APO RESEARCH · REPORT
Epoxy Molding Compounds
EMC (Epoxy Molding Compound) is a semi-conductor encapsulant which is used in most products where semi-conductors are applied, such as general home appliances including mobile phones, refrigerators and TVs, industrial devices and vehicles. With the development of IT technology and the development of electronic products based on modern technologies, the global semi-conductor market is expanding and the EMC demand is increasing.
Product & engineering
Understand the product.
EMC (Epoxy Molding Compound) is a semi-conductor encapsulant which is used in most products where semi-conductors are applied, such as general home appliances including mobile phones, refrigerators and TVs, industrial devices and vehicles. With the development of IT technology and the development of electronic products based on modern technologies, the global semi-conductor market is expanding and the EMC demand is increasing.
Selected research
Industry Research
Epoxy Molding Compounds Industry Research Report 2026
Market perspective
EMC (Epoxy Molding Compound) is a semi-conductor encapsulant which is used in most products where semi-conductors are applied, such as general home appliances including mobile phones, refrigerators and TVs, industrial devices and vehicles. With the development of IT technology and the development of electronic products based on modern technologies, the global semi-conductor market is expanding and the EMC demand is increasing.
Asia-Pacific is the largest Epoxy Molding Compounds market with about 86% market share. North America is follower, accounting for about 6% market share.The industry's leading producers are Sumitomo Bakelite, Hitachi Chemical and Chang Chun Group, which accounted for 21%, 11% and 4% of revenue.
Report Scope
Read the full market overview
This report quantifies the global Epoxy Molding Compounds market in revenue (US$ million) and, where applicable, sales volume (Kiloton), using 2025 as the base year and providing annual historical and forecast data for 2021–2032.
It standardizes definitions of types and applications, harmonizes vendor attribution, and presents comparable time series by company, type, application, and region/country, including indicative price bands (US$/Kiloton) and concentration ratios (CR5/CR10).
The outputs are intended to support strategy development, budgeting, and performance benchmarking for manufacturers, new entrants, channel partners, and investors; the report also reviews technology shifts and notable product introductions relevant to Epoxy Molding Compounds.
Key Companies & Market Share Insights
This section profiles leading manufacturers, combining 2021–2025 results with a 2026–2032 outlook. It reports revenue, market share, price bands, product and application mix, regional and channel mix, and key developments (M&A, capacity additions, certifications). It also provides global revenue, average price, and—where applicable—sales volume by manufacturer, and calculates CR5/CR10 and rank changes to support comparative benchmarking.
Epoxy Molding Compounds Market by Company
Sumitomo Bakelite
Hitachi Chemical
Chang Chun Group
Hysol Huawei Electronics
Panasonic
Kyocera
KCC
Samsung SDI
Eternal Materials
Jiangsu Zhongpeng New Material
Shin-Etsu Chemical
Hexion
Nepes
Tianjin Kaihua Insulating Material
HHCK
Scienchem
Beijing Sino-tech Electronic Material
Epoxy Molding Compounds Segment by Type
Normal Epoxy Molding Compound
Green Epoxy Molding Compound
Epoxy Molding Compounds Segment by Application
Semiconductor Encapsulation
Electronic Components
Epoxy Molding Compounds Segment by Region
North America
United States
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Spain
Netherlands
Switzerland
Sweden
Poland
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Southeast Asia
South America
Brazil
Argentina
Chile
Middle East & Africa
Egypt
South Africa
Israel
Türkiye
GCC Countries
Key Drivers & Barriers
High-impact rendering factors and drivers have been studied in this report to aid the readers to understand the general development. Moreover, the report includes restraints and challenges that may act as stumbling blocks on the way of the players. This will assist the users to be attentive and make informed decisions related to business. Specialists have also laid their focus on the upcoming business prospects.
Reasons to Buy This Report
1. This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global Epoxy Molding Compounds market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.
2. This report will help stakeholders to understand the global industry status and trends of Epoxy Molding Compounds and provides them with information on key market drivers, restraints, challenges, and opportunities.
3. This report will help stakeholders to understand competitors better and gain more insights to strengthen their position in their businesses. The competitive landscape section includes the market share and rank (in volume and value), competitor ecosystem, new product development, expansion, and acquisition.
