Selected research
Market Structure
Global Chip on Board (COB) Encapsulants Market by Size, by Type, by Application, by Region, History and Forecast 2021-2032
Market perspective
The global Chip on Board (COB) Encapsulants market is projected to grow from US$ million in 2026 to US$ million by 2032, implying a CAGR of % over 2026-2032.
The US & Canada market for Chip on Board (COB) Encapsulants is projected to increase from US$ million in 2026 to US$ million by 2032, at a CAGR of % over 2026-2032.
The Europe market for Chip on Board (COB) Encapsulants is projected to increase from US$ million in 2026 to US$ million by 2032, at a CAGR of % over 2026-2032.
Read the full market overview
The Asia Pacific market for Chip on Board (COB) Encapsulants is projected to increase from US$ million in 2026 to US$ million by 2032, at a CAGR of % over 2026-2032.
The China market for Chip on Board (COB) Encapsulants is projected to increase from US$ million in 2026 to US$ million by 2032, at a CAGR of % over 2026-2032.
Leading global manufacturers of Chip on Board (COB) Encapsulants include Henkel, DuPont, Suzhou Yichang Electronics, Shenzhen Pujia New Materials, Shenzhen Guanghengwei, Nagase ChemteX, Longain New Materials(Yantai), Hangzhou First and Dymax, among others. In 2025, the top three vendors together accounted for approximately % of global revenue.
On the production side, the report examines Chip on Board (COB) Encapsulants output, growth rates, and market shares by manufacturer and by region (at regional and country level) for 2021-2026, with forecasts through 2032.
On the consumption side, the report analyzes sales of Chip on Board (COB) Encapsulants by region (regional and country level), company, type, and application for 2021-2026 and provides forecasts through 2032.
The report provides an overview of the global Chip on Board (COB) Encapsulants market in terms of capacity, output, revenue, and price, analyzing global market trends using historical revenue and sales data for 2021-2025, estimates for 2026, and projected CAGRs through 2032.
The study covers key producers of Chip on Board (COB) Encapsulants and consumption patterns in major regions and countries, assesses future market potential, and highlights priority regions and countries for segmenting the market into sub-sectors, with country-specific market value data for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, the Middle East, Africa, and other countries.
The report also presents Chip on Board (COB) Encapsulants sales, revenue, market share, and industry ranking for the main manufacturers for 2021-2026, identifies the major stakeholders in the global market, and analyzes their competitive landscape and market positioning based on recent developments and segmental revenues.
In addition, the report analyzes segment data by type and application—covering sales, revenue, and price—for 2021-2032, and evaluates and forecasts the Chip on Board (COB) Encapsulants market size, projected growth trends, production technologies, key applications, and end-use industries.
Chip on Board (COB) Encapsulants Segment by Company
Henkel
DuPont
Suzhou Yichang Electronics
Shenzhen Pujia New Materials
Shenzhen Guanghengwei
Nagase ChemteX
Longain New Materials(Yantai)
Hangzhou First
Dymax
Chip on Board (COB) Encapsulants Segment by Type
Silicone Type
Expoxy Resin
Chip on Board (COB) Encapsulants Segment by Application
LED
ICs
Other
Chip on Board (COB) Encapsulants Segment by Region
North America
United States
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Spain
Netherlands
Switzerland
Sweden
Poland
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Southeast Asia
South America
Brazil
Argentina
Chile
Middle East & Africa
Egypt
South Africa
Israel
Türkiye
GCC Countries
Study Objectives
1. To analyze and research the global status and future forecast, involving, production, value, consumption, growth rate (CAGR), market share, historical and forecast.
2. To present the key manufacturers, capacity, production, revenue, market share, and Recent Developments.
3. To split the breakdown data by regions, type, manufacturers, and Application.
4. To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints, and risks.
5. To identify significant trends, drivers, influence factors in global and regions.
6. To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
Reasons to Buy This Report
1. This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global Chip on Board (COB) Encapsulants market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.
2. This report will help stakeholders to understand the global industry status and trends of Chip on Board (COB) Encapsulants and provides them with information on key market drivers, restraints, challenges, and opportunities.
3. This report will help stakeholders to understand competitors better and gain more insights to strengthen their position in their businesses. The competitive landscape section includes the market share and rank (in volume and value), competitor ecosystem, new product development, expansion, and acquisition.
4. This report stays updated with novel technology integration, features, and the latest developments in the market.
5. This report helps stakeholders to gain insights into which regions to target globally.
6. This report helps stakeholders to gain insights into the end-user perception concerning the adoption of Chip on Board (COB) Encapsulants.
7. This report helps stakeholders to identify some of the key players in the market and understand their valuable contribution.
Chapter Outline
Chapter 1: Provides an overview of the Chip on Board (COB) Encapsulants market, including product definition, global market growth prospects, production value, capacity, and average price forecasts (2021-2032).
