schneider Electric
- 12.5.1 Schneider Electric Company Information
- 12.5.2 Schneider Electric Business Overview
- 12.5.3 Schneider Electric Revenue in AI Data Center Direct to Chip Cooling Business (2021-2026)
- 12.5.4 Schneider Electric AI Data Center Direct to Chip Cooling Product Portfolio
- 12.5.5 Schneider Electric Recent Developments
- 12.6 Flex Ltd.
- 12.6.1 Flex Ltd. Company Information
- 12.6.2 Flex Ltd. Business Overview
- 12.6.3 Flex Ltd. Revenue in AI Data Center Direct to Chip Cooling Business (2021-2026)
- 12.6.4 Flex Ltd. AI Data Center Direct to Chip Cooling Product Portfolio
- 12.6.5 Flex Ltd. Recent Developments
- 12.7 CoolIT System
- 12.7.1 CoolIT System Company Information
- 12.7.2 CoolIT System Business Overview
- 12.7.3 CoolIT System Revenue in AI Data Center Direct to Chip Cooling Business (2021-2026)
- 12.7.4 CoolIT System AI Data Center Direct to Chip Cooling Product Portfolio
- 12.7.5 CoolIT System Recent Developments
- 12.8 Modine
- 12.8.1 Modine Company Information
- 12.8.2 Modine Business Overview
- 12.8.3 Modine Revenue in AI Data Center Direct to Chip Cooling Business (2021-2026)
- 12.8.4 Modine AI Data Center Direct to Chip Cooling Product Portfolio
- 12.8.5 Modine Recent Developments
- 12.9 DCX Liquid Cooling Systems
- 12.9.1 DCX Liquid Cooling Systems Company Information
- 12.9.2 DCX Liquid Cooling Systems Business Overview
- 12.9.3 DCX Liquid Cooling Systems Revenue in AI Data Center Direct to Chip Cooling Business (2021-2026)
- 12.9.4 DCX Liquid Cooling Systems AI Data Center Direct to Chip Cooling Product Portfolio
- 12.9.5 DCX Liquid Cooling Systems Recent Developments
- 12.10 Inspur
- 12.10.1 Inspur Company Information
- 12.10.2 Inspur Business Overview
- 12.10.3 Inspur Revenue in AI Data Center Direct to Chip Cooling Business (2021-2026)
- 12.10.4 Inspur AI Data Center Direct to Chip Cooling Product Portfolio
- 12.10.5 Inspur Recent Developments
- 12.11 Malico
- 12.11.1 Malico Company Information
- 12.11.2 Malico Business Overview
- 12.11.3 Malico Revenue in AI Data Center Direct to Chip Cooling Business (2021-2026)
- 12.11.4 Malico AI Data Center Direct to Chip Cooling Product Portfolio
- 12.11.5 Malico Recent Developments
- 12.12 ZutaCore
- 12.12.1 ZutaCore Company Information
- 12.12.2 ZutaCore Business Overview
- 12.12.3 ZutaCore Revenue in AI Data Center Direct to Chip Cooling Business (2021-2026)
- 12.12.4 ZutaCore AI Data Center Direct to Chip Cooling Product Portfolio
- 12.12.5 ZutaCore Recent Developments
- 12.13 Chilldyne
- 12.13.1 Chilldyne Company Information
- 12.13.2 Chilldyne Business Overview
- 12.13.3 Chilldyne Revenue in AI Data Center Direct to Chip Cooling Business (2021-2026)
- 12.13.4 Chilldyne AI Data Center Direct to Chip Cooling Product Portfolio
- 12.13.5 Chilldyne Recent Developments
- 12.14 Accelsius
- 12.14.1 Accelsius Company Information
- 12.14.2 Accelsius Business Overview
- 12.14.3 Accelsius Revenue in AI Data Center Direct to Chip Cooling Business (2021-2026)
- 12.14.4 Accelsius AI Data Center Direct to Chip Cooling Product Portfolio
- 12.14.5 Accelsius Recent Developments
- 12.15 Delta Power Solutions
- 12.15.1 Delta Power Solutions Company Information
- 12.15.2 Delta Power Solutions Business Overview
- 12.15.3 Delta Power Solutions Revenue in AI Data Center Direct to Chip Cooling Business (2021-2026)
- 12.15.4 Delta Power Solutions AI Data Center Direct to Chip Cooling Product Portfolio
- 12.15.5 Delta Power Solutions Recent Developments
- 12.16 Stulz
- 12.16.1 Stulz Company Information
- 12.16.2 Stulz Business Overview
- 12.16.3 Stulz Revenue in AI Data Center Direct to Chip Cooling Business (2021-2026)
- 12.16.4 Stulz AI Data Center Direct to Chip Cooling Product Portfolio
- 12.16.5 Stulz Recent Developments
- 12.17 Iceotope Precision Liquid Cooling
- 12.17.1 Iceotope Precision Liquid Cooling Company Information
