Selected research
Market Analysis & Forecast
Global NOR Flash Chip Tape-Out Service Market Analysis and Forecast 2026-2032
Market perspective
The global NOR Flash Chip Tape-Out Service market is projected to grow from US$ million in 2026 to US$ million by 2032, at a Compound Annual Growth Rate (CAGR) of % during the forecast period.
The North America market for NOR Flash Chip Tape-Out Service is estimated to increase from $ million in 2026 to reach $ million by 2032, at a CAGR of % during the forecast period of 2026 through 2032.
Europe market for NOR Flash Chip Tape-Out Service is estimated to increase from $ million in 2026 to reach $ million by 2032, at a CAGR of % during the forecast period of 2026 through 2032.
Read the full market overview
Asia-Pacific market for NOR Flash Chip Tape-Out Service is estimated to increase from $ million in 2026 to reach $ million by 2032, at a CAGR of % during the forecast period of 2026 through 2032.
The China market for NOR Flash Chip Tape-Out Service is estimated to increase from $ million in 2026 to reach $ million by 2032, at a CAGR of % during the forecast period of 2026 through 2032.
The major global companies of NOR Flash Chip Tape-Out Service include Winbond Electronics, TSMC, UMC, Samsung, SK hynix, Intel, Semiconductor Manufacturing International Corporation, China Resources Microelectronics and He Jian Technology, etc. In 2025, the world's top three vendors accounted for approximately % of the revenue.
Report Includes
This report presents an overview of global market for NOR Flash Chip Tape-Out Service, market size. Analyses of the global market trends, with historic market revenue data for 2021 - 2025, estimates for 2026, and projections of CAGR through 2032.
This report researches the key producers of NOR Flash Chip Tape-Out Service, also provides the revenue of main regions and countries. Of the upcoming market potential for NOR Flash Chip Tape-Out Service, and key regions or countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the NOR Flash Chip Tape-Out Service revenue, market share and industry ranking of main manufacturers, data from 2021 to 2026. Identification of the major stakeholders in the global NOR Flash Chip Tape-Out Service market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by Type and by Application, revenue, and growth rate, from 2021 to 2032. Evaluation and forecast the market size for NOR Flash Chip Tape-Out Service revenue, projected growth trends, production technology, application and end-user industry.
NOR Flash Chip Tape-Out Service Segment by Company
Winbond Electronics
TSMC
UMC
Samsung
SK hynix
Intel
Semiconductor Manufacturing International Corporation
China Resources Microelectronics
He Jian Technology
Shanghai Huahong
Shanghai Huali
Wuhan Xinxin
Micron Technology
Spansion
Macronix
NOR Flash Chip Tape-Out Service Segment by Type
Vertical Integration Model
Vertical Division Model
NOR Flash Chip Tape-Out Service Segment by Application
Smart Wearable Device
Consumer Electronics
Internet Equipment
Others
NOR Flash Chip Tape-Out Service Segment by Region
North America
United States
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Spain
Netherlands
Switzerland
Sweden
Poland
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Southeast Asia
South America
Brazil
Argentina
Chile
Colombia
Middle East & Africa
Egypt
South Africa
Israel
Türkiye
GCC Countries
Study Objectives
1. To analyze and research the global status and future forecast, involving growth rate (CAGR), market share, historical and forecast.
2. To present the key players, revenue, market share, and Recent Developments.
3. To split the breakdown data by regions, type, manufacturers, and Application.
4. To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints, and risks.
5. To identify significant trends, drivers, influence factors in global and regions.
6. To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
Reasons to Buy This Report
1. This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global NOR Flash Chip Tape-Out Service market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.
2. This report will help stakeholders to understand the global industry status and trends of NOR Flash Chip Tape-Out Service and provides them with information on key market drivers, restraints, challenges, and opportunities.
3. This report will help stakeholders to understand competitors better and gain more insights to strengthen their position in their businesses. The competitive landscape section includes the market share and rank (in market size), competitor ecosystem, new product development, expansion, and acquisition.