4. This report stays updated with novel technology integration, features, and the latest developments in the market
5. This report helps stakeholders to gain insights into which regions to target globally
6. This report helps stakeholders to gain insights into the end-user perception concerning the adoption of Epoxy Molding Compounds.
7. This report helps stakeholders to identify some of the key players in the market and understand their valuable contribution.
Chapter Outline
Chapter 1: Research objectives, research methods, data sources, data cross-validation;
Chapter 2: Introduces the report scope of the report, executive summary of different market segments (by region, product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 3: Detailed analysis of Epoxy Molding Compounds manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 5: Production/output, value of Epoxy Molding Compounds by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 6: Consumption of Epoxy Molding Compounds in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 7: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 8: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 9: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 10: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 11: The main points and conclusions of the report.
More report detail
Tables and figures
Scope & coverage.
Types
- Normal Epoxy Molding Compound
- Green Epoxy Molding Compound
Applications
- Semiconductor Encapsulation
- Electronic Components
Companies covered
- Sumitomo Bakelite
- Hitachi Chemical
- Chang Chun Group
- Hysol Huawei Electronics
- Panasonic
- Kyocera
- KCC
- Samsung SDI
- Eternal Materials
- Jiangsu Zhongpeng New Material
- Shin-Etsu Chemical
- Hexion
- Nepes
- Tianjin Kaihua Insulating Material
- HHCK
- Scienchem
- Beijing Sino-tech Electronic Material
Inside the report.
1 Preface
- 1.1 Scope of Report
- 1.2 Reasons for Doing This Study
- 1.3 Research Methodology
- 1.4 Research Process
- 1.5 Data Source
- 1.5.1 Secondary Sources
- 1.5.2 Primary Sources
2 Market Overview
- 2.1 Product Definition
- 2.2 Epoxy Molding Compounds by Type
- 2.2.1 Market Value Comparison by Type (2021 VS 2025 VS 2032) & (US$ Million)
- 2.2.2 Normal Epoxy Molding Compound
- 2.2.3 Green Epoxy Molding Compound
- 2.3 Epoxy Molding Compounds by Application
- 2.3.1 Market Value Comparison by Application (2021 VS 2025 VS 2032) & (US$ Million)
- 2.3.2 Semiconductor Encapsulation
- 2.3.3 Electronic Components
- 2.4 Global Market Growth Prospects
- 2.4.1 Global Epoxy Molding Compounds Production Value Estimates and Forecasts (2021-2032)
- 2.4.2 Global Epoxy Molding Compounds Production Capacity Estimates and Forecasts (2021-2032)
- 2.4.3 Global Epoxy Molding Compounds Production Estimates and Forecasts (2021-2032)
- 2.4.4 Global Epoxy Molding Compounds Market Average Price (2021-2032)
3 Market Competitive Landscape by Manufacturers
- 3.1 Global Epoxy Molding Compounds Production by Manufacturers (2021-2026)
- 3.2 Global Epoxy Molding Compounds Production Value by Manufacturers (2021-2026)
- 3.3 Global Epoxy Molding Compounds Average Price by Manufacturers (2021-2026)
- 3.4 Global Epoxy Molding Compounds Industry Manufacturers Ranking, 2024 VS 2025 VS 2026
- 3.5 Global Epoxy Molding Compounds Key Manufacturers, Manufacturing Sites & Headquarters
- 3.6 Global Epoxy Molding Compounds Manufacturers, Product Type & Application
- 3.7 Global Epoxy Molding Compounds Manufacturers Established Date
- 3.8 Global Epoxy Molding Compounds Market CR5 and HHI
- 3.9 Global Manufacturers Mergers & Acquisition
4 Manufacturers Profiled
- 4.1 Sumitomo Bakelite
- 4.1.1 Sumitomo Bakelite Epoxy Molding Compounds Company Information
- 4.1.2 Sumitomo Bakelite Epoxy Molding Compounds Business Overview
- 4.1.3 Sumitomo Bakelite Epoxy Molding Compounds Production Capacity, Value and Gross Margin (2021-2026)
