APO RESEARCH · REPORT
IC Advanced Packaging Equipment
The semiconductor chip is not an island, it needs to form a more complex system through interconnected input and output (I/O) systems and peripheral systems or circuits. Since the IC chip and its internal circuits are very fragile, they need to be packaged for support and protection. The main functions of the package include: providing electrical connections between the chip and external systems, including power and signals; providing a stable and reliable working environment for the chip, which has a mechanical and environmental protection effect on the integrated circuit chip; and providing a thermal path to ensure the normal heat dissipation of the chip.
Product & engineering
Understand the product.
The semiconductor chip is not an island, it needs to form a more complex system through interconnected input and output (I/O) systems and peripheral systems or circuits. Since the IC chip and its internal circuits are very fragile, they need to be packaged for support and protection. The main functions of the package include: providing electrical connections between the chip and external systems, including power and signals; providing a stable and reliable working environment for the chip, which has a mechanical and environmental protection effect on the integrated circuit chip; and providing a thermal path to ensure the normal heat dissipation of the chip.
In order to increase circuit density and continue or surpass "Moore's Law", advanced packaging technology has become inevitable.
Selected research
Industry Research
IC Advanced Packaging Equipment Industry Research Report 2026
Market perspective
The semiconductor chip is not an island, it needs to form a more complex system through interconnected input and output (I/O) systems and peripheral systems or circuits. Since the IC chip and its internal circuits are very fragile, they need to be packaged for support and protection. The main functions of the package include: providing electrical connections between the chip and external systems, including power and signals; providing a stable and reliable working environment for the chip, which has a mechanical and environmental protection effect on the integrated circuit chip; and providing a thermal path to ensure the normal heat dissipation of the chip.
In order to increase circuit density and continue or surpass "Moore's Law", advanced packaging technology has become inevitable.
Global IC Advanced Packaging Equipment key players include ASM Pacific, Applied Material, Advantest, Kulicke&Soffa, DISCO, etc. Global top five manufacturers hold a share about 45%.
Read the full market overview
China is the largest market, with a share about 30%, followed by United States, and Southeast Asia, both have a share over 30 percent.
In terms of product, Cutting Equipment is the largest segment, with a share over 25%. And in terms of application, the largest application is Consumer Electronics, followed by Automotive Electronics, etc.
Report Scope
This report quantifies the global IC Advanced Packaging Equipment market in revenue (US$ million) and, where applicable, sales volume (Units), using 2025 as the base year and providing annual historical and forecast data for 2021–2032.
It standardizes definitions of types and applications, harmonizes vendor attribution, and presents comparable time series by company, type, application, and region/country, including indicative price bands (US$/Units) and concentration ratios (CR5/CR10).
The outputs are intended to support strategy development, budgeting, and performance benchmarking for manufacturers, new entrants, channel partners, and investors; the report also reviews technology shifts and notable product introductions relevant to IC Advanced Packaging Equipment.
Key Companies & Market Share Insights
This section profiles leading manufacturers, combining 2021–2025 results with a 2026–2032 outlook. It reports revenue, market share, price bands, product and application mix, regional and channel mix, and key developments (M&A, capacity additions, certifications). It also provides global revenue, average price, and—where applicable—sales volume by manufacturer, and calculates CR5/CR10 and rank changes to support comparative benchmarking.
IC Advanced Packaging Equipment Market by Company
ASM Pacific
Applied Material
Advantest
Kulicke&Soffa
DISCO
Tokyo Seimitsu
BESI
Hitachi
Teradyne
Hanmi
Toray Engineering
Shinkawa
COHU Semiconductor
TOWA
SUSS Microtec
IC Advanced Packaging Equipment Segment by Type
Cutting Equipment
Solid Crystal Devices
Welding Equipment
Testing Equipment
Other
IC Advanced Packaging Equipment Segment by Application
Automotive Electronics
Consumer Electronics
Other
IC Advanced Packaging Equipment Segment by Region
North America
United States
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Spain
Netherlands
Switzerland
Sweden
Poland
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Southeast Asia
South America
Brazil
Argentina
Chile
Colombia
Middle East & Africa
Egypt
South Africa
Israel
Türkiye
GCC Countries
Key Drivers & Barriers
High-impact rendering factors and drivers have been studied in this report to aid the readers to understand the general development. Moreover, the report includes restraints and challenges that may act as stumbling blocks on the way of the players. This will assist the users to be attentive and make informed decisions related to business. Specialists have also laid their focus on the upcoming business prospects.