4. This report stays updated with novel technology integration, features, and the latest developments in the market.
5. This report helps stakeholders to gain insights into which regions to target globally.
6. This report helps stakeholders to gain insights into the end-user perception concerning the adoption of NOR Flash Chip Tape-Out Service.
7. This report helps stakeholders to identify some of the key players in the market and understand their valuable contribution.
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Revenue of NOR Flash Chip Tape-Out Service in global and regional level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 4: Detailed analysis of NOR Flash Chip Tape-Out Service company competitive landscape, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 5: Provides the analysis of various market segments by type, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key companies, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, NOR Flash Chip Tape-Out Service revenue, gross margin, and recent development, etc.
Chapter 8: North America by type, by application and by country, revenue for each segment.
Chapter 9: Europe by type, by application and by country, revenue for each segment.
Chapter 10: China type, by application, revenue for each segment.
Chapter 11: Asia (excluding China) type, by application and by region, revenue for each segment.
Chapter 12: South America, Middle East and Africa by type, by application and by country, revenue for each segment.
Chapter 13: The main concluding insights of the report.
More report detail
Tables and figures
Scope & coverage.
Types
- Vertical Integration Model
- Vertical Division Model
Applications
- Smart Wearable Device
- Consumer Electronics
- Internet Equipment
- Others
Companies covered
- Winbond Electronics
- TSMC
- UMC
- Samsung
- SK hynix
- Intel
- Semiconductor Manufacturing International Corporation
- China Resources Microelectronics
- He Jian Technology
- Shanghai Huahong
- Shanghai Huali
- Wuhan Xinxin
- Micron Technology
- Spansion
- Macronix
Inside the report.
1 Market Overview
- 1.1 Product Definition
- 1.2 NOR Flash Chip Tape-Out Service Market by Type
- 1.2.1 Global NOR Flash Chip Tape-Out Service Market Size by Type, 2021 VS 2025 VS 2032
- 1.2.2 Vertical Integration Model
- 1.2.3 Vertical Division Model
- 1.3 NOR Flash Chip Tape-Out Service Market by Application
- 1.3.1 Global NOR Flash Chip Tape-Out Service Market Size by Application, 2021 VS 2025 VS 2032
- 1.3.2 Smart Wearable Device
- 1.3.3 Consumer Electronics
- 1.3.4 Internet Equipment
- 1.3.5 Others
- 1.4 Assumptions and Limitations
- 1.5 Study Goals and Objectives
2 NOR Flash Chip Tape-Out Service Market Dynamics
- 2.1 NOR Flash Chip Tape-Out Service Industry Trends
- 2.2 NOR Flash Chip Tape-Out Service Industry Drivers
- 2.3 NOR Flash Chip Tape-Out Service Industry Opportunities and Challenges
- 2.4 NOR Flash Chip Tape-Out Service Industry Restraints
3 Global Growth Perspective