Chapter 2: Analysis key trends, drivers, challenges, and opportunities within the global Chip on Board (COB) Encapsulants industry.
Chapter 3: Detailed analysis of Chip on Board (COB) Encapsulants market competition landscape. Including Chip on Board (COB) Encapsulants manufacturers' output value, output and average price from 2021 to 2026, as well as competition analysis indicators such as origin, product type, application, merger and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 7: Production/Production Value of Chip on Board (COB) Encapsulants by region. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 8: Consumption of Chip on Board (COB) Encapsulants in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 9: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 10: Concluding Insights of the report.
More report detail
Tables and figures
Scope & coverage.
Types
- Silicone Type
- Expoxy Resin
Applications
- LED
- ICs
- Other
Companies covered
- Henkel
- DuPont
- Suzhou Yichang Electronics
- Shenzhen Pujia New Materials
- Shenzhen Guanghengwei
- Nagase ChemteX
- Longain New Materials(Yantai)
- Hangzhou First
- Dymax
Inside the report.
1 Market Overview
- 1.1 Product Definition
- 1.2 Global Market Growth Prospects
- 1.2.1 Global Chip on Board (COB) Encapsulants Production Value Estimates and Forecasts (2021-2032)
- 1.2.2 Global Chip on Board (COB) Encapsulants Production Capacity Estimates and Forecasts (2021-2032)
- 1.2.3 Global Chip on Board (COB) Encapsulants Production Estimates and Forecasts (2021-2032)
- 1.2.4 Global Chip on Board (COB) Encapsulants Market Average Price (2021-2032)
- 1.3 Assumptions and Limitations
- 1.4 Study Goals and Objectives
2 Global Chip on Board (COB) Encapsulants Market Dynamics
- 2.1 Chip on Board (COB) Encapsulants Industry Trends
- 2.2 Chip on Board (COB) Encapsulants Industry Drivers
- 2.3 Chip on Board (COB) Encapsulants Industry Opportunities and Challenges
- 2.4 Chip on Board (COB) Encapsulants Industry Restraints
3 Chip on Board (COB) Encapsulants Market by Manufacturers
- 3.1 Global Chip on Board (COB) Encapsulants Production Value by Manufacturers (2021-2026)
- 3.2 Global Chip on Board (COB) Encapsulants Production by Manufacturers (2021-2026)
- 3.3 Global Chip on Board (COB) Encapsulants Average Price by Manufacturers (2021-2026)
- 3.4 Global Chip on Board (COB) Encapsulants Industry Manufacturers Ranking, 2024 VS 2025 VS 2026
- 3.5 Global Chip on Board (COB) Encapsulants Key Manufacturers Manufacturing Sites & Headquarters
- 3.6 Global Chip on Board (COB) Encapsulants Manufacturers, Product Type & Application
- 3.7 Global Chip on Board (COB) Encapsulants Manufacturers Established Date
- 3.8 Market Competitive Analysis
- 3.8.1 Global Chip on Board (COB) Encapsulants Market CR5 and HHI
- 3.8.2 Global Top 5 and 10 Chip on Board (COB) Encapsulants Players Market Share by Production Value in 2025
- 3.8.3 2025 Chip on Board (COB) Encapsulants Tier 1, Tier 2, and Tier 3
4 Chip on Board (COB) Encapsulants Market by Type
- 4.1 Chip on Board (COB) Encapsulants Type Introduction
- 4.1.1 Silicone Type
- 4.1.2 Expoxy Resin
- 4.2 Global Chip on Board (COB) Encapsulants Production by Type
- 4.2.1 Global Chip on Board (COB) Encapsulants Production by Type (2021 VS 2025 VS 2032)
- 4.2.2 Global Chip on Board (COB) Encapsulants Production by Type (2021-2032)
- 4.2.3 Global Chip on Board (COB) Encapsulants Production Market Share by Type (2021-2032)
- 4.3 Global Chip on Board (COB) Encapsulants Production Value by Type
- 4.3.1 Global Chip on Board (COB) Encapsulants Production Value by Type (2021 VS 2025 VS 2032)
- 4.3.2 Global Chip on Board (COB) Encapsulants Production Value by Type (2021-2032)
- 4.3.3 Global Chip on Board (COB) Encapsulants Production Value Market Share by Type (2021-2032)
5 Chip on Board (COB) Encapsulants Market by Application
- 5.1 Chip on Board (COB) Encapsulants Application Introduction