Reasons to Buy This Report
1. This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global IC Advanced Packaging Equipment market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.
2. This report will help stakeholders to understand the global industry status and trends of IC Advanced Packaging Equipment and provides them with information on key market drivers, restraints, challenges, and opportunities.
3. This report will help stakeholders to understand competitors better and gain more insights to strengthen their position in their businesses. The competitive landscape section includes the market share and rank (in volume and value), competitor ecosystem, new product development, expansion, and acquisition.
4. This report stays updated with novel technology integration, features, and the latest developments in the market
5. This report helps stakeholders to gain insights into which regions to target globally
6. This report helps stakeholders to gain insights into the end-user perception concerning the adoption of IC Advanced Packaging Equipment.
7. This report helps stakeholders to identify some of the key players in the market and understand their valuable contribution.
Chapter Outline
Chapter 1: Research objectives, research methods, data sources, data cross-validation;
Chapter 2: Introduces the report scope of the report, executive summary of different market segments (by region, product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 3: Detailed analysis of IC Advanced Packaging Equipment manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 5: Production/output, value of IC Advanced Packaging Equipment by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 6: Consumption of IC Advanced Packaging Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 7: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 8: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 9: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 10: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 11: The main points and conclusions of the report.
More report detail
Tables and figures
Scope & coverage.
Types
- Cutting Equipment
- Solid Crystal Devices
- Welding Equipment
- Testing Equipment
- Other
Applications
- Automotive Electronics
- Consumer Electronics
- Other
Companies covered
- ASM Pacific
- Applied Material
- Advantest
- Kulicke&Soffa
- DISCO
- Tokyo Seimitsu
- BESI
- Hitachi
- Teradyne
- Hanmi
- Toray Engineering
- Shinkawa
- COHU Semiconductor
- TOWA
- SUSS Microtec
Inside the report.
1 Preface
- 1.1 Scope of Report
- 1.2 Reasons for Doing This Study
- 1.3 Research Methodology
- 1.4 Research Process
- 1.5 Data Source
- 1.5.1 Secondary Sources
- 1.5.2 Primary Sources
2 Market Overview
- 2.1 Product Definition
- 2.2 IC Advanced Packaging Equipment by Type
- 2.2.1 Market Value Comparison by Type (2021 VS 2025 VS 2032) & (US$ Million)
- 2.2.2 Cutting Equipment
- 2.2.3 Solid Crystal Devices
- 2.2.4 Welding Equipment
- 2.2.5 Testing Equipment
- 2.2.6 Other
- 2.3 IC Advanced Packaging Equipment by Application
- 2.3.1 Market Value Comparison by Application (2021 VS 2025 VS 2032) & (US$ Million)
- 2.3.2 Automotive Electronics
- 2.3.3 Consumer Electronics
- 2.3.4 Other
- 2.4 Global Market Growth Prospects
- 2.4.1 Global IC Advanced Packaging Equipment Production Value Estimates and Forecasts (2021-2032)
- 2.4.2 Global IC Advanced Packaging Equipment Production Capacity Estimates and Forecasts (2021-2032)
- 2.4.3 Global IC Advanced Packaging Equipment Production Estimates and Forecasts (2021-2032)
- 2.4.4 Global IC Advanced Packaging Equipment Market Average Price (2021-2032)
3 Market Competitive Landscape by Manufacturers
- 3.1 Global IC Advanced Packaging Equipment Production by Manufacturers (2021-2026)
- 3.2 Global IC Advanced Packaging Equipment Production Value by Manufacturers (2021-2026)
- 3.3 Global IC Advanced Packaging Equipment Average Price by Manufacturers (2021-2026)