- 12.17.2 Iceotope Precision Liquid Cooling Business Overview
- 12.17.3 Iceotope Precision Liquid Cooling Revenue in AI Data Center Direct to Chip Cooling Business (2021-2026)
- 12.17.4 Iceotope Precision Liquid Cooling AI Data Center Direct to Chip Cooling Product Portfolio
- 12.17.5 Iceotope Precision Liquid Cooling Recent Developments
- 12.18 Iceotope
- 12.18.1 Iceotope Company Information
- 12.18.2 Iceotope Business Overview
- 12.18.3 Iceotope Revenue in AI Data Center Direct to Chip Cooling Business (2021-2026)
- 12.18.4 Iceotope AI Data Center Direct to Chip Cooling Product Portfolio
- 12.18.5 Iceotope Recent Developments
- 12.19 BOYD
- 12.19.1 BOYD Company Information
- 12.19.2 BOYD Business Overview
- 12.19.3 BOYD Revenue in AI Data Center Direct to Chip Cooling Business (2021-2026)
- 12.19.4 BOYD AI Data Center Direct to Chip Cooling Product Portfolio
- 12.19.5 BOYD Recent Developments
- 12.20 Wiwynn Corporation
- 12.20.1 Wiwynn Corporation Company Information
- 12.20.2 Wiwynn Corporation Business Overview
- 12.20.3 Wiwynn Corporation Revenue in AI Data Center Direct to Chip Cooling Business (2021-2026)
- 12.20.4 Wiwynn Corporation AI Data Center Direct to Chip Cooling Product Portfolio
- 12.20.5 Wiwynn Corporation Recent Developments
- 12.21 Kaori
- 12.21.1 Kaori Company Information
- 12.21.2 Kaori Business Overview
- 12.21.3 Kaori Revenue in AI Data Center Direct to Chip Cooling Business (2021-2026)
- 12.21.4 Kaori AI Data Center Direct to Chip Cooling Product Portfolio
- 12.21.5 Kaori Recent Developments
- 12.22 Rittal GmbH & Co. KG
- 12.22.1 Rittal GmbH & Co. KG Company Information
- 12.22.2 Rittal GmbH & Co. KG Business Overview
- 12.22.3 Rittal GmbH & Co. KG Revenue in AI Data Center Direct to Chip Cooling Business (2021-2026)
- 12.22.4 Rittal GmbH & Co. KG AI Data Center Direct to Chip Cooling Product Portfolio
- 12.22.5 Rittal GmbH & Co. KG Recent Developments
- 12.23 LiquidStack
- 12.23.1 LiquidStack Company Information
- 12.23.2 LiquidStack Business Overview
- 12.23.3 LiquidStack Revenue in AI Data Center Direct to Chip Cooling Business (2021-2026)
- 12.23.4 LiquidStack AI Data Center Direct to Chip Cooling Product Portfolio
- 12.23.5 LiquidStack Recent Developments
- 12.24 Taisol Electronics
- 12.24.1 Taisol Electronics Company Information
- 12.24.2 Taisol Electronics Business Overview
- 12.24.3 Taisol Electronics Revenue in AI Data Center Direct to Chip Cooling Business (2021-2026)
- 12.24.4 Taisol Electronics AI Data Center Direct to Chip Cooling Product Portfolio
- 12.24.5 Taisol Electronics Recent Developments
- 12.25 Quanta
- 12.25.1 Quanta Company Information
- 12.25.2 Quanta Business Overview
- 12.25.3 Quanta Revenue in AI Data Center Direct to Chip Cooling Business (2021-2026)
- 12.25.4 Quanta AI Data Center Direct to Chip Cooling Product Portfolio
- 12.25.5 Quanta Recent Developments
- 12.26 Shenzhen Green Cloud Map Technology
- 12.26.1 Shenzhen Green Cloud Map Technology Company Information
- 12.26.2 Shenzhen Green Cloud Map Technology Business Overview
- 12.26.3 Shenzhen Green Cloud Map Technology Revenue in AI Data Center Direct to Chip Cooling Business (2021-2026)
- 12.26.4 Shenzhen Green Cloud Map Technology AI Data Center Direct to Chip Cooling Product Portfolio
- 12.26.5 Shenzhen Green Cloud Map Technology Recent Developments
- 12.27 Goaland Energy Conservation Tech
- 12.27.1 Goaland Energy Conservation Tech Company Information
- 12.27.2 Goaland Energy Conservation Tech Business Overview
- 12.27.3 Goaland Energy Conservation Tech Revenue in AI Data Center Direct to Chip Cooling Business (2021-2026)
- 12.27.4 Goaland Energy Conservation Tech AI Data Center Direct to Chip Cooling Product Portfolio
- 12.27.5 Goaland Energy Conservation Tech Recent Developments
13 Report Conclusion
14 Disclaimer
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