- 3.1 Global NOR Flash Chip Tape-Out Service Market Perspective (2021-2032)
- 3.2 Global NOR Flash Chip Tape-Out Service Growth Trends by Region
- 3.2.1 Global NOR Flash Chip Tape-Out Service Market Size by Region: 2021 VS 2025 VS 2032
- 3.2.2 Global NOR Flash Chip Tape-Out Service Market Size by Region (2021-2026)
- 3.2.3 Global NOR Flash Chip Tape-Out Service Market Size by Region (2027-2032)
4 Competitive Landscape by Players
- 4.1 Global NOR Flash Chip Tape-Out Service Revenue by Players
- 4.1.1 Global NOR Flash Chip Tape-Out Service Revenue by Players (2021-2026)
- 4.1.2 Global NOR Flash Chip Tape-Out Service Revenue Market Share by Players (2021-2026)
- 4.1.3 Global NOR Flash Chip Tape-Out Service Players Revenue Share Top 10 and Top 5 in 2025
- 4.2 Global NOR Flash Chip Tape-Out Service Key Players Ranking, 2024 VS 2025 VS 2026
- 4.3 Global NOR Flash Chip Tape-Out Service Key Players Headquarters & Area Served
- 4.4 Global NOR Flash Chip Tape-Out Service Players, Product Type & Application
- 4.5 Global NOR Flash Chip Tape-Out Service Players Establishment Date
- 4.6 Market Competitive Analysis
- 4.6.1 Global NOR Flash Chip Tape-Out Service Market CR5 and HHI
- 4.6.3 2025 NOR Flash Chip Tape-Out Service Tier 1, Tier 2, and Tier 3
5 NOR Flash Chip Tape-Out Service Market Size by Type
- 5.1 Global NOR Flash Chip Tape-Out Service Revenue by Type (2021 VS 2025 VS 2032)
- 5.2 Global NOR Flash Chip Tape-Out Service Revenue by Type (2021-2032)
- 5.3 Global NOR Flash Chip Tape-Out Service Revenue Market Share by Type (2021-2032)
6 NOR Flash Chip Tape-Out Service Market Size by Application
- 6.1 Global NOR Flash Chip Tape-Out Service Revenue by Application (2021 VS 2025 VS 2032)
- 6.2 Global NOR Flash Chip Tape-Out Service Revenue by Application (2021-2032)
- 6.3 Global NOR Flash Chip Tape-Out Service Revenue Market Share by Application (2021-2032)
7 Company Profiles
- 7.1 Winbond Electronics
- 7.1.1 Winbond Electronics Company Information
- 7.1.2 Winbond Electronics Business Overview
- 7.1.3 Winbond Electronics NOR Flash Chip Tape-Out Service Revenue and Gross Margin (2021-2026)
- 7.1.4 Winbond Electronics NOR Flash Chip Tape-Out Service Product Portfolio
- 7.1.5 Winbond Electronics Recent Developments
- 7.2 TSMC
- 7.2.1 TSMC Company Information
- 7.2.2 TSMC Business Overview
- 7.2.3 TSMC NOR Flash Chip Tape-Out Service Revenue and Gross Margin (2021-2026)
- 7.2.4 TSMC NOR Flash Chip Tape-Out Service Product Portfolio
- 7.2.5 TSMC Recent Developments
- 7.3 UMC
- 7.3.1 UMC Company Information
- 7.3.2 UMC Business Overview
- 7.3.3 UMC NOR Flash Chip Tape-Out Service Revenue and Gross Margin (2021-2026)
- 7.3.4 UMC NOR Flash Chip Tape-Out Service Product Portfolio
- 7.3.5 UMC Recent Developments
- 7.4 Samsung
- 7.4.1 Samsung Company Information
- 7.4.2 Samsung Business Overview
- 7.4.3 Samsung NOR Flash Chip Tape-Out Service Revenue and Gross Margin (2021-2026)
- 7.4.4 Samsung NOR Flash Chip Tape-Out Service Product Portfolio
