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Sputtering is a technology used to form a thin film on a silicon wafer, glass, or other substrate. Within a vacuum state maintained in a sputtering machine, a sputtering target is bombarded with argon ions. This causes atoms or molecules to be emitted from the sputtering target. The atoms or molecules are deposited and form a thin film on the substrate. A sputtering target is the object of the ion bombardment when sputtering takes place.
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