- 4.1.4 Sumitomo Bakelite Product Portfolio
- 4.1.5 Sumitomo Bakelite Recent Developments
- 4.2 Hitachi Chemical
- 4.2.1 Hitachi Chemical Epoxy Molding Compounds Company Information
- 4.2.2 Hitachi Chemical Epoxy Molding Compounds Business Overview
- 4.2.3 Hitachi Chemical Epoxy Molding Compounds Production Capacity, Value and Gross Margin (2021-2026)
- 4.2.4 Hitachi Chemical Product Portfolio
- 4.2.5 Hitachi Chemical Recent Developments
- 4.3 Chang Chun Group
- 4.3.1 Chang Chun Group Epoxy Molding Compounds Company Information
- 4.3.2 Chang Chun Group Epoxy Molding Compounds Business Overview
- 4.3.3 Chang Chun Group Epoxy Molding Compounds Production Capacity, Value and Gross Margin (2021-2026)
- 4.3.4 Chang Chun Group Product Portfolio
- 4.3.5 Chang Chun Group Recent Developments
- 4.4 Hysol Huawei Electronics
- 4.4.1 Hysol Huawei Electronics Epoxy Molding Compounds Company Information
- 4.4.2 Hysol Huawei Electronics Epoxy Molding Compounds Business Overview
- 4.4.3 Hysol Huawei Electronics Epoxy Molding Compounds Production Capacity, Value and Gross Margin (2021-2026)
- 4.4.4 Hysol Huawei Electronics Product Portfolio
- 4.4.5 Hysol Huawei Electronics Recent Developments
- 4.5 Panasonic
- 4.5.1 Panasonic Epoxy Molding Compounds Company Information
- 4.5.2 Panasonic Epoxy Molding Compounds Business Overview
- 4.5.3 Panasonic Epoxy Molding Compounds Production Capacity, Value and Gross Margin (2021-2026)
- 4.5.4 Panasonic Product Portfolio
- 4.5.5 Panasonic Recent Developments
- 4.6 Kyocera
- 4.6.1 Kyocera Epoxy Molding Compounds Company Information
- 4.6.2 Kyocera Epoxy Molding Compounds Business Overview
- 4.6.3 Kyocera Epoxy Molding Compounds Production Capacity, Value and Gross Margin (2021-2026)
- 4.6.4 Kyocera Product Portfolio
- 4.6.5 Kyocera Recent Developments
- 4.7 KCC
- 4.7.1 KCC Epoxy Molding Compounds Company Information
- 4.7.2 KCC Epoxy Molding Compounds Business Overview
- 4.7.3 KCC Epoxy Molding Compounds Production Capacity, Value and Gross Margin (2021-2026)
- 4.7.4 KCC Product Portfolio
- 4.7.5 KCC Recent Developments
- 4.8 Samsung SDI
- 4.8.1 Samsung SDI Epoxy Molding Compounds Company Information
- 4.8.2 Samsung SDI Epoxy Molding Compounds Business Overview
- 4.8.3 Samsung SDI Epoxy Molding Compounds Production Capacity, Value and Gross Margin (2021-2026)
- 4.8.4 Samsung SDI Product Portfolio
- 4.8.5 Samsung SDI Recent Developments
- 4.9 Eternal Materials
- 4.9.1 Eternal Materials Epoxy Molding Compounds Company Information
- 4.9.2 Eternal Materials Epoxy Molding Compounds Business Overview
- 4.9.3 Eternal Materials Epoxy Molding Compounds Production Capacity, Value and Gross Margin (2021-2026)
- 4.9.4 Eternal Materials Product Portfolio
- 4.9.5 Eternal Materials Recent Developments
- 4.10 Jiangsu Zhongpeng New Material
- 4.10.1 Jiangsu Zhongpeng New Material Epoxy Molding Compounds Company Information
- 4.10.2 Jiangsu Zhongpeng New Material Epoxy Molding Compounds Business Overview
- 4.10.3 Jiangsu Zhongpeng New Material Epoxy Molding Compounds Production Capacity, Value and Gross Margin (2021-2026)
- 4.10.4 Jiangsu Zhongpeng New Material Product Portfolio
- 4.10.5 Jiangsu Zhongpeng New Material Recent Developments
- 4.11 Shin-Etsu Chemical
- 4.11.1 Shin-Etsu Chemical Epoxy Molding Compounds Company Information
- 4.11.2 Shin-Etsu Chemical Epoxy Molding Compounds Business Overview
- 4.11.3 Shin-Etsu Chemical Epoxy Molding Compounds Production Capacity, Value and Gross Margin (2021-2026)
- 4.11.4 Shin-Etsu Chemical Product Portfolio
- 4.11.5 Shin-Etsu Chemical Recent Developments
- 4.12 Hexion
- 4.12.1 Hexion Epoxy Molding Compounds Company Information
- 4.12.2 Hexion Epoxy Molding Compounds Business Overview
- 4.12.3 Hexion Epoxy Molding Compounds Production Capacity, Value and Gross Margin (2021-2026)
- 4.12.4 Hexion Product Portfolio
- 4.12.5 Hexion Recent Developments
- 4.13 Nepes
- 4.13.1 Nepes Epoxy Molding Compounds Company Information
- 4.13.2 Nepes Epoxy Molding Compounds Business Overview
- 4.13.3 Nepes Epoxy Molding Compounds Production Capacity, Value and Gross Margin (2021-2026)
- 4.13.4 Nepes Product Portfolio
- 4.13.5 Nepes Recent Developments
- 4.14 Tianjin Kaihua Insulating Material
- 4.14.1 Tianjin Kaihua Insulating Material Epoxy Molding Compounds Company Information
- 4.14.2 Tianjin Kaihua Insulating Material Epoxy Molding Compounds Business Overview
- 4.14.3 Tianjin Kaihua Insulating Material Epoxy Molding Compounds Production Capacity, Value and Gross Margin (2021-2026)
- 4.14.4 Tianjin Kaihua Insulating Material Product Portfolio
- 4.14.5 Tianjin Kaihua Insulating Material Recent Developments
- 4.15 HHCK
- 4.15.1 HHCK Epoxy Molding Compounds Company Information
- 4.15.2 HHCK Epoxy Molding Compounds Business Overview
- 4.15.3 HHCK Epoxy Molding Compounds Production Capacity, Value and Gross Margin (2021-2026)
- 4.15.4 HHCK Product Portfolio
- 4.15.5 HHCK Recent Developments
- 4.16 Scienchem
- 4.16.1 Scienchem Epoxy Molding Compounds Company Information
- 4.16.2 Scienchem Epoxy Molding Compounds Business Overview
- 4.16.3 Scienchem Epoxy Molding Compounds Production Capacity, Value and Gross Margin (2021-2026)
- 4.16.4 Scienchem Product Portfolio
- 4.16.5 Scienchem Recent Developments
- 4.17 Beijing Sino-tech Electronic Material
- 4.17.1 Beijing Sino-tech Electronic Material Epoxy Molding Compounds Company Information
- 4.17.2 Beijing Sino-tech Electronic Material Epoxy Molding Compounds Business Overview
- 4.17.3 Beijing Sino-tech Electronic Material Epoxy Molding Compounds Production Capacity, Value and Gross Margin (2021-2026)
- 4.17.4 Beijing Sino-tech Electronic Material Product Portfolio
- 4.17.5 Beijing Sino-tech Electronic Material Recent Developments
5 Global Epoxy Molding Compounds Production by Region
- 5.1 Global Epoxy Molding Compounds Production Estimates and Forecasts by Region: 2021 VS 2025 VS 2032
- 5.2 Global Epoxy Molding Compounds Production by Region: 2021-2032
- 5.2.1 Global Epoxy Molding Compounds Production by Region: 2021-2026
- 5.2.2 Global Epoxy Molding Compounds Production Forecast by Region (2027-2032)
- 5.3 Global Epoxy Molding Compounds Production Value Estimates and Forecasts by Region: 2021 VS 2025 VS 2032
- 5.4 Global Epoxy Molding Compounds Production Value by Region: 2021-2032
- 5.4.1 Global Epoxy Molding Compounds Production Value by Region: 2021-2026
- 5.4.2 Global Epoxy Molding Compounds Production Value Forecast by Region (2027-2032)
- 5.5 Global Epoxy Molding Compounds Market Price Analysis by Region (2021-2026)
- 5.6 Global Epoxy Molding Compounds Production and Value, YOY Growth
- 5.6.1 North America Epoxy Molding Compounds Production Value Estimates and Forecasts (2021-2032)
- 5.6.2 Europe Epoxy Molding Compounds Production Value Estimates and Forecasts (2021-2032)
- 5.6.3 China Epoxy Molding Compounds Production Value Estimates and Forecasts (2021-2032)
- 5.6.4 Japan Epoxy Molding Compounds Production Value Estimates and Forecasts (2021-2032)
6 Global Epoxy Molding Compounds Consumption by Region
- 6.1 Global Epoxy Molding Compounds Consumption Estimates and Forecasts by Region: 2021 VS 2025 VS 2032
- 6.2 Global Epoxy Molding Compounds Consumption by Region (2021-2032)
- 6.2.1 Global Epoxy Molding Compounds Consumption by Region: 2021-2026
- 6.2.2 Global Epoxy Molding Compounds Forecasted Consumption by Region (2027-2032)
- 6.3 North America
- 6.3.1 North America Epoxy Molding Compounds Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 6.3.2 North America Epoxy Molding Compounds Consumption by Country (2021-2032)
- 6.3.3 United States
- 6.3.4 Canada
- 6.3.5 Mexico
- 6.4 Europe
- 6.4.1 Europe Epoxy Molding Compounds Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 6.4.2 Europe Epoxy Molding Compounds Consumption by Country (2021-2032)
- 6.4.3 Germany
- 6.4.4 France
- 6.4.5 U.K.
- 6.4.6 Italy
- 6.4.7 Russia
- 6.4.8 Spain
- 6.4.9 Netherlands
- 6.4.10 Switzerland
- 6.4.11 Sweden
- 6.4.12 Poland
- 6.5 Asia Pacific
- 6.5.1 Asia Pacific Epoxy Molding Compounds Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 6.5.2 Asia Pacific Epoxy Molding Compounds Consumption by Country (2021-2032)
- 6.5.3 China
- 6.5.4 Japan
- 6.5.5 South Korea
- 6.5.6 India
- 6.5.7 Australia
- 6.5.8 Taiwan
- 6.5.9 Southeast Asia
- 6.6 South America, Middle East & Africa
- 6.6.1 South America, Middle East & Africa Epoxy Molding Compounds Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 6.6.2 South America, Middle East & Africa Epoxy Molding Compounds Consumption by Country (2021-2032)
- 6.6.3 Brazil
- 6.6.4 Argentina
- 6.6.5 Chile
- 6.6.6 Turkey
- 6.6.7 GCC Countries
7 Segment by Type
- 7.1 Global Epoxy Molding Compounds Production by Type (2021-2032)
- 7.1.1 Global Epoxy Molding Compounds Production by Type (2021-2032) & (Kiloton)
- 7.1.2 Global Epoxy Molding Compounds Production Market Share by Type (2021-2032)
- 7.2 Global Epoxy Molding Compounds Production Value by Type (2021-2032)
- 7.2.1 Global Epoxy Molding Compounds Production Value by Type (2021-2032) & (US$ Million)
- 7.2.2 Global Epoxy Molding Compounds Production Value Market Share by Type (2021-2032)
- 7.3 Global Epoxy Molding Compounds Price by Type (2021-2032)
8 Segment by Application
- 8.1 Global Epoxy Molding Compounds Production by Application (2021-2032)
- 8.1.1 Global Epoxy Molding Compounds Production by Application (2021-2032) & (Kiloton)
- 8.1.2 Global Epoxy Molding Compounds Production Market Share by Application (2021-2032)
- 8.2 Global Epoxy Molding Compounds Production Value by Application (2021-2032)
- 8.2.1 Global Epoxy Molding Compounds Production Value by Application (2021-2032) & (US$ Million)
- 8.2.2 Global Epoxy Molding Compounds Production Value Market Share by Application (2021-2032)
- 8.3 Global Epoxy Molding Compounds Price by Application (2021-2032)
9 Value Chain and Sales Channels Analysis of the Market
- 9.1 Epoxy Molding Compounds Value Chain Analysis
- 9.1.1 Epoxy Molding Compounds Key Raw Materials
- 9.1.2 Raw Materials Key Suppliers
- 9.1.3 Epoxy Molding Compounds Production Mode & Process
- 9.2 Epoxy Molding Compounds Sales Channels Analysis
- 9.2.1 Direct Comparison with Distribution Share
- 9.2.2 Epoxy Molding Compounds Distributors
- 9.2.3 Epoxy Molding Compounds Customers
10 Global Epoxy Molding Compounds Analyzing Market Dynamics
- 10.1 Epoxy Molding Compounds Industry Trends
- 10.2 Epoxy Molding Compounds Industry Drivers
- 10.3 Epoxy Molding Compounds Industry Opportunities and Challenges
- 10.4 Epoxy Molding Compounds Industry Restraints
11 Report Conclusion
12 Disclaimer
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