- 7.4.5 Samsung Recent Developments
- 7.5 SK hynix
- 7.5.1 SK hynix Company Information
- 7.5.2 SK hynix Business Overview
- 7.5.3 SK hynix NOR Flash Chip Tape-Out Service Revenue and Gross Margin (2021-2026)
- 7.5.4 SK hynix NOR Flash Chip Tape-Out Service Product Portfolio
- 7.5.5 SK hynix Recent Developments
- 7.6 Intel
- 7.6.1 Intel Company Information
- 7.6.2 Intel Business Overview
- 7.6.3 Intel NOR Flash Chip Tape-Out Service Revenue and Gross Margin (2021-2026)
- 7.6.4 Intel NOR Flash Chip Tape-Out Service Product Portfolio
- 7.6.5 Intel Recent Developments
- 7.7 Semiconductor Manufacturing International Corporation
- 7.7.1 Semiconductor Manufacturing International Corporation Company Information
- 7.7.2 Semiconductor Manufacturing International Corporation Business Overview
- 7.7.3 Semiconductor Manufacturing International Corporation NOR Flash Chip Tape-Out Service Revenue and Gross Margin (2021-2026)
- 7.7.4 Semiconductor Manufacturing International Corporation NOR Flash Chip Tape-Out Service Product Portfolio
- 7.7.5 Semiconductor Manufacturing International Corporation Recent Developments
- 7.8 China Resources Microelectronics
- 7.8.1 China Resources Microelectronics Company Information
- 7.8.2 China Resources Microelectronics Business Overview
- 7.8.3 China Resources Microelectronics NOR Flash Chip Tape-Out Service Revenue and Gross Margin (2021-2026)
- 7.8.4 China Resources Microelectronics NOR Flash Chip Tape-Out Service Product Portfolio
- 7.8.5 China Resources Microelectronics Recent Developments
- 7.9 He Jian Technology
- 7.9.1 He Jian Technology Company Information
- 7.9.2 He Jian Technology Business Overview
- 7.9.3 He Jian Technology NOR Flash Chip Tape-Out Service Revenue and Gross Margin (2021-2026)
- 7.9.4 He Jian Technology NOR Flash Chip Tape-Out Service Product Portfolio
- 7.9.5 He Jian Technology Recent Developments
- 7.10 Shanghai Huahong
- 7.10.1 Shanghai Huahong Company Information
- 7.10.2 Shanghai Huahong Business Overview
- 7.10.3 Shanghai Huahong NOR Flash Chip Tape-Out Service Revenue and Gross Margin (2021-2026)
- 7.10.4 Shanghai Huahong NOR Flash Chip Tape-Out Service Product Portfolio
- 7.10.5 Shanghai Huahong Recent Developments
- 7.11 Shanghai Huali
- 7.11.1 Shanghai Huali Company Information
- 7.11.2 Shanghai Huali Business Overview
- 7.11.3 Shanghai Huali NOR Flash Chip Tape-Out Service Revenue and Gross Margin (2021-2026)
- 7.11.4 Shanghai Huali NOR Flash Chip Tape-Out Service Product Portfolio
- 7.11.5 Shanghai Huali Recent Developments
- 7.12 Wuhan Xinxin
- 7.12.1 Wuhan Xinxin Company Information
- 7.12.2 Wuhan Xinxin Business Overview
- 7.12.3 Wuhan Xinxin NOR Flash Chip Tape-Out Service Revenue and Gross Margin (2021-2026)
- 7.12.4 Wuhan Xinxin NOR Flash Chip Tape-Out Service Product Portfolio
- 7.12.5 Wuhan Xinxin Recent Developments
- 7.13 Micron Technology
- 7.13.1 Micron Technology Company Information
- 7.13.2 Micron Technology Business Overview