- 5.1.1 LED
- 5.1.2 ICs
- 5.1.3 Other
- 5.2 Global Chip on Board (COB) Encapsulants Production by Application
- 5.2.1 Global Chip on Board (COB) Encapsulants Production by Application (2021 VS 2025 VS 2032)
- 5.2.2 Global Chip on Board (COB) Encapsulants Production by Application (2021-2032)
- 5.2.3 Global Chip on Board (COB) Encapsulants Production Market Share by Application (2021-2032)
- 5.3 Global Chip on Board (COB) Encapsulants Production Value by Application
- 5.3.1 Global Chip on Board (COB) Encapsulants Production Value by Application (2021 VS 2025 VS 2032)
- 5.3.2 Global Chip on Board (COB) Encapsulants Production Value by Application (2021-2032)
- 5.3.3 Global Chip on Board (COB) Encapsulants Production Value Market Share by Application (2021-2032)
6 Company Profiles
- 6.1 Henkel
- 6.1.1 Henkel Company Information
- 6.1.2 Henkel Business Overview
- 6.1.3 Henkel Chip on Board (COB) Encapsulants Production, Value and Gross Margin (2021-2026)
- 6.1.4 Henkel Chip on Board (COB) Encapsulants Product Portfolio
- 6.1.5 Henkel Recent Developments
- 6.2 DuPont
- 6.2.1 DuPont Company Information
- 6.2.2 DuPont Business Overview
- 6.2.3 DuPont Chip on Board (COB) Encapsulants Production, Value and Gross Margin (2021-2026)
- 6.2.4 DuPont Chip on Board (COB) Encapsulants Product Portfolio
- 6.2.5 DuPont Recent Developments
- 6.3 Suzhou Yichang Electronics
- 6.3.1 Suzhou Yichang Electronics Company Information
- 6.3.2 Suzhou Yichang Electronics Business Overview
- 6.3.3 Suzhou Yichang Electronics Chip on Board (COB) Encapsulants Production, Value and Gross Margin (2021-2026)
- 6.3.4 Suzhou Yichang Electronics Chip on Board (COB) Encapsulants Product Portfolio
- 6.3.5 Suzhou Yichang Electronics Recent Developments
- 6.4 Shenzhen Pujia New Materials
- 6.4.1 Shenzhen Pujia New Materials Company Information
- 6.4.2 Shenzhen Pujia New Materials Business Overview
- 6.4.3 Shenzhen Pujia New Materials Chip on Board (COB) Encapsulants Production, Value and Gross Margin (2021-2026)
- 6.4.4 Shenzhen Pujia New Materials Chip on Board (COB) Encapsulants Product Portfolio
- 6.4.5 Shenzhen Pujia New Materials Recent Developments
- 6.5 Shenzhen Guanghengwei
- 6.5.1 Shenzhen Guanghengwei Company Information
- 6.5.2 Shenzhen Guanghengwei Business Overview
- 6.5.3 Shenzhen Guanghengwei Chip on Board (COB) Encapsulants Production, Value and Gross Margin (2021-2026)
- 6.5.4 Shenzhen Guanghengwei Chip on Board (COB) Encapsulants Product Portfolio
- 6.5.5 Shenzhen Guanghengwei Recent Developments
- 6.6 Nagase ChemteX
- 6.6.1 Nagase ChemteX Company Information
- 6.6.2 Nagase ChemteX Business Overview
- 6.6.3 Nagase ChemteX Chip on Board (COB) Encapsulants Production, Value and Gross Margin (2021-2026)
- 6.6.4 Nagase ChemteX Chip on Board (COB) Encapsulants Product Portfolio
- 6.6.5 Nagase ChemteX Recent Developments
- 6.7 Longain New Materials(Yantai)
- 6.7.1 Longain New Materials(Yantai) Company Information
- 6.7.2 Longain New Materials(Yantai) Business Overview
- 6.7.3 Longain New Materials(Yantai) Chip on Board (COB) Encapsulants Production, Value and Gross Margin (2021-2026)
- 6.7.4 Longain New Materials(Yantai) Chip on Board (COB) Encapsulants Product Portfolio
- 6.7.5 Longain New Materials(Yantai) Recent Developments
- 6.8 Hangzhou First
- 6.8.1 Hangzhou First Company Information
- 6.8.2 Hangzhou First Business Overview
- 6.8.3 Hangzhou First Chip on Board (COB) Encapsulants Production, Value and Gross Margin (2021-2026)
- 6.8.4 Hangzhou First Chip on Board (COB) Encapsulants Product Portfolio
- 6.8.5 Hangzhou First Recent Developments
- 6.9 Dymax
- 6.9.1 Dymax Company Information
- 6.9.2 Dymax Business Overview
- 6.9.3 Dymax Chip on Board (COB) Encapsulants Production, Value and Gross Margin (2021-2026)
- 6.9.4 Dymax Chip on Board (COB) Encapsulants Product Portfolio
- 6.9.5 Dymax Recent Developments
7 Global Chip on Board (COB) Encapsulants Production by Region