- 3.4 Global IC Advanced Packaging Equipment Industry Manufacturers Ranking, 2024 VS 2025 VS 2026
- 3.5 Global IC Advanced Packaging Equipment Key Manufacturers, Manufacturing Sites & Headquarters
- 3.6 Global IC Advanced Packaging Equipment Manufacturers, Product Type & Application
- 3.7 Global IC Advanced Packaging Equipment Manufacturers Established Date
- 3.8 Global IC Advanced Packaging Equipment Market CR5 and HHI
- 3.9 Global Manufacturers Mergers & Acquisition
4 Manufacturers Profiled
- 4.1 ASM Pacific
- 4.1.1 ASM Pacific IC Advanced Packaging Equipment Company Information
- 4.1.2 ASM Pacific IC Advanced Packaging Equipment Business Overview
- 4.1.3 ASM Pacific IC Advanced Packaging Equipment Production, Value and Gross Margin (2021-2026)
- 4.1.4 ASM Pacific Product Portfolio
- 4.1.5 ASM Pacific Recent Developments
- 4.2 Applied Material
- 4.2.1 Applied Material IC Advanced Packaging Equipment Company Information
- 4.2.2 Applied Material IC Advanced Packaging Equipment Business Overview
- 4.2.3 Applied Material IC Advanced Packaging Equipment Production, Value and Gross Margin (2021-2026)
- 4.2.4 Applied Material Product Portfolio
- 4.2.5 Applied Material Recent Developments
- 4.3 Advantest
- 4.3.1 Advantest IC Advanced Packaging Equipment Company Information
- 4.3.2 Advantest IC Advanced Packaging Equipment Business Overview
- 4.3.3 Advantest IC Advanced Packaging Equipment Production, Value and Gross Margin (2021-2026)
- 4.3.4 Advantest Product Portfolio
- 4.3.5 Advantest Recent Developments
- 4.4 Kulicke&Soffa
- 4.4.1 Kulicke&Soffa IC Advanced Packaging Equipment Company Information
- 4.4.2 Kulicke&Soffa IC Advanced Packaging Equipment Business Overview
- 4.4.3 Kulicke&Soffa IC Advanced Packaging Equipment Production, Value and Gross Margin (2021-2026)
- 4.4.4 Kulicke&Soffa Product Portfolio
- 4.4.5 Kulicke&Soffa Recent Developments
- 4.5 DISCO
- 4.5.1 DISCO IC Advanced Packaging Equipment Company Information
- 4.5.2 DISCO IC Advanced Packaging Equipment Business Overview
- 4.5.3 DISCO IC Advanced Packaging Equipment Production, Value and Gross Margin (2021-2026)
- 4.5.4 DISCO Product Portfolio
- 4.5.5 DISCO Recent Developments
- 4.6 Tokyo Seimitsu
- 4.6.1 Tokyo Seimitsu IC Advanced Packaging Equipment Company Information
- 4.6.2 Tokyo Seimitsu IC Advanced Packaging Equipment Business Overview
- 4.6.3 Tokyo Seimitsu IC Advanced Packaging Equipment Production, Value and Gross Margin (2021-2026)
- 4.6.4 Tokyo Seimitsu Product Portfolio
- 4.6.5 Tokyo Seimitsu Recent Developments
- 4.7 BESI
- 4.7.1 BESI IC Advanced Packaging Equipment Company Information
- 4.7.2 BESI IC Advanced Packaging Equipment Business Overview
- 4.7.3 BESI IC Advanced Packaging Equipment Production, Value and Gross Margin (2021-2026)
- 4.7.4 BESI Product Portfolio
- 4.7.5 BESI Recent Developments
- 4.8 Hitachi
- 4.8.1 Hitachi IC Advanced Packaging Equipment Company Information
- 4.8.2 Hitachi IC Advanced Packaging Equipment Business Overview
- 4.8.3 Hitachi IC Advanced Packaging Equipment Production, Value and Gross Margin (2021-2026)
- 4.8.4 Hitachi Product Portfolio
- 4.8.5 Hitachi Recent Developments
- 4.9 Teradyne
- 4.9.1 Teradyne IC Advanced Packaging Equipment Company Information
- 4.9.2 Teradyne IC Advanced Packaging Equipment Business Overview
- 4.9.3 Teradyne IC Advanced Packaging Equipment Production, Value and Gross Margin (2021-2026)
- 4.9.4 Teradyne Product Portfolio
- 4.9.5 Teradyne Recent Developments
- 4.10 Hanmi
- 4.10.1 Hanmi IC Advanced Packaging Equipment Company Information
- 4.10.2 Hanmi IC Advanced Packaging Equipment Business Overview
- 4.10.3 Hanmi IC Advanced Packaging Equipment Production, Value and Gross Margin (2021-2026)
- 4.10.4 Hanmi Product Portfolio
- 4.10.5 Hanmi Recent Developments
- 4.11 Toray Engineering
- 4.11.1 Toray Engineering IC Advanced Packaging Equipment Company Information
- 4.11.2 Toray Engineering IC Advanced Packaging Equipment Business Overview
- 4.11.3 Toray Engineering IC Advanced Packaging Equipment Production, Value and Gross Margin (2021-2026)
- 4.11.4 Toray Engineering Product Portfolio
- 4.11.5 Toray Engineering Recent Developments
- 4.12 Shinkawa
- 4.12.1 Shinkawa IC Advanced Packaging Equipment Company Information
- 4.12.2 Shinkawa IC Advanced Packaging Equipment Business Overview
- 4.12.3 Shinkawa IC Advanced Packaging Equipment Production, Value and Gross Margin (2021-2026)
- 4.12.4 Shinkawa Product Portfolio
- 4.12.5 Shinkawa Recent Developments
- 4.13 COHU Semiconductor
- 4.13.1 COHU Semiconductor IC Advanced Packaging Equipment Company Information
- 4.13.2 COHU Semiconductor IC Advanced Packaging Equipment Business Overview
- 4.13.3 COHU Semiconductor IC Advanced Packaging Equipment Production, Value and Gross Margin (2021-2026)
- 4.13.4 COHU Semiconductor Product Portfolio
- 4.13.5 COHU Semiconductor Recent Developments
- 4.14 TOWA
- 4.14.1 TOWA IC Advanced Packaging Equipment Company Information
- 4.14.2 TOWA IC Advanced Packaging Equipment Business Overview
- 4.14.3 TOWA IC Advanced Packaging Equipment Production, Value and Gross Margin (2021-2026)
- 4.14.4 TOWA Product Portfolio
- 4.14.5 TOWA Recent Developments
- 4.15 SUSS Microtec
- 4.15.1 SUSS Microtec IC Advanced Packaging Equipment Company Information
- 4.15.2 SUSS Microtec IC Advanced Packaging Equipment Business Overview
- 4.15.3 SUSS Microtec IC Advanced Packaging Equipment Production, Value and Gross Margin (2021-2026)
- 4.15.4 SUSS Microtec Product Portfolio
- 4.15.5 SUSS Microtec Recent Developments
5 Global IC Advanced Packaging Equipment Production by Region
- 5.1 Global IC Advanced Packaging Equipment Production Estimates and Forecasts by Region: 2021 VS 2025 VS 2032
- 5.2 Global IC Advanced Packaging Equipment Production by Region: 2021-2032
- 5.2.1 Global IC Advanced Packaging Equipment Production by Region: 2021-2026
- 5.2.2 Global IC Advanced Packaging Equipment Production Forecast by Region (2027-2032)
- 5.3 Global IC Advanced Packaging Equipment Production Value Estimates and Forecasts by Region: 2021 VS 2025 VS 2032
- 5.4 Global IC Advanced Packaging Equipment Production Value by Region: 2021-2032
- 5.4.1 Global IC Advanced Packaging Equipment Production Value by Region: 2021-2026
- 5.4.2 Global IC Advanced Packaging Equipment Production Value Forecast by Region (2027-2032)
- 5.5 Global IC Advanced Packaging Equipment Market Price Analysis by Region (2021-2026)
- 5.6 Global IC Advanced Packaging Equipment Production and Value, YOY Growth
- 5.6.1 North America IC Advanced Packaging Equipment Production Value Estimates and Forecasts (2021-2032)
- 5.6.2 Europe IC Advanced Packaging Equipment Production Value Estimates and Forecasts (2021-2032)
- 5.6.3 China IC Advanced Packaging Equipment Production Value Estimates and Forecasts (2021-2032)
- 5.6.4 Japan IC Advanced Packaging Equipment Production Value Estimates and Forecasts (2021-2032)
6 Global IC Advanced Packaging Equipment Consumption by Region
- 6.1 Global IC Advanced Packaging Equipment Consumption Estimates and Forecasts by Region: 2021 VS 2025 VS 2032
- 6.2 Global IC Advanced Packaging Equipment Consumption by Region (2021-2032)
- 6.2.1 Global IC Advanced Packaging Equipment Consumption by Region: 2021-2026
- 6.2.2 Global IC Advanced Packaging Equipment Forecasted Consumption by Region (2027-2032)
- 6.3 North America
- 6.3.1 North America IC Advanced Packaging Equipment Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 6.3.2 North America IC Advanced Packaging Equipment Consumption by Country (2021-2032)
- 6.3.3 United States
- 6.3.4 Canada
- 6.3.5 Mexico
- 6.4 Europe
- 6.4.1 Europe IC Advanced Packaging Equipment Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 6.4.2 Europe IC Advanced Packaging Equipment Consumption by Country (2021-2032)
- 6.4.3 Germany
- 6.4.4 France
- 6.4.5 U.K.
- 6.4.6 Italy
- 6.4.7 Russia
- 6.4.8 Spain
- 6.4.9 Netherlands
- 6.4.10 Switzerland
- 6.4.11 Sweden
- 6.4.12 Poland
- 6.5 Asia Pacific
- 6.5.1 Asia Pacific IC Advanced Packaging Equipment Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 6.5.2 Asia Pacific IC Advanced Packaging Equipment Consumption by Country (2021-2032)
- 6.5.3 China
- 6.5.4 Japan
- 6.5.5 South Korea
- 6.5.6 India
- 6.5.7 Australia
- 6.5.8 Taiwan
- 6.5.9 Southeast Asia
- 6.6 South America, Middle East & Africa
- 6.6.1 South America, Middle East & Africa IC Advanced Packaging Equipment Consumption Growth Rate by Country: 2021 VS 2025 VS 2032
- 6.6.2 South America, Middle East & Africa IC Advanced Packaging Equipment Consumption by Country (2021-2032)
- 6.6.3 Brazil
- 6.6.4 Argentina
- 6.6.5 Chile
- 6.6.6 Turkey
- 6.6.7 GCC Countries
7 Segment by Type
- 7.1 Global IC Advanced Packaging Equipment Production by Type (2021-2032)
- 7.1.1 Global IC Advanced Packaging Equipment Production by Type (2021-2032) & (Units)
- 7.1.2 Global IC Advanced Packaging Equipment Production Market Share by Type (2021-2032)
- 7.2 Global IC Advanced Packaging Equipment Production Value by Type (2021-2032)
- 7.2.1 Global IC Advanced Packaging Equipment Production Value by Type (2021-2032) & (US$ Million)
- 7.2.2 Global IC Advanced Packaging Equipment Production Value Market Share by Type (2021-2032)
- 7.3 Global IC Advanced Packaging Equipment Price by Type (2021-2032)
8 Segment by Application
- 8.1 Global IC Advanced Packaging Equipment Production by Application (2021-2032)
- 8.1.1 Global IC Advanced Packaging Equipment Production by Application (2021-2032) & (Units)
- 8.1.2 Global IC Advanced Packaging Equipment Production Market Share by Application (2021-2032)
- 8.2 Global IC Advanced Packaging Equipment Production Value by Application (2021-2032)
- 8.2.1 Global IC Advanced Packaging Equipment Production Value by Application (2021-2032) & (US$ Million)
- 8.2.2 Global IC Advanced Packaging Equipment Production Value Market Share by Application (2021-2032)
- 8.3 Global IC Advanced Packaging Equipment Price by Application (2021-2032)
9 Value Chain and Sales Channels Analysis of the Market
- 9.1 IC Advanced Packaging Equipment Value Chain Analysis
- 9.1.1 IC Advanced Packaging Equipment Key Raw Materials
- 9.1.2 Raw Materials Key Suppliers
- 9.1.3 IC Advanced Packaging Equipment Production Mode & Process
- 9.2 IC Advanced Packaging Equipment Sales Channels Analysis
- 9.2.1 Direct Comparison with Distribution Share
- 9.2.2 IC Advanced Packaging Equipment Distributors
- 9.2.3 IC Advanced Packaging Equipment Customers
10 Global IC Advanced Packaging Equipment Analyzing Market Dynamics
- 10.1 IC Advanced Packaging Equipment Industry Trends
- 10.2 IC Advanced Packaging Equipment Industry Drivers
- 10.3 IC Advanced Packaging Equipment Industry Opportunities and Challenges
- 10.4 IC Advanced Packaging Equipment Industry Restraints
11 Report Conclusion
12 Disclaimer
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