- 7.13.3 Micron Technology NOR Flash Chip Tape-Out Service Revenue and Gross Margin (2021-2026)
- 7.13.4 Micron Technology NOR Flash Chip Tape-Out Service Product Portfolio
- 7.13.5 Micron Technology Recent Developments
- 7.14 Spansion
- 7.14.1 Spansion Company Information
- 7.14.2 Spansion Business Overview
- 7.14.3 Spansion NOR Flash Chip Tape-Out Service Revenue and Gross Margin (2021-2026)
- 7.14.4 Spansion NOR Flash Chip Tape-Out Service Product Portfolio
- 7.14.5 Spansion Recent Developments
- 7.15 Macronix
- 7.15.1 Macronix Company Information
- 7.15.2 Macronix Business Overview
- 7.15.3 Macronix NOR Flash Chip Tape-Out Service Revenue and Gross Margin (2021-2026)
- 7.15.4 Macronix NOR Flash Chip Tape-Out Service Product Portfolio
- 7.15.5 Macronix Recent Developments
8 North America
- 8.1 North America NOR Flash Chip Tape-Out Service Revenue (2021-2032)
- 8.2 North America NOR Flash Chip Tape-Out Service Revenue by Type (2021-2032)
- 8.2.1 North America NOR Flash Chip Tape-Out Service Revenue by Type (2021-2026)
- 8.2.2 North America NOR Flash Chip Tape-Out Service Revenue by Type (2027-2032)
- 8.3 North America NOR Flash Chip Tape-Out Service Revenue Share by Type (2021-2032)
- 8.4 North America NOR Flash Chip Tape-Out Service Revenue by Application (2021-2032)
- 8.4.1 North America NOR Flash Chip Tape-Out Service Revenue by Application (2021-2026)
- 8.4.2 North America NOR Flash Chip Tape-Out Service Revenue by Application (2027-2032)
- 8.5 North America NOR Flash Chip Tape-Out Service Revenue Share by Application (2021-2032)
- 8.6 North America NOR Flash Chip Tape-Out Service Revenue by Country
- 8.6.1 North America NOR Flash Chip Tape-Out Service Revenue by Country (2021 VS 2025 VS 2032)
- 8.6.2 North America NOR Flash Chip Tape-Out Service Revenue by Country (2021-2026)
- 8.6.3 North America NOR Flash Chip Tape-Out Service Revenue by Country (2027-2032)
- 8.6.4 United States
- 8.6.5 Canada
- 8.6.6 Mexico
9 Europe
- 9.1 Europe NOR Flash Chip Tape-Out Service Revenue (2021-2032)
- 9.2 Europe NOR Flash Chip Tape-Out Service Revenue by Type (2021-2032)
- 9.2.1 Europe NOR Flash Chip Tape-Out Service Revenue by Type (2021-2026)
- 9.2.2 Europe NOR Flash Chip Tape-Out Service Revenue by Type (2027-2032)
- 9.3 Europe NOR Flash Chip Tape-Out Service Revenue Share by Type (2021-2032)
- 9.4 Europe NOR Flash Chip Tape-Out Service Revenue by Application (2021-2032)
- 9.4.1 Europe NOR Flash Chip Tape-Out Service Revenue by Application (2021-2026)
- 9.4.2 Europe NOR Flash Chip Tape-Out Service Revenue by Application (2027-2032)
- 9.5 Europe NOR Flash Chip Tape-Out Service Revenue Share by Application (2021-2032)
- 9.6 Europe NOR Flash Chip Tape-Out Service Revenue by Country
- 9.6.1 Europe NOR Flash Chip Tape-Out Service Revenue by Country (2021 VS 2025 VS 2032)
- 9.6.2 Europe NOR Flash Chip Tape-Out Service Revenue by Country (2021-2026)
- 9.6.3 Europe NOR Flash Chip Tape-Out Service Revenue by Country (2027-2032)
- 9.6.4 Germany
- 9.6.5 France
- 9.6.6 U.K.