- 7.1 Global Chip on Board (COB) Encapsulants Production by Region: 2021 VS 2025 VS 2032
- 7.2 Global Chip on Board (COB) Encapsulants Production by Region (2021-2032)
- 7.2.1 Global Chip on Board (COB) Encapsulants Production by Region (2021-2026)
- 7.2.2 Global Chip on Board (COB) Encapsulants Production Forecast by Region (2027-2032)
- 7.3 Global Chip on Board (COB) Encapsulants Production by Region: 2021 VS 2025 VS 2032
- 7.4 Global Chip on Board (COB) Encapsulants Production Value by Region (2021-2032)
- 7.4.1 Global Chip on Board (COB) Encapsulants Production Value by Region (2021-2026)
- 7.4.2 Global Chip on Board (COB) Encapsulants Production Value by Region (2027-2032)
- 7.5 Global Chip on Board (COB) Encapsulants Market Price Analysis by Region (2021-2032)
- 7.6 Regional Production Value Trends (2021-2032)
- 7.6.1 North America Chip on Board (COB) Encapsulants Production Value (2021-2032)
- 7.6.2 Europe Chip on Board (COB) Encapsulants Production Value (2021-2032)
- 7.6.3 Asia-Pacific Chip on Board (COB) Encapsulants Production Value (2021-2032)
- 7.6.4 South America Chip on Board (COB) Encapsulants Production Value (2021-2032)
- 7.6.5 Middle East & Africa Chip on Board (COB) Encapsulants Production Value (2021-2032)
8 Global Chip on Board (COB) Encapsulants Consumption by Region
- 8.1 Global Chip on Board (COB) Encapsulants Consumption by Region: 2021 VS 2025 VS 2032
- 8.2 Global Chip on Board (COB) Encapsulants Consumption by Region (2021-2032)
- 8.2.1 Global Chip on Board (COB) Encapsulants Consumption by Region (2021-2026)
- 8.2.2 Global Chip on Board (COB) Encapsulants Consumption by Region (2027-2032)
- 8.3 North America
- 8.3.1 North America Chip on Board (COB) Encapsulants Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 8.3.2 North America Chip on Board (COB) Encapsulants Consumption by Country (2021-2032)
- 8.3.3 U.S.
- 8.3.4 Canada
- 8.3.5 Mexico
- 8.4 Europe
- 8.4.1 Europe Chip on Board (COB) Encapsulants Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 8.4.2 Europe Chip on Board (COB) Encapsulants Consumption by Country (2021-2032)
- 8.4.3 Germany
- 8.4.4 France
- 8.4.5 U.K.
- 8.4.6 Italy
- 8.4.7 Netherlands
- 8.5 Asia Pacific
- 8.5.1 Asia Pacific Chip on Board (COB) Encapsulants Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 8.5.2 Asia Pacific Chip on Board (COB) Encapsulants Consumption by Country (2021-2032)
- 8.5.3 China
- 8.5.4 Japan
- 8.5.5 South Korea
- 8.5.6 Southeast Asia
- 8.5.7 India
- 8.5.8 Australia
- 8.6 South America
- 8.6.1 South America Chip on Board (COB) Encapsulants Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 8.6.2 South America Chip on Board (COB) Encapsulants Consumption by Country (2021-2032)
- 8.6.3 Brazil
- 8.6.4 Argentina
- 8.6.5 Chile
- 8.6.6 Colombia
- 8.7 Middle East & Africa
- 8.7.1 Middle East & Africa Chip on Board (COB) Encapsulants Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 8.7.2 Middle East & Africa Chip on Board (COB) Encapsulants Consumption by Country (2021-2032)
- 8.7.3 Egypt
- 8.7.4 South Africa
- 8.7.5 Israel
- 8.7.6 Türkiye
- 8.7.7 GCC Countries
9 Value Chain and Sales Channels Analysis
- 9.1 Chip on Board (COB) Encapsulants Value Chain Analysis
- 9.1.1 Chip on Board (COB) Encapsulants Key Raw Materials
- 9.1.2 Raw Materials Key Suppliers
- 9.1.3 Manufacturing Cost Structure
- 9.1.4 Chip on Board (COB) Encapsulants Production Mode & Process
- 9.2 Chip on Board (COB) Encapsulants Sales Channels Analysis
- 9.2.1 Direct Comparison with Distribution Share
- 9.2.2 Chip on Board (COB) Encapsulants Distributors
- 9.2.3 Chip on Board (COB) Encapsulants Customers
10 Concluding Insights
11 Appendix
- 11.1 Reasons for Doing This Study
- 11.2 Research Methodology
- 11.3 Research Process
- 11.4 Authors List of This Report
- 11.5 Data Source
- 11.5.1 Secondary Sources
- 11.5.2 Primary Sources
- 11.6 Disclaimer
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