- 9.6.7 Italy
- 9.6.8 Russia
- 9.6.9 Spain
- 9.6.10 Netherlands
- 9.6.11 Switzerland
- 9.6.12 Sweden
- 9.6.13 Poland
10 China
- 10.1 China NOR Flash Chip Tape-Out Service Revenue (2021-2032)
- 10.2 China NOR Flash Chip Tape-Out Service Revenue by Type (2021-2032)
- 10.2.1 China NOR Flash Chip Tape-Out Service Revenue by Type (2021-2026)
- 10.2.2 China NOR Flash Chip Tape-Out Service Revenue by Type (2027-2032)
- 10.3 China NOR Flash Chip Tape-Out Service Revenue Share by Type (2021-2032)
- 10.4 China NOR Flash Chip Tape-Out Service Revenue by Application (2021-2032)
- 10.4.1 China NOR Flash Chip Tape-Out Service Revenue by Application (2021-2026)
- 10.4.2 China NOR Flash Chip Tape-Out Service Revenue by Application (2027-2032)
- 10.5 China NOR Flash Chip Tape-Out Service Revenue Share by Application (2021-2032)
11 Asia (Excluding China)
- 11.1 Asia NOR Flash Chip Tape-Out Service Revenue (2021-2032)
- 11.2 Asia NOR Flash Chip Tape-Out Service Revenue by Type (2021-2032)
- 11.2.1 Asia NOR Flash Chip Tape-Out Service Revenue by Type (2021-2026)
- 11.2.2 Asia NOR Flash Chip Tape-Out Service Revenue by Type (2027-2032)
- 11.3 Asia NOR Flash Chip Tape-Out Service Revenue Share by Type (2021-2032)
- 11.4 Asia NOR Flash Chip Tape-Out Service Revenue by Application (2021-2032)
- 11.4.1 Asia NOR Flash Chip Tape-Out Service Revenue by Application (2021-2026)
- 11.4.2 Asia NOR Flash Chip Tape-Out Service Revenue by Application (2027-2032)
- 11.5 Asia NOR Flash Chip Tape-Out Service Revenue Share by Application (2021-2032)
- 11.6 Asia NOR Flash Chip Tape-Out Service Revenue by Country
- 11.6.1 Asia NOR Flash Chip Tape-Out Service Revenue by Country (2021 VS 2025 VS 2032)
- 11.6.2 Asia NOR Flash Chip Tape-Out Service Revenue by Country (2021-2026)
- 11.6.3 Asia NOR Flash Chip Tape-Out Service Revenue by Country (2027-2032)
- 11.6.4 Japan
- 11.6.5 South Korea
- 11.6.6 India
- 11.6.7 Australia
- 11.6.8 Taiwan
- 11.6.9 Southeast Asia
12 South America, Middle East and Africa
- 12.1 SAMEA NOR Flash Chip Tape-Out Service Revenue (2021-2032)
- 12.2 SAMEA NOR Flash Chip Tape-Out Service Revenue by Type (2021-2032)
- 12.2.1 SAMEA NOR Flash Chip Tape-Out Service Revenue by Type (2021-2026)
- 12.2.2 SAMEA NOR Flash Chip Tape-Out Service Revenue by Type (2027-2032)
- 12.3 SAMEA NOR Flash Chip Tape-Out Service Revenue Share by Type (2021-2032)
- 12.4 SAMEA NOR Flash Chip Tape-Out Service Revenue by Application (2021-2032)
- 12.4.1 SAMEA NOR Flash Chip Tape-Out Service Revenue by Application (2021-2026)
- 12.4.2 SAMEA NOR Flash Chip Tape-Out Service Revenue by Application (2027-2032)
- 12.5 SAMEA NOR Flash Chip Tape-Out Service Revenue Share by Application (2021-2032)
- 12.6 SAMEA NOR Flash Chip Tape-Out Service Revenue by Country
- 12.6.1 SAMEA NOR Flash Chip Tape-Out Service Revenue by Country (2021 VS 2025 VS 2032)
- 12.6.2 SAMEA NOR Flash Chip Tape-Out Service Revenue by Country (2021-2026)
- 12.6.3 SAMEA NOR Flash Chip Tape-Out Service Revenue by Country (2027-2032)
- 12.6.4 Brazil
- 12.6.5 Argentina
- 12.6.6 Chile
- 12.6.7 Colombia
- 12.6.8 Peru
- 12.6.9 Saudi Arabia
- 12.6.10 Israel
- 12.6.11 UAE
- 12.6.12 Turkey
- 12.6.13 Iran
- 12.6.14 Egypt
13 Concluding Insights
14 Appendix
- 14.1 Reasons for Doing This Study
- 14.2 Research Methodology
- 14.3 Research Process
- 14.4 Authors List of This Report
- 14.5 Data Source
- 14.5.1 Secondary Sources
- 14.5.2 Primary Sources
GET THE RESEARCH
Choose your license.
Choose who needs access.
All options are for this report and research series.
PDF by email within 3–5 working days after payment confirmation.
Talk